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Class Information
Number: 257/665
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Contacts or leads including fusible link means or noise suppression means
Description: Subject matter wherein an active solid-state device is provided with electrical contacts or leads (pronounced "leeds") which contain portions which have a composition or are made so that they will melt at a relatively low temperature to form an open circuit and thereby protect the device in case excessive current, e.g., a current spike from lightning, or voltage is provided to the contact or lead, or contains means designed to suppress unwanted electrical disturbances in the electrical contacts or leads.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6858469 |
Method and apparatus for epoxy loc die attachment |
Feb. 22, 2005 |
| 6853054 |
High frequency semiconductor device |
Feb. 8, 2005 |
| 6853073 |
Microwave electronic devices comprising a metal enclosure |
Feb. 8, 2005 |
| 6849929 |
IC chip and semiconductor device |
Feb. 1, 2005 |
| 6838770 |
Semiconductor device, designing method and designing device thereof |
Jan. 4, 2005 |
| 6828658 |
Package for integrated circuit with internal matching |
Dec. 7, 2004 |
| 6822309 |
Apparatus for selectively cutting fuse electrodes |
Nov. 23, 2004 |
| 6818957 |
Semiconductor chip with fuse unit |
Nov. 16, 2004 |
| 6809404 |
Semiconductor device |
Oct. 26, 2004 |
| 6791157 |
Integrated circuit package incorporating programmable elements |
Sep. 14, 2004 |
| 6787878 |
Semiconductor device having a potential fuse, and method of manufacturing the same |
Sep. 7, 2004 |
| 6784516 |
Insulative cap for laser fusing |
Aug. 31, 2004 |
| 6774457 |
Rectangular contact used as a low voltage fuse element |
Aug. 10, 2004 |
| 6774456 |
Configuration of fuses in semiconductor structures with Cu metallization |
Aug. 10, 2004 |
| 6770948 |
Integrated fuse with regions of different doping within the fuse neck |
Aug. 3, 2004 |
| 6753590 |
High impedance antifuse |
Jun. 22, 2004 |
| 6734525 |
Low stress integrated circuit fusible link |
May. 11, 2004 |
| 6720591 |
Semiconductor integrated circuit device |
Apr. 13, 2004 |
| 6713871 |
Surface mount solder method and apparatus for decoupling capacitance and process of making |
Mar. 30, 2004 |
| 6713848 |
Output stage layout for minimum cross coupling between channels |
Mar. 30, 2004 |
| 6707159 |
Semiconductor chip and production process therefor |
Mar. 16, 2004 |
| 6703651 |
Electronic device having stacked modules and method for producing it |
Mar. 9, 2004 |
| 6680857 |
Unit-architecture with implemented limited bank-column-select repairability |
Jan. 20, 2004 |
| 6680519 |
Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry |
Jan. 20, 2004 |
| 6680520 |
Method and structure for forming precision MIM fusible circuit elements using fuses and antifuses |
Jan. 20, 2004 |
| 6674152 |
Bipolar diode |
Jan. 6, 2004 |
| 6670215 |
Semiconductor device and manufacturing method thereof |
Dec. 30, 2003 |
| 6661525 |
Method for monitoring the length of constant-wire-length bonds and apparatus therefor |
Dec. 9, 2003 |
| 6661106 |
Alignment mark structure for laser fusing and method of use |
Dec. 9, 2003 |
| 6633055 |
Electronic fuse structure and method of manufacturing |
Oct. 14, 2003 |
| 6627917 |
Method and apparatus for wafer-level burn-in |
Sep. 30, 2003 |
| 6621155 |
Integrated circuit device having stacked dies and impedance balanced transmission lines |
Sep. 16, 2003 |
| 6617664 |
Semiconductor device having a fuse and a fabrication process thereof |
Sep. 9, 2003 |
| 6613612 |
Fuse in semiconductor device and fabricating method thereof |
Sep. 2, 2003 |
| 6597054 |
Reduced pitch laser redundancy fuse bank structure |
Jul. 22, 2003 |
| 6597055 |
Redundancy structure in self-aligned contacts |
Jul. 22, 2003 |
| 6589810 |
BGA package and method of fabrication |
Jul. 8, 2003 |
| 6586815 |
Semiconductor device having dummy interconnection and method for manufacturing the same |
Jul. 1, 2003 |
| 6580156 |
Integrated fuse with regions of different doping within the fuse neck |
Jun. 17, 2003 |
| 6573585 |
Electrically blowable fuse with reduced cross-sectional area |
Jun. 3, 2003 |
| 6566730 |
Laser-breakable fuse link with alignment and break point promotion structures |
May. 20, 2003 |
| 6566238 |
Metal wire fuse structure with cavity |
May. 20, 2003 |
| 6563188 |
Semiconductor device having multilayer passivation layer formed over memory cell fuse area |
May. 13, 2003 |
| 6531760 |
Semiconductor device |
Mar. 11, 2003 |
| 6531757 |
Semiconductor device fuse box with fuses of uniform depth |
Mar. 11, 2003 |
| 6524941 |
Sub-minimum wiring structure |
Feb. 25, 2003 |
| 6521981 |
Semiconductor device and manufacturing method thereof |
Feb. 18, 2003 |
| 6509634 |
Chip mounting structure having adhesive conductor |
Jan. 21, 2003 |
| 6507076 |
Microwave transistor subjected to burn-in testing |
Jan. 14, 2003 |
| 6496053 |
Corrosion insensitive fusible link using capacitance sensing for semiconductor devices |
Dec. 17, 2002 |
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