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Class Information
Number: 257/665
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Contacts or leads including fusible link means or noise suppression means
Description: Subject matter wherein an active solid-state device is provided with electrical contacts or leads (pronounced "leeds") which contain portions which have a composition or are made so that they will melt at a relatively low temperature to form an open circuit and thereby protect the device in case excessive current, e.g., a current spike from lightning, or voltage is provided to the contact or lead, or contains means designed to suppress unwanted electrical disturbances in the electrical contacts or leads.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7414313 |
Polymeric conductor donor and transfer method |
Aug. 19, 2008 |
| 7413936 |
Method of forming copper layers |
Aug. 19, 2008 |
| 7402442 |
Physically highly secure multi-chip assembly |
Jul. 22, 2008 |
| 7375982 |
Thin film deposition as an active conductor and method therefor |
May. 20, 2008 |
| 7354805 |
Method of making electrically programmable fuse for silicon-on-insulator (SOI) technology |
Apr. 8, 2008 |
| 7352050 |
Fuse region of a semiconductor region |
Apr. 1, 2008 |
| 7332791 |
Electrically programmable polysilicon fuse with multiple level resistance and programming |
Feb. 19, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7309898 |
Method and apparatus for providing noise suppression in an integrated circuit |
Dec. 18, 2007 |
| 7291923 |
Tapered signal lines |
Nov. 6, 2007 |
| 7291902 |
Chip component and method for producing a chip component |
Nov. 6, 2007 |
| 7291506 |
Magnetic memory device and method of manufacturing the same |
Nov. 6, 2007 |
| 7282751 |
Semiconductor device |
Oct. 16, 2007 |
| 7245028 |
Split control pad for multiple signal |
Jul. 17, 2007 |
| 7242072 |
Electrically programmable fuse for silicon-on-insulator (SOI) technology |
Jul. 10, 2007 |
| 7230319 |
Electronic substrate |
Jun. 12, 2007 |
| 7227238 |
Integrated fuse with regions of different doping within the fuse neck |
Jun. 5, 2007 |
| 7215007 |
Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards |
May. 8, 2007 |
| 7211738 |
Bonding pad structure for a display device and fabrication method thereof |
May. 1, 2007 |
| 7211843 |
System and method for programming a memory cell |
May. 1, 2007 |
| 7211887 |
connection arrangement for micro lead frame plastic packages |
May. 1, 2007 |
| 7170148 |
Semi-fusible link system for a multi-layer integrated circuit and method of making same |
Jan. 30, 2007 |
| 7151001 |
Fabrication method of self-aligned ferroelectric gate transistor using buffer layer of high etching selectivity |
Dec. 19, 2006 |
| 7135758 |
Surface mount solder method and apparatus for decoupling capacitance and process of making |
Nov. 14, 2006 |
| 7126204 |
Integrated semiconductor circuit with an electrically programmable switching element |
Oct. 24, 2006 |
| 7105917 |
Semiconductor device having a fuse connected to a pad and fabrication method thereof |
Sep. 12, 2006 |
| 7091564 |
Semiconductor chip with fuse unit |
Aug. 15, 2006 |
| 7075107 |
Semiconductor wafer and manufacturing process thereof |
Jul. 11, 2006 |
| 7068521 |
Semiconductor device |
Jun. 27, 2006 |
| 7067897 |
Semiconductor device |
Jun. 27, 2006 |
| 7064409 |
Structure and programming of laser fuse |
Jun. 20, 2006 |
| 7061070 |
Semiconductor device with fuse arrangement |
Jun. 13, 2006 |
| 7057217 |
Fuse arrangement and integrated circuit device using the same |
Jun. 6, 2006 |
| 7053495 |
Semiconductor integrated circuit device and method for fabricating the same |
May. 30, 2006 |
| 7038319 |
Apparatus and method to reduce signal cross-talk |
May. 2, 2006 |
| 7033865 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
Apr. 25, 2006 |
| 7009222 |
Protective metal structure and method to protect low-K dielectric layer during fuse blow process |
Mar. 7, 2006 |
| 7005727 |
Low cost programmable CPU package/substrate |
Feb. 28, 2006 |
| 6989577 |
Semiconductor device having multiple insulation layers |
Jan. 24, 2006 |
| 6936911 |
Semiconductor integrated circuit device |
Aug. 30, 2005 |
| 6933591 |
Electrically-programmable integrated circuit fuses and sensing circuits |
Aug. 23, 2005 |
| 6927472 |
Fuse structure and method to form the same |
Aug. 9, 2005 |
| 6924185 |
Fuse structure and method to form the same |
Aug. 2, 2005 |
| 6913954 |
Programmable fuse device |
Jul. 5, 2005 |
| 6903447 |
Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching |
Jun. 7, 2005 |
| 6888227 |
Apparatus for routing signals |
May. 3, 2005 |
| 6879020 |
Semiconductor device |
Apr. 12, 2005 |
| 6875920 |
Semiconductor device and design support method of electronic device using the same |
Apr. 5, 2005 |
| 6867441 |
Metal fuse structure for saving layout area |
Mar. 15, 2005 |
| 6858469 |
Method and apparatus for epoxy loc die attachment |
Feb. 22, 2005 |
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