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Class Information
Number: 257/663
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Superconductive contact or lead > On integrated circuit
Description: Subject matter under 661 in which the superconductive contact or lead is associated with an electrical network made up of more than one electronic device, including at least one active solid-state electronic device, in a unitary structure.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7449769 |
Superconducting system, superconducting circuit chip, and high-temperature superconducting junction device with a shunt resistor |
Nov. 11, 2008 |
| 7411279 |
Component interconnect with substrate shielding |
Aug. 12, 2008 |
| 7230319 |
Electronic substrate |
Jun. 12, 2007 |
| 7211887 |
connection arrangement for micro lead frame plastic packages |
May. 1, 2007 |
| 7187061 |
Use of a down-bond as a controlled inductor in integrated circuit applications |
Mar. 6, 2007 |
| 7169621 |
Ferroelectric memory device |
Jan. 30, 2007 |
| 7135717 |
Semiconductor switches and switching circuits for microwave |
Nov. 14, 2006 |
| 7112870 |
Semiconductor integrated circuit device including dummy patterns located to reduce dishing |
Sep. 26, 2006 |
| 7105928 |
Copper wiring with high temperature superconductor (HTS) layer |
Sep. 12, 2006 |
| 7095042 |
Electrode structure, semiconductor light-emitting device having the same and method of manufacturing the same |
Aug. 22, 2006 |
| 7075171 |
Superconducting system, superconducting circuit chip, and high-temperature superconducting junction device with a shunt resistor |
Jul. 11, 2006 |
| 7042103 |
Low stress semiconductor die attach |
May. 9, 2006 |
| 7015585 |
Packaged integrated circuit having wire bonds and method therefor |
Mar. 21, 2006 |
| 7002238 |
Use of a down-bond as a controlled inductor in integrated circuit applications |
Feb. 21, 2006 |
| 6987282 |
Quantum bit with a multi-terminal junction and loop with a phase shift |
Jan. 17, 2006 |
| 6967393 |
Semiconductor differential interconnect |
Nov. 22, 2005 |
| 6919579 |
Quantum bit with a multi-terminal junction and loop with a phase shift |
Jul. 19, 2005 |
| 6911664 |
Extra-substrate control system |
Jun. 28, 2005 |
| 6903447 |
Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching |
Jun. 7, 2005 |
| 6897548 |
Semiconductor differential interconnect |
May. 24, 2005 |
| 6838749 |
Structures for increasing the critical temperature of superconductors |
Jan. 4, 2005 |
| 6838694 |
Superconducting quantum-bit device based on Josephson junctions |
Jan. 4, 2005 |
| 6828658 |
Package for integrated circuit with internal matching |
Dec. 7, 2004 |
| 6809403 |
Fault tolerant electrical circuit and method |
Oct. 26, 2004 |
| 6806558 |
Integrated segmented and interdigitated broadside- and edge-coupled transmission lines |
Oct. 19, 2004 |
| 6787798 |
Method and system for storing information using nano-pinned dipole magnetic vortices in superconducting materials |
Sep. 7, 2004 |
| 6784521 |
Directional coupler |
Aug. 31, 2004 |
| 6777808 |
Capacitor for signal propagation across ground plane boundaries in superconductor integrated circuits |
Aug. 17, 2004 |
| 6774463 |
Superconductor gate semiconductor channel field effect transistor |
Aug. 10, 2004 |
| 6713853 |
Electronic package with offset reference plane cutout |
Mar. 30, 2004 |
| 6642608 |
MoNx resistor for superconductor integrated circuit |
Nov. 4, 2003 |
| 6589810 |
BGA package and method of fabrication |
Jul. 8, 2003 |
| 6583498 |
Integrated circuit packaging with tapered striplines of constant impedance |
Jun. 24, 2003 |
| 6569757 |
Methods for forming co-axial interconnect lines in a CMOS process for high speed applications |
May. 27, 2003 |
| 6552422 |
Data carrier with an integrated electronic component and with a transmission coil which comprises turn portions arranged directly against said component |
Apr. 22, 2003 |
| 6518648 |
Superconductor barrier layer for integrated circuit interconnects |
Feb. 11, 2003 |
| 6518673 |
Capacitor for signal propagation across ground plane boundaries in superconductor integrated circuits |
Feb. 11, 2003 |
| 6384479 |
Semiconductor integrated circuit device |
May. 7, 2002 |
| 6345189 |
Assembly of carrier and superconductive film |
Feb. 5, 2002 |
| 6345190 |
Assembly of carrier and superconductive film |
Feb. 5, 2002 |
| 6175749 |
Assembly of carrier and superconductive film |
Jan. 16, 2001 |
| 6169322 |
Die attach pad adapted to reduce delamination stress and method of using same |
Jan. 2, 2001 |
| 6087711 |
Integrated circuit metallization with superconductor BEOL wiring |
Jul. 11, 2000 |
| 6051440 |
Method of fabricating a low-inductance in-line resistor for superconductor integrated circuits |
Apr. 18, 2000 |
| 6051846 |
Monolithic integrated high-T.sub.c superconductor-semiconductor structure |
Apr. 18, 2000 |
| 5994763 |
Wiring structure for semiconductor element and method for forming the same |
Nov. 30, 1999 |
| 5912503 |
Planar in-line resistors for superconductor circuits |
Jun. 15, 1999 |
| 5880521 |
Super-conductive wiring and semiconductor device using the same |
Mar. 9, 1999 |
| 5828078 |
Electrostatic discharge protection using high temperature superconductors |
Oct. 27, 1998 |
| 5760463 |
Superconducting layer in contact with group III-V semiconductor layer for wiring structure |
Jun. 2, 1998 |
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