| |
 |
|
Class Information
Number: 257/664
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Transmission line lead (e.g., stripline, coax, etc.)
Description: Subject matter wherein an active solid-state device is provided with an electrical connection or lead with controlled electrical characteristics used to transmit high-frequency, e.g., greater than 3 megahertz, or narrow pulse signals to or from the device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605450 |
High frequency arrangement |
Oct. 20, 2009 |
| 7602049 |
Capacitive techniques to reduce noise in high speed interconnections |
Oct. 13, 2009 |
| 7595546 |
Printed circuit board |
Sep. 29, 2009 |
| 7592879 |
Integrated circuit with at least one integrated transmission line |
Sep. 22, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7569916 |
Separable network interconnect systems and assemblies |
Aug. 4, 2009 |
| 7550854 |
Integrated interconnect arrangement |
Jun. 23, 2009 |
| 7547558 |
Method for manufacturing semiconductor device |
Jun. 16, 2009 |
| 7504711 |
Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof |
Mar. 17, 2009 |
| 7495318 |
Apparatus and method for improving AC coupling on circuit boards |
Feb. 24, 2009 |
| 7483286 |
Semiconductor memory device with high permeability lines interposed between adjacent transmission lines |
Jan. 27, 2009 |
| 7470937 |
Optical module |
Dec. 30, 2008 |
| 7468560 |
Semiconductor device with micro connecting elements and method for producing the same |
Dec. 23, 2008 |
| 7457337 |
Optical module having case grounding using bypass capacitor |
Nov. 25, 2008 |
| 7414299 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 19, 2008 |
| 7411279 |
Component interconnect with substrate shielding |
Aug. 12, 2008 |
| 7391099 |
Optical modulator module |
Jun. 24, 2008 |
| 7391637 |
Semiconductor memory device with high permeability composite films to reduce noise in high speed interconnects |
Jun. 24, 2008 |
| 7375414 |
High permeability layered films to reduce noise in high speed interconnects |
May. 20, 2008 |
| 7372144 |
High speed electronics interconnect and method of manufacture |
May. 13, 2008 |
| 7365415 |
High frequency semiconductor device |
Apr. 29, 2008 |
| 7361975 |
Semiconductor integrated circuit having reduced cross-talk noise |
Apr. 22, 2008 |
| 7352059 |
Low loss interconnect structure for use in microelectronic circuits |
Apr. 1, 2008 |
| 7335968 |
High permeability composite films to reduce noise in high speed interconnects |
Feb. 26, 2008 |
| 7321167 |
Flex tape architecture for integrated circuit signal ingress/egress |
Jan. 22, 2008 |
| 7312528 |
Semiconductor device having antenna connection electrodes |
Dec. 25, 2007 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7291916 |
Signal transmission structure and circuit substrate thereof |
Nov. 6, 2007 |
| 7286029 |
Passive devices formed in grooves on a substrate and a method of manufacture |
Oct. 23, 2007 |
| 7244977 |
Longitudinal MISFET manufacturing method, longitudinal MISFET, semiconductor storage device manufacturing method, and semiconductor storage device |
Jul. 17, 2007 |
| 7239002 |
Integrated circuit device |
Jul. 3, 2007 |
| 7239013 |
Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device |
Jul. 3, 2007 |
| 7230319 |
Electronic substrate |
Jun. 12, 2007 |
| 7215007 |
Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards |
May. 8, 2007 |
| 7211738 |
Bonding pad structure for a display device and fabrication method thereof |
May. 1, 2007 |
| 7206515 |
Single-ended/differential wired radio frequency interface |
Apr. 17, 2007 |
| 7187061 |
Use of a down-bond as a controlled inductor in integrated circuit applications |
Mar. 6, 2007 |
| 7187062 |
Coupler detector |
Mar. 6, 2007 |
| 7161244 |
Microwave device for dissipating or attenuating power |
Jan. 9, 2007 |
| 7161450 |
Microwave transmission line having dielectric film layers providing negative space charge effects |
Jan. 9, 2007 |
| 7148772 |
Coaxial waveguide microstructures having an active device and methods of formation thereof |
Dec. 12, 2006 |
| 7149024 |
Optical modulator module |
Dec. 12, 2006 |
| 7142822 |
Package device for accommodating a radio frequency circuit |
Nov. 28, 2006 |
| 7132740 |
Semiconductor package with conductor impedance selected during assembly |
Nov. 7, 2006 |
| 7112870 |
Semiconductor integrated circuit device including dummy patterns located to reduce dishing |
Sep. 26, 2006 |
| 7109531 |
High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment |
Sep. 19, 2006 |
| 7109569 |
Dual referenced microstrip |
Sep. 19, 2006 |
| 7105928 |
Copper wiring with high temperature superconductor (HTS) layer |
Sep. 12, 2006 |
| 7101778 |
Transmission lines for CMOS integrated circuits |
Sep. 5, 2006 |
| 7087983 |
Manufacturing methods of semiconductor devices and a solid state image pickup device |
Aug. 8, 2006 |
|
|
|
