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Browse by Category: Main > Physics
Class Information
Number: 257/660
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > With shielding (e.g., electrical or magnetic shielding, or from electromagnetic radiation or charged particles) > With means to shield device contained in housing or package from charged particles (e.g., alpha particles) or highly ionizing radiation (i.e., hard x-rays or shorter wavelength)
Description: Subject matter wherein the device is provided with means to shield it from charged particles or highly ionizing radiation contained in a housing or package separate and apart from the shielding means.










Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8704443 Organic EL device Apr. 22, 2014
8664751 Semiconductor package Mar. 4, 2014
8664756 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability Mar. 4, 2014
8665596 Power switching circuitry Mar. 4, 2014
8653633 Semiconductor device packages with electromagnetic interference shielding Feb. 18, 2014
8652880 Semiconductor device and method of manufacturing same Feb. 18, 2014
8637963 Radiation-shielded semiconductor device Jan. 28, 2014
8614120 Semiconductor chip package and method of making same Dec. 24, 2013
8610266 Semiconductor device for radio frequency applications and method for making the same Dec. 17, 2013
8603861 Alpha shielding techniques and configurations Dec. 10, 2013
8605466 Radiation hardened motor drive stage Dec. 10, 2013
8592958 Chip package and manufacturing method thereof Nov. 26, 2013
8575730 Semiconductor device Nov. 5, 2013
8569870 Integrated circuit packaging system with shielding spacer and method of manufacture thereof Oct. 29, 2013
8569869 Integrated circuit packaging system with encapsulation and method of manufacture thereof Oct. 29, 2013
8552539 Shielded package having shield lid Oct. 8, 2013
8531012 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV Sep. 10, 2013
8521085 Integrated circuit with intra-chip and extra-chip RF communication Aug. 27, 2013
8507319 Integrated circuit package system with shield Aug. 13, 2013
8502311 Semiconductor transistor comprising two electrically conductive shield elements Aug. 6, 2013
8497156 Semiconductor device and manufacturing method of the same Jul. 30, 2013
8482107 Circular shield of a circuit-substrate laminated module and electronic apparatus Jul. 9, 2013
8482108 Wafer-scale X-ray detector and method of manufacturing the same Jul. 9, 2013
8466539 MRAM device and method of assembling same Jun. 18, 2013
8450836 Semiconductor device May. 28, 2013
8432022 Shielded embedded electronic component substrate fabrication method and structure Apr. 30, 2013
8415774 Screened electrical device and a process for manufacturing the same Apr. 9, 2013
8410584 Semiconductor device packages with electromagnetic interference shielding Apr. 2, 2013
8399964 Multilayer structures for magnetic shielding Mar. 19, 2013
8378466 Wafer-level semiconductor device packages with electromagnetic interference shielding Feb. 19, 2013
8373256 Semiconductor device Feb. 12, 2013
8368185 Semiconductor device packages with electromagnetic interference shielding Feb. 5, 2013
8368187 Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die Feb. 5, 2013
8362600 Method and structure to reduce soft error rate susceptibility in semiconductor structures Jan. 29, 2013
8362608 Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package Jan. 29, 2013
8362599 Forming radio frequency integrated circuits Jan. 29, 2013
8362597 Shielded package having shield lid Jan. 29, 2013
8362598 Semiconductor device with electromagnetic interference shielding Jan. 29, 2013
8350368 Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure Jan. 8, 2013
8350367 Semiconductor device packages with electromagnetic interference shielding Jan. 8, 2013
8349659 Integrated shield for a no-lead semiconductor device package Jan. 8, 2013
8349710 Shielding techniques for an integrated circuit Jan. 8, 2013
8344485 Anticounterfeiting system and method for integrated circuits Jan. 1, 2013
8338921 Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same Dec. 25, 2012
8319318 Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages Nov. 27, 2012
8309454 Structure for electrostatic discharge in embedded wafer level packages Nov. 13, 2012
8304286 Integrated circuit packaging system with shielded package and method of manufacture thereof Nov. 6, 2012
8304891 Semiconductor package device, semiconductor package structure, and fabrication methods thereof Nov. 6, 2012
8296941 Conformal shielding employing segment buildup Oct. 30, 2012
8299586 Semiconductor device and method of manufacturing the same Oct. 30, 2012

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