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Class Information
Number: 257/666
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame
Description: Subject matter wherein the active solid-state device is provided with a conductive metal network which may have relatively large area portions, commonly called pads or flags, for direct contact with semiconductor chips or dice, and lead elements for facilitating electrical interconnection of the chips or dies via intermediate (e.g., jumper) connections to other electronic devices or components.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure |
Dec. 2, 2008 |
| 7459381 |
Integrated circuits and interconnect structure for integrated circuits |
Dec. 2, 2008 |
| 7459345 |
Packaging method for an electronic element |
Dec. 2, 2008 |
| 7453138 |
Electronic circuit device and manufacturing method thereof |
Nov. 18, 2008 |
| 7449412 |
Interconnect circuitry, multichip module, and methods of manufacturing thereof |
Nov. 11, 2008 |
| 7446400 |
Chip package structure and fabricating method thereof |
Nov. 4, 2008 |
| 7446396 |
Stacked integrated circuit leadframe package system |
Nov. 4, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7443011 |
System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices |
Oct. 28, 2008 |
| 7439610 |
High power shunt switch with high isolation and ease of assembly |
Oct. 21, 2008 |
| 7436049 |
Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package |
Oct. 14, 2008 |
| 7436048 |
Multichip leadframe package |
Oct. 14, 2008 |
| 7436002 |
Surface-mountable radiation-emitting component |
Oct. 14, 2008 |
| 7432588 |
Semiconductor device and method of fabricating the same |
Oct. 7, 2008 |
| 7432584 |
Leadframe for use in a semiconductor package |
Oct. 7, 2008 |
| 7432583 |
Leadless leadframe package substitute and stack package |
Oct. 7, 2008 |
| 7429784 |
Package structure |
Sep. 30, 2008 |
| 7425755 |
Semiconductor package, method for manufacturing the same and lead frame for use in the same |
Sep. 16, 2008 |
| 7420265 |
Integrated circuit package system with integrated circuit support |
Sep. 2, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7414303 |
Lead on chip semiconductor package |
Aug. 19, 2008 |
| 7414302 |
Flashless lead frame with horizontal singulation |
Aug. 19, 2008 |
| 7414300 |
Molded semiconductor package |
Aug. 19, 2008 |
| 7413934 |
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
Aug. 19, 2008 |
| 7411278 |
Package device with electromagnetic interference shield |
Aug. 12, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7408248 |
Lead frame for semiconductor device |
Aug. 5, 2008 |
| 7408245 |
IC package encapsulating a chip under asymmetric single-side leads |
Aug. 5, 2008 |
| 7408244 |
Semiconductor package and stack arrangement thereof |
Aug. 5, 2008 |
| 7408243 |
High temperature package flip-chip bonding to ceramic |
Aug. 5, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7408205 |
Digital camera module |
Aug. 5, 2008 |
| 7405487 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device |
Jul. 29, 2008 |
| 7405483 |
Electronic assembly and circuit board |
Jul. 29, 2008 |
| 7402898 |
Semiconductor package, method for fabricating the same, and semiconductor device |
Jul. 22, 2008 |
| 7402896 |
Integrated circuit (IC) carrier assembly incorporating serpentine suspension |
Jul. 22, 2008 |
| 7402462 |
Folded frame carrier for MOSFET BGA |
Jul. 22, 2008 |
| 7399658 |
Pre-molded leadframe and method therefor |
Jul. 15, 2008 |
| 7397137 |
Direct FET device for high frequency application |
Jul. 8, 2008 |
| 7397114 |
Semiconductor integrated circuit device and method of manufacturing the same |
Jul. 8, 2008 |
| 7397113 |
Semiconductor device |
Jul. 8, 2008 |
| 7397112 |
Semiconductor package and lead frame therefor |
Jul. 8, 2008 |
| 7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area |
Jun. 24, 2008 |
| 7388283 |
Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe |
Jun. 17, 2008 |
| 7388280 |
Package stacking lead frame system |
Jun. 17, 2008 |
| 7385279 |
Semiconductor device and a method of manufacturing the same |
Jun. 10, 2008 |
| 7385278 |
Strobe light control circuit and IGBT device |
Jun. 10, 2008 |
| 7378743 |
Circuit board and electronic assembly |
May. 27, 2008 |
| 7378723 |
Method and apparatus for decoupling conductive portions of a microelectronic device package |
May. 27, 2008 |
| 7378722 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device |
May. 27, 2008 |
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