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Class Information
Number: 257/644
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > With means to control surface effects > Insulating coating > Multiple layers > At least one layer of glass
Description: Subject matter wherein there is at least one layer of glass in the multiple insulating layers on the semiconductor body.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7446392 |
Electronic device and method for manufacturing the same |
Nov. 4, 2008 |
| 7436076 |
Micromechanical component having an anodically bonded cap and a manufacturing method |
Oct. 14, 2008 |
| 7405466 |
Method of fabricating microelectromechanical system structures |
Jul. 29, 2008 |
| 7355269 |
IC on non-semiconductor substrate |
Apr. 8, 2008 |
| 7298021 |
Electronic device and method for manufacturing the same |
Nov. 20, 2007 |
| 7291923 |
Tapered signal lines |
Nov. 6, 2007 |
| 7250670 |
Semiconductor structure and fabricating method thereof |
Jul. 31, 2007 |
| RE39690 |
Enhanced planarization technique for an integrated circuit |
Jun. 12, 2007 |
| 7226875 |
Method for enhancing FSG film stability |
Jun. 5, 2007 |
| 7208836 |
Integrated circuitry and a semiconductor processing method of forming a series of conductive lines |
Apr. 24, 2007 |
| 7180129 |
Semiconductor device including insulating layer |
Feb. 20, 2007 |
| 7145245 |
Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate--therein |
Dec. 5, 2006 |
| 7075187 |
Coating material over electrodes to support organic synthesis |
Jul. 11, 2006 |
| 7030468 |
Low k and ultra low k SiCOH dielectric films and methods to form the same |
Apr. 18, 2006 |
| 6979882 |
Electronic device and method for manufacturing the same |
Dec. 27, 2005 |
| 6943429 |
Wafer having alignment marks extending from a first to a second surface of the wafer |
Sep. 13, 2005 |
| 6890786 |
Wafer scale processing |
May. 10, 2005 |
| 6888224 |
Methods and systems for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials |
May. 3, 2005 |
| 6864562 |
Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film |
Mar. 8, 2005 |
| 6844628 |
Electronic device and method for manufacturing the same |
Jan. 18, 2005 |
| 6800928 |
Porous integrated circuit dielectric with decreased surface porosity |
Oct. 5, 2004 |
| 6791164 |
Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
Sep. 14, 2004 |
| 6787886 |
Semiconductor device and methods of fabricating the same |
Sep. 7, 2004 |
| 6774461 |
Method of reducing thick film stress of spin-on dielectric and the resulting sandwich dielectric structure |
Aug. 10, 2004 |
| 6774059 |
High crack resistance nitride process |
Aug. 10, 2004 |
| 6746969 |
Method of manufacturing semiconductor device |
Jun. 8, 2004 |
| 6730619 |
Method of manufacturing insulating layer and semiconductor device including insulating layer |
May. 4, 2004 |
| 6713235 |
Method for fabricating thin-film substrate and thin-film substrate fabricated by the method |
Mar. 30, 2004 |
| 6707134 |
Semiconductor structure having an improved pre-metal dielectric stack and method for forming the same |
Mar. 16, 2004 |
| 6664071 |
Photodetector and the use of the same |
Dec. 16, 2003 |
| 6650002 |
Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film |
Nov. 18, 2003 |
| 6621154 |
Semiconductor apparatus having stress cushioning layer |
Sep. 16, 2003 |
| 6597066 |
Hermetic chip and method of manufacture |
Jul. 22, 2003 |
| 6597042 |
Contact with germanium layer |
Jul. 22, 2003 |
| 6518646 |
Semiconductor device with variable composition low-k inter-layer dielectric and method of making |
Feb. 11, 2003 |
| 6515351 |
Integrated circuit with borderless contacts |
Feb. 4, 2003 |
| 6504234 |
Semiconductor device with interlayer film comprising a diffusion prevention layer to keep metal impurities from invading the underlying semiconductor substrate |
Jan. 7, 2003 |
| 6495906 |
Simplified process for producing nanoporous silica |
Dec. 17, 2002 |
| 6476415 |
Wafer scale processing |
Nov. 5, 2002 |
| 6441467 |
Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film |
Aug. 27, 2002 |
| 6396078 |
Semiconductor device with a tapered hole formed using multiple layers with different etching rates |
May. 28, 2002 |
| 6388326 |
Bonding pad on a semiconductor chip |
May. 14, 2002 |
| 6379785 |
Glass-coated substrates for high frequency applications |
Apr. 30, 2002 |
| 6320246 |
Semiconductor wafer assemblies |
Nov. 20, 2001 |
| 6316829 |
Reinforced semiconductor package |
Nov. 13, 2001 |
| 6303977 |
Fully hermetic semiconductor chip, including sealed edge sides |
Oct. 16, 2001 |
| 6300667 |
Semiconductor structure with air gaps formed between metal leads |
Oct. 9, 2001 |
| 6246105 |
Semiconductor device and manufacturing process thereof |
Jun. 12, 2001 |
| 6242355 |
Method for insulating metal conductors by spin-on-glass and devices made |
Jun. 5, 2001 |
| 6215194 |
Wafer sheet with adhesive on both sides and attached semiconductor wafer |
Apr. 10, 2001 |
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