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Class Information
Number: 257/666
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame
Description: Subject matter wherein the active solid-state device is provided with a conductive metal network which may have relatively large area portions, commonly called pads or flags, for direct contact with semiconductor chips or dice, and lead elements for facilitating electrical interconnection of the chips or dies via intermediate (e.g., jumper) connections to other electronic devices or components.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619314 |
Integrated circuit package system including die stacking |
Nov. 17, 2009 |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Nov. 17, 2009 |
| 7619303 |
Integrated circuit package |
Nov. 17, 2009 |
| 7619302 |
Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules |
Nov. 17, 2009 |
| 7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar |
Nov. 10, 2009 |
| 7615852 |
Semiconductor component in a housing with mechanically inforcing flat conductor webs |
Nov. 10, 2009 |
| 7615851 |
Integrated circuit package system |
Nov. 10, 2009 |
| 7612439 |
Semiconductor package having improved thermal performance |
Nov. 3, 2009 |
| 7612435 |
Method of packaging integrated circuits |
Nov. 3, 2009 |
| 7612434 |
Electronic device having wiring substrate and lead frame |
Nov. 3, 2009 |
| 7608914 |
Integrated circuit package with electrically isolated leads |
Oct. 27, 2009 |
| 7608482 |
Integrated circuit package with molded insulation |
Oct. 27, 2009 |
| 7605451 |
RF power transistor having an encapsulated chip package |
Oct. 20, 2009 |
| 7602051 |
Thermally conductive resin sheet and power module using the same |
Oct. 13, 2009 |
| 7602050 |
Integrated circuit packaging |
Oct. 13, 2009 |
| 7598608 |
Mounting substrate |
Oct. 6, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
Oct. 6, 2009 |
| 7598601 |
Current sensor |
Oct. 6, 2009 |
| 7598600 |
Stackable power semiconductor package system |
Oct. 6, 2009 |
| 7598599 |
Semiconductor package system with substrate having different bondable heights at lead finger tips |
Oct. 6, 2009 |
| 7598598 |
Offset etched corner leads for semiconductor package |
Oct. 6, 2009 |
| 7595551 |
Semiconductor package for a large die |
Sep. 29, 2009 |
| 7595548 |
Physical quantity sensor and manufacturing method therefor |
Sep. 29, 2009 |
| 7595226 |
Method of packaging an integrated circuit die |
Sep. 29, 2009 |
| 7592694 |
Chip package and method of manufacturing the same |
Sep. 22, 2009 |
| 7589404 |
Semiconductor device |
Sep. 15, 2009 |
| 7589399 |
Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device |
Sep. 15, 2009 |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7586178 |
Alternative flip chip in leaded molded package design and method for manufacture |
Sep. 8, 2009 |
| 7582963 |
Vertically integrated system-in-a-package |
Sep. 1, 2009 |
| 7582958 |
Semiconductor package |
Sep. 1, 2009 |
| 7582957 |
Integrated circuit package system with encapsulation lock |
Sep. 1, 2009 |
| 7582956 |
Flip chip in leaded molded package and method of manufacture thereof |
Sep. 1, 2009 |
| 7582954 |
Optical leadless leadframe package |
Sep. 1, 2009 |
| 7582953 |
Package structure with leadframe on offset chip-stacked structure |
Sep. 1, 2009 |
| 7579697 |
Arrangement for high frequency application |
Aug. 25, 2009 |
| 7579682 |
Power semiconductor module |
Aug. 25, 2009 |
| 7579676 |
Leadless leadframe implemented in a leadframe-based BGA package |
Aug. 25, 2009 |
| 7579674 |
Semiconductor package configuration with improved lead portion arrangement |
Aug. 25, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7576416 |
Chip package having with asymmetric molding and turbulent plate downset design |
Aug. 18, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7564123 |
Semiconductor package with fastened leads |
Jul. 21, 2009 |
| 7564122 |
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant |
Jul. 21, 2009 |
| 7560804 |
Integrated circuit package and method of making the same |
Jul. 14, 2009 |
| 7560743 |
Electro-optical device, method of manufacturing the same, and image forming apparatus |
Jul. 14, 2009 |
| 7557451 |
Electro-optical device and electronic apparatus |
Jul. 7, 2009 |
| 7557432 |
Thermally enhanced power semiconductor package system |
Jul. 7, 2009 |
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