| |
 |
|
Class Information
Number: 257/665
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Contacts or leads including fusible link means or noise suppression means
Description: Subject matter wherein an active solid-state device is provided with electrical contacts or leads (pronounced "leeds") which contain portions which have a composition or are made so that they will melt at a relatively low temperature to form an open circuit and thereby protect the device in case excessive current, e.g., a current spike from lightning, or voltage is provided to the contact or lead, or contains means designed to suppress unwanted electrical disturbances in the electrical contacts or leads.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5303199 |
Redundant memory device having a memory cell and electrically breakable circuit having the same dielectric film |
Apr. 12, 1994 |
| 5299151 |
Method for writing into semiconductor memory |
Mar. 29, 1994 |
| 5264725 |
Low-current polysilicon fuse |
Nov. 23, 1993 |
| 5260597 |
Routing structure for a customizable integrated circuit |
Nov. 9, 1993 |
| 5256899 |
Integrated circuit fuse link having an exothermic charge adjacent the fuse portion |
Oct. 26, 1993 |
| 5200364 |
Packaged integrated circuit with encapsulated electronic devices |
Apr. 6, 1993 |
| 5144412 |
Process for manufacturing plastic pin grid arrays and the product produced thereby |
Sep. 1, 1992 |
| 5070392 |
Integrated circuit having laser-alterable metallization layer |
Dec. 3, 1991 |
| 5068706 |
Semiconductor device with fuse function |
Nov. 26, 1991 |
| 5053383 |
Method of reducing critical current density of oxide superconductors by radiation damage |
Oct. 1, 1991 |
| 5043792 |
Integrated circuit having wiring strips for propagating in-phase signals |
Aug. 27, 1991 |
| 5040049 |
Semiconductor device and method of manufacturing a semiconductor device |
Aug. 13, 1991 |
| 5027174 |
Semiconductor integrated circuit device with improved resistance against electrostatic noise |
Jun. 25, 1991 |
| 5017510 |
Method of making a scalable fuse link element |
May. 21, 1991 |
| 5011791 |
Fusible link with built-in redundancy |
Apr. 30, 1991 |
| 5006918 |
Floating orthogonal line structure for X-Y wiring planes |
Apr. 9, 1991 |
| 5003371 |
Fuse-melting device |
Mar. 26, 1991 |
| 4993954 |
Device for interconnection between and integrated circuit and an electrical circuit |
Feb. 19, 1991 |
| 4994902 |
Semiconductor devices and electronic system incorporating them |
Feb. 19, 1991 |
| 4970686 |
Semiconductor memory cells and semiconductor memory device employing the semiconductor memory cells |
Nov. 13, 1990 |
| 4945398 |
Overcurrent preventive diode |
Jul. 31, 1990 |
| 4943842 |
Semiconductor device with fuse function |
Jul. 24, 1990 |
| 4942308 |
Power transistor monolithic integrated structure |
Jul. 17, 1990 |
| 4937649 |
Semiconductor integrated circuit having a capacitor for stabilizing a voltage at a power supplying wiring |
Jun. 26, 1990 |
| 4935801 |
Metallic fuse with optically absorptive layer |
Jun. 19, 1990 |
| 4935645 |
Fusing and detection circuit |
Jun. 19, 1990 |
| 4933738 |
Customizable semiconductor devices |
Jun. 12, 1990 |
| 4903113 |
Enhanced tab package |
Feb. 20, 1990 |
| 4887148 |
Pin grid array package structure |
Dec. 12, 1989 |
| 4866503 |
Semiconductor stack |
Sep. 12, 1989 |
| 4831497 |
Reduction of cross talk in interconnecting conductors |
May. 16, 1989 |
| 4801558 |
Electrostatic discharge protection using thin nickel fuse |
Jan. 31, 1989 |
| 4796079 |
Chip component providing rf suppression |
Jan. 3, 1989 |
| 4796080 |
Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate |
Jan. 3, 1989 |
| 4796075 |
Fusible link structure for integrated circuits |
Jan. 3, 1989 |
| 4786780 |
Method for trimming thin-film transistor array |
Nov. 22, 1988 |
| 4774558 |
Thermally-activated, shorting diode switch having non-operationally-alterable junction path |
Sep. 27, 1988 |
| 4758876 |
Thermal protective device with bimetal for semiconductor devices and the like |
Jul. 19, 1988 |
| 4737830 |
Integrated circuit structure having compensating means for self-inductance effects |
Apr. 12, 1988 |
| 4714952 |
Capacitor built-in integrated circuit packaged unit and process of fabrication thereof |
Dec. 22, 1987 |
| 4703436 |
Wafer level integration technique |
Oct. 27, 1987 |
| 4684973 |
Semiconductor integrated circuit device having ground connections arranged to eliminate mutual interference between island-disposed electronic circuits |
Aug. 4, 1987 |
| 4679088 |
Image sensor with means to adjust capacitance of signal leads |
Jul. 7, 1987 |
| 4675719 |
Thyristor device |
Jun. 23, 1987 |
| 4670770 |
Integrated circuit chip-and-substrate assembly |
Jun. 2, 1987 |
| 4654694 |
Electronic component box supplied with a capacitor |
Mar. 31, 1987 |
| 4617586 |
High-frequency circuit comprising an integrated capacitor |
Oct. 14, 1986 |
| 4613771 |
Integrated circuit having three power bases and proportioned parasitic resistive and capacitive coupling to reduce output noise |
Sep. 23, 1986 |
| 4609834 |
Integrated logic circuit incorporating a module which generates a control signal that cancels switching noise |
Sep. 2, 1986 |
| 4599636 |
Two terminal axial lead suppressor and diode bridge device |
Jul. 8, 1986 |
|
|
|
