Resources Contact Us Home
Browse by Category: Main > Physics
Class Information
Number: 257/644
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > With means to control surface effects > Insulating coating > Multiple layers > At least one layer of glass
Description: Subject matter wherein there is at least one layer of glass in the multiple insulating layers on the semiconductor body.

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8587008 Light-emitting device Nov. 19, 2013
8476742 Fluid ejection device comprising substrate contact via Jul. 2, 2013
8394656 Method of creating MEMS device cavities by a non-etching process Mar. 12, 2013
8368064 Glass for scattering layer of organic LED device and organic LED device Feb. 5, 2013
8227877 Semiconductor bio-sensors and methods of manufacturing the same Jul. 24, 2012
8097932 Ultra low .kappa. plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality Jan. 17, 2012
7999328 Isolation trench having first and second trench areas of different widths Aug. 16, 2011
7795061 Method of creating MEMS device cavities by a non-etching process Sep. 14, 2010
7772648 Performance enhanced silicon-on-insulator technology Aug. 10, 2010
7759801 Tapered signal lines Jul. 20, 2010
7632760 Semiconductor device having field stabilization film and method Dec. 15, 2009
7579622 Fabrication of MEMS devices with spin-on glass Aug. 25, 2009
7446392 Electronic device and method for manufacturing the same Nov. 4, 2008
7436076 Micromechanical component having an anodically bonded cap and a manufacturing method Oct. 14, 2008
7405466 Method of fabricating microelectromechanical system structures Jul. 29, 2008
7355269 IC on non-semiconductor substrate Apr. 8, 2008
7298021 Electronic device and method for manufacturing the same Nov. 20, 2007
7291923 Tapered signal lines Nov. 6, 2007
7250670 Semiconductor structure and fabricating method thereof Jul. 31, 2007
RE39690 Enhanced planarization technique for an integrated circuit Jun. 12, 2007
7226875 Method for enhancing FSG film stability Jun. 5, 2007
7208836 Integrated circuitry and a semiconductor processing method of forming a series of conductive lines Apr. 24, 2007
7180129 Semiconductor device including insulating layer Feb. 20, 2007
7145245 Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate--therein Dec. 5, 2006
7075187 Coating material over electrodes to support organic synthesis Jul. 11, 2006
7030468 Low k and ultra low k SiCOH dielectric films and methods to form the same Apr. 18, 2006
6979882 Electronic device and method for manufacturing the same Dec. 27, 2005
6943429 Wafer having alignment marks extending from a first to a second surface of the wafer Sep. 13, 2005
6890786 Wafer scale processing May. 10, 2005
6888224 Methods and systems for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials May. 3, 2005
6864562 Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film Mar. 8, 2005
6844628 Electronic device and method for manufacturing the same Jan. 18, 2005
6800928 Porous integrated circuit dielectric with decreased surface porosity Oct. 5, 2004
6791164 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages Sep. 14, 2004
6787886 Semiconductor device and methods of fabricating the same Sep. 7, 2004
6774059 High crack resistance nitride process Aug. 10, 2004
6774461 Method of reducing thick film stress of spin-on dielectric and the resulting sandwich dielectric structure Aug. 10, 2004
6746969 Method of manufacturing semiconductor device Jun. 8, 2004
6730619 Method of manufacturing insulating layer and semiconductor device including insulating layer May. 4, 2004
6713235 Method for fabricating thin-film substrate and thin-film substrate fabricated by the method Mar. 30, 2004
6707134 Semiconductor structure having an improved pre-metal dielectric stack and method for forming the same Mar. 16, 2004
6664071 Photodetector and the use of the same Dec. 16, 2003
6650002 Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film Nov. 18, 2003
6621154 Semiconductor apparatus having stress cushioning layer Sep. 16, 2003
6597066 Hermetic chip and method of manufacture Jul. 22, 2003
6597042 Contact with germanium layer Jul. 22, 2003
6518646 Semiconductor device with variable composition low-k inter-layer dielectric and method of making Feb. 11, 2003
6515351 Integrated circuit with borderless contacts Feb. 4, 2003
6504234 Semiconductor device with interlayer film comprising a diffusion prevention layer to keep metal impurities from invading the underlying semiconductor substrate Jan. 7, 2003
6495906 Simplified process for producing nanoporous silica Dec. 17, 2002

1 2 3 4

  Recently Added Patents
Nonvolatile semiconductor storage device having conductive and insulative charge storage films
Display apparatus, a method for a display control, and program
Method and apparatus of motion vector prediction with extended motion vector predictor
Interest point detection
Controller for machine tool and five-axis simultaneous control machine tool controlled thereby
Piezoelectric speaker and method of manufacturing the same
Synchronous rectifier network unit circuit and method
  Randomly Featured Patents
Method for maintaining cache coherence using a distributed directory with event driven updates
Heating and air conditioning system
Stabilized interferon compositions
Digital signal processing circuit having an adder circuit with carry-outs
School bus safety lighting system
Radioactive substance container, manufacturing apparatus thereof and manufacturing method thereof
Thin film transistor array panel for a liquid crystal display
Pool chemical dispenser
Semiconductor chip package with enhanced thermal conductivity
High thermal emissive semiconductor device package