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Class Information
Number: 257/662
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Superconductive contact or lead > Transmission line or shielded
Description: Subject matter under 661 in which the superconductive electrical lead has controlled electrical characteristics designed to convey high frequency (e.g., greater than 3 megahertz) signals or narrow pulse signals; or is surrounded by a separate electrical conductor or envelope, called a shield, designed to minimize the effects of nearby electrical circuits.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7449769 |
Superconducting system, superconducting circuit chip, and high-temperature superconducting junction device with a shunt resistor |
Nov. 11, 2008 |
| 7411279 |
Component interconnect with substrate shielding |
Aug. 12, 2008 |
| 7411277 |
Semiconductor integrated circuit having shield wiring |
Aug. 12, 2008 |
| 7391637 |
Semiconductor memory device with high permeability composite films to reduce noise in high speed interconnects |
Jun. 24, 2008 |
| 7375414 |
High permeability layered films to reduce noise in high speed interconnects |
May. 20, 2008 |
| 7361975 |
Semiconductor integrated circuit having reduced cross-talk noise |
Apr. 22, 2008 |
| 7335968 |
High permeability composite films to reduce noise in high speed interconnects |
Feb. 26, 2008 |
| 7327016 |
High permeability composite films to reduce noise in high speed interconnects |
Feb. 5, 2008 |
| 7321145 |
Method and apparatus for operating nonvolatile memory cells with modified band structure |
Jan. 22, 2008 |
| 7294906 |
Wiring technique |
Nov. 13, 2007 |
| 7279778 |
Semiconductor package having a high-speed signal input/output terminal |
Oct. 9, 2007 |
| 7265438 |
RF seal ring structure |
Sep. 4, 2007 |
| 7239002 |
Integrated circuit device |
Jul. 3, 2007 |
| 7230319 |
Electronic substrate |
Jun. 12, 2007 |
| 7214586 |
Methods of fabricating nonvolatile memory device |
May. 8, 2007 |
| 7211887 |
connection arrangement for micro lead frame plastic packages |
May. 1, 2007 |
| 7196387 |
Memory cell with an asymmetrical area |
Mar. 27, 2007 |
| 7190053 |
Field device incorporating circuit card assembly as environmental and EMI/RFI shield |
Mar. 13, 2007 |
| 7187061 |
Use of a down-bond as a controlled inductor in integrated circuit applications |
Mar. 6, 2007 |
| 7135717 |
Semiconductor switches and switching circuits for microwave |
Nov. 14, 2006 |
| 7122881 |
Wiring board and circuit module |
Oct. 17, 2006 |
| 7112870 |
Semiconductor integrated circuit device including dummy patterns located to reduce dishing |
Sep. 26, 2006 |
| 7109569 |
Dual referenced microstrip |
Sep. 19, 2006 |
| 7087983 |
Manufacturing methods of semiconductor devices and a solid state image pickup device |
Aug. 8, 2006 |
| 7075171 |
Superconducting system, superconducting circuit chip, and high-temperature superconducting junction device with a shunt resistor |
Jul. 11, 2006 |
| 7053466 |
High-speed signaling interface with broadside dynamic wave coupling |
May. 30, 2006 |
| 7048992 |
Fabrication of Parascan tunable dielectric chips |
May. 23, 2006 |
| 7030470 |
Using chip lamination to couple an integrated circuit with a microstrip transmission line |
Apr. 18, 2006 |
| 7030455 |
Integrated electromagnetic shielding device |
Apr. 18, 2006 |
| 7015585 |
Packaged integrated circuit having wire bonds and method therefor |
Mar. 21, 2006 |
| 7015569 |
Method and apparatus for implementing a co-axial wire in a semiconductor chip |
Mar. 21, 2006 |
| 7012337 |
Semiconductor device including a photosensitive resin covering at least a portion of a substrate having a via hole |
Mar. 14, 2006 |
| 7002238 |
Use of a down-bond as a controlled inductor in integrated circuit applications |
Feb. 21, 2006 |
| 6982477 |
Integrated circuit |
Jan. 3, 2006 |
| 6967393 |
Semiconductor differential interconnect |
Nov. 22, 2005 |
| 6927477 |
Coplanar line, and a module using the coplanar line |
Aug. 9, 2005 |
| 6919619 |
Actively-shielded signal wires |
Jul. 19, 2005 |
| 6906402 |
High permeability thin films and patterned thin films to reduce noise in high speed interconnections |
Jun. 14, 2005 |
| 6903444 |
High permeability thin films and patterned thin films to reduce noise in high speed interconnections |
Jun. 7, 2005 |
| 6903003 |
High permeability composite films to reduce noise in high speed interconnects |
Jun. 7, 2005 |
| 6903447 |
Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching |
Jun. 7, 2005 |
| 6897548 |
Semiconductor differential interconnect |
May. 24, 2005 |
| 6876076 |
Multilayer semiconductor device for transmitting microwave signals and associated methods |
Apr. 5, 2005 |
| 6876064 |
Semiconductor device having superior resistance to moisture |
Apr. 5, 2005 |
| 6853054 |
High frequency semiconductor device |
Feb. 8, 2005 |
| 6846738 |
High permeability composite films to reduce noise in high speed interconnects |
Jan. 25, 2005 |
| 6844256 |
High permeability composite films to reduce noise in high speed interconnects |
Jan. 18, 2005 |
| 6833317 |
High permeability composite films to reduce noise in high speed interconnects |
Dec. 21, 2004 |
| 6828658 |
Package for integrated circuit with internal matching |
Dec. 7, 2004 |
| 6809403 |
Fault tolerant electrical circuit and method |
Oct. 26, 2004 |
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