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Class Information
Number: 257/643
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > With means to control surface effects > Insulating coating > Multiple layers > At least one layer of organic material > Polyimide or polyamide
Description: Subject matter wherein the at least one organic insulating layer comprises polyamide (i.e., a polymeric compound) resulting from replacement of an atom of hydrogen in an organic amine by an organic univalent acid radical, or polyimide, i.e., a polymeric compound resulting from replacement of both atoms of hydrogen in an organic amine by organic univalent acid radicals or by an organic divalent acid radical.


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
6657303 Integrated circuit with low solubility metal-conductor interconnect cap Dec. 2, 2003
6636543 Semiconductor device and surface emitting semiconductor laser device Oct. 21, 2003
6635967 Air gap semiconductor structure and method of manufacture Oct. 21, 2003
6633085 Method of selectively alloying interconnect regions by ion implantation Oct. 14, 2003
6614099 Copper metallurgy in integrated circuits Sep. 2, 2003
6611064 Semiconductor device and method for manufacturing the same Aug. 26, 2003
6597069 Flip chip metallization Jul. 22, 2003
6586826 Integrated circuit package having posts for connection to other packages and substrates Jul. 1, 2003
6580155 Semiconductor device Jun. 17, 2003
6580170 Semiconductor device protective overcoat with enhanced adhesion to polymeric materials Jun. 17, 2003
6555969 EL display device and manufacturing method thereof Apr. 29, 2003
6552432 Mask on a polymer having an opening width less than that of the opening in the polymer Apr. 22, 2003
6531759 Alpha particle shield for integrated circuit Mar. 11, 2003
6501179 Constructions comprising insulative materials Dec. 31, 2002
6479884 Interim oxidation of silsesquioxane dielectric for dual damascene process Nov. 12, 2002
6452274 Semiconductor device having a low dielectric layer as an interlayer insulating layer Sep. 17, 2002
6445059 Semiconductor device Sep. 3, 2002
6441468 Semiconductor device Aug. 27, 2002
6437425 Semiconductor devices which utilize low K dielectrics Aug. 20, 2002
6432844 Implanted conductor and methods of making Aug. 13, 2002
6423566 Moisture and ion barrier for protection of devices and interconnect structures Jul. 23, 2002
6414377 Low k dielectric materials with inherent copper ion migration barrier Jul. 2, 2002
6384483 Manufacturing method for semiconductor device May. 7, 2002
6348733 Dual damascene process and structure with dielectric barrier layer Feb. 19, 2002
6337511 LOC semiconductor assembled with room temperature adhesive Jan. 8, 2002
6333556 Insulating materials Dec. 25, 2001
6316823 LOC semiconductor assembled with room temperature adhesive Nov. 13, 2001
6310389 Semiconductor package Oct. 30, 2001
6303978 Optical semiconductor component and method of manufacture Oct. 16, 2001
6255735 Dual damascene arrangement for metal interconnection with low k dielectric constant materials in dielectric layers Jul. 3, 2001
6252297 Array substrate, liquid crystal display device and their manufacturing method Jun. 26, 2001
6246070 Semiconductor device provided with semiconductor circuit made of semiconductor element and method of fabricating the same Jun. 12, 2001
6239470 Active matrix electro-luminescent display thin film transistor May. 29, 2001
6229192 Image sensor or LCD including switching pin diodes May. 8, 2001
6208016 Forming submicron integrated-circuit wiring from gold, silver, copper and other metals Mar. 27, 2001
6201293 Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same Mar. 13, 2001
6198159 Bonded wafer, process for producing same and substrate Mar. 6, 2001
6169293 Display device Jan. 2, 2001
6140691 Trench isolation structure having a low K dielectric material isolated from a silicon-based substrate Oct. 31, 2000
6137155 Planar guard ring Oct. 24, 2000
6130472 Moisture and ion barrier for protection of devices and interconnect structures Oct. 10, 2000
6097093 Structure of a dual damascene Aug. 1, 2000
6087006 Surface-protecting film and resin-sealed semiconductor device having said film Jul. 11, 2000
6084301 Composite bump structures Jul. 4, 2000
6084311 Method and apparatus for reducing resin bleed during the formation of a semiconductor device Jul. 4, 2000
6043551 Metal locking structures to prevent a passivation layer from delaminating Mar. 28, 2000
6040628 Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics Mar. 21, 2000
6018184 Semiconductor structure useful in a self-aligned contact having multiple insulation layers of non-uniform thickness Jan. 25, 2000
5965935 Low loss ridged microstrip line for monolithic microwave integrated circuit (MMIC) applications Oct. 12, 1999
5963285 Liquid crystal display with improved electrode adhesion and method for manufacturing same Oct. 5, 1999

1 2 3 4


 
 
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