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Class Information
Number: 257/666
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Lead frame
Description: Subject matter wherein the active solid-state device is provided with a conductive metal network which may have relatively large area portions, commonly called pads or flags, for direct contact with semiconductor chips or dice, and lead elements for facilitating electrical interconnection of the chips or dies via intermediate (e.g., jumper) connections to other electronic devices or components.










Sub-classes under this class:

Class Number Class Name Patents
257/677 Of specified material other than copper (e.g., kovar (t.m.)) 249
257/668 On insulating carrier other than a printed circuit board 1,170
257/672 Small lead frame (e.g., "spider" frame) for connecting a large lead frame to a semiconductor chip 463
257/673 With bumps on ends of lead fingers to connect to semiconductor 548
257/667 With dam or vent for encapsulant 462
257/675 With heat sink means 890
257/674 With means for controlling lead tension 339
257/670 With separate tie bar element or plural tie bars 539
257/669 With stress relief 570
257/676 With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for led) 2,440


Patents under this class:

Patent Number Title Of Patent Date Issued
8710637 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8710636 Lead frame array package with flip chip die attach Apr. 29, 2014
8710540 LED package with top and bottom electrodes Apr. 29, 2014
8704345 Semiconductor package and lead frame thereof Apr. 22, 2014
8704344 Ultra-small chip package and method for manufacturing the same Apr. 22, 2014
8704343 Borderless interconnect line structure self-aligned to upper and lower level contact vias Apr. 22, 2014
8704342 Resin sealing type semiconductor device and method of manufacturing the same, and lead frame Apr. 22, 2014
8692360 Electrical connectivity for circuit applications Apr. 8, 2014
8691631 Device including two mounting surfaces Apr. 8, 2014
8687668 Multi-wavelength semiconductor laser device Apr. 1, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686546 Combined packaged power semiconductor device Apr. 1, 2014
8686545 Semiconductor device and method for manufacturing the same Apr. 1, 2014
8680661 Direct contact package for power transistors Mar. 25, 2014
8680657 Lead frame, semiconductor apparatus using this lead frame, intermediate product thereof and manufacturing method thereof Mar. 25, 2014
8680656 Leadframe structure for concentrated photovoltaic receiver package Mar. 25, 2014
8680627 Stacked half-bridge package with a common conductive clip Mar. 25, 2014
8679896 DC/DC converter power module package incorporating a stacked controller and construction methodology Mar. 25, 2014
8674490 Semiconductor die package including IC driver and bridge Mar. 18, 2014
8674487 Semiconductor packages with lead extensions and related methods Mar. 18, 2014
8674485 Semiconductor device including leadframe with downsets Mar. 18, 2014
8669650 Flip chip semiconductor device Mar. 11, 2014
8669647 Method for semiconductor leadframes in low volume and rapid turnaround Mar. 11, 2014
8664776 Interconnection tape providing a serial electrode pad connection in a semiconductor device Mar. 4, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664046 Manufacturing method thereof and a semiconductor device Mar. 4, 2014
8664045 LED lamp strip and manufacturing process thereof Mar. 4, 2014
8659131 Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut Feb. 25, 2014
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8659128 Flip chip package structure with heat dissipation enhancement and its application Feb. 25, 2014
8659113 Embedded semiconductor die package and method of making the same using metal frame carrier Feb. 25, 2014
8659106 Light emitting device and method of manufacturing the light emitting device Feb. 25, 2014
8653636 Contactless communication medium Feb. 18, 2014
8653635 Power overlay structure with leadframe connections Feb. 18, 2014
8648456 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Feb. 11, 2014
8648449 Electrical connectivity for circuit applications Feb. 11, 2014
8643158 Semiconductor package and lead frame therefor Feb. 4, 2014
8643157 Integrated circuit package system having perimeter paddle Feb. 4, 2014
8643156 Lead frame for assembling semiconductor device Feb. 4, 2014
8643153 Semiconductor device with staggered leads Feb. 4, 2014
8642395 Method of making chip-on-lead package Feb. 4, 2014
8637997 Semiconductor device and method of manufacturing the same Jan. 28, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8633511 Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material Jan. 21, 2014
8633062 Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof Jan. 21, 2014
RE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size Jan. 14, 2014
8629549 Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body Jan. 14, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8629467 Semiconductor device Jan. 14, 2014
8624380 Vertical mount package for MEMS sensors Jan. 7, 2014











 
 
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