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Class Information
Number: 257/643
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > With means to control surface effects > Insulating coating > Multiple layers > At least one layer of organic material > Polyimide or polyamide
Description: Subject matter wherein the at least one organic insulating layer comprises polyamide (i.e., a polymeric compound) resulting from replacement of an atom of hydrogen in an organic amine by an organic univalent acid radical, or polyimide, i.e., a polymeric compound resulting from replacement of both atoms of hydrogen in an organic amine by organic univalent acid radicals or by an organic divalent acid radical.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7427813 |
Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package |
Sep. 23, 2008 |
| 7410915 |
Method of forming carbon polymer film using plasma CVD |
Aug. 12, 2008 |
| 7382042 |
COF flexible printed wiring board and method of producing the wiring board |
Jun. 3, 2008 |
| 7378682 |
Memory element using active layer of blended materials |
May. 27, 2008 |
| 7365414 |
Component packaging apparatus, systems, and methods |
Apr. 29, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7307338 |
Three dimensional polymer memory cell systems |
Dec. 11, 2007 |
| 7298021 |
Electronic device and method for manufacturing the same |
Nov. 20, 2007 |
| 7279778 |
Semiconductor package having a high-speed signal input/output terminal |
Oct. 9, 2007 |
| 7262489 |
Three-dimensionally formed circuit sheet, component and method for manufacturing the same |
Aug. 28, 2007 |
| 7244635 |
Semiconductor device and method of manufacturing the same |
Jul. 17, 2007 |
| 7239030 |
Flexible wiring board for tape carrier package having improved flame resistance |
Jul. 3, 2007 |
| 7205565 |
Thin film transistor and OLED including the same |
Apr. 17, 2007 |
| 7202495 |
Organic semiconductor element, production method therefor and organic semiconductor device |
Apr. 10, 2007 |
| 7202551 |
Display device having underlying insulating film and insulating films |
Apr. 10, 2007 |
| 7199450 |
Materials and method to seal vias in silicon substrates |
Apr. 3, 2007 |
| 7157788 |
Metal oxide dispersion for dye-sensitized solar cells, photoactive electrode and dye-sensitized solar cell |
Jan. 2, 2007 |
| 7145221 |
Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
Dec. 5, 2006 |
| 7087982 |
Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials |
Aug. 8, 2006 |
| 7084493 |
Wiring circuit board and production method thereof |
Aug. 1, 2006 |
| 7075187 |
Coating material over electrodes to support organic synthesis |
Jul. 11, 2006 |
| 7071539 |
Chemical planarization performance for copper/low-k interconnect structures |
Jul. 4, 2006 |
| 7067901 |
Semiconductor devices including protective layers on active surfaces thereof |
Jun. 27, 2006 |
| 7053495 |
Semiconductor integrated circuit device and method for fabricating the same |
May. 30, 2006 |
| 7034380 |
Low-dielectric constant structure with a multilayer stack of thin films with pores |
Apr. 25, 2006 |
| 7019328 |
Printed transistors |
Mar. 28, 2006 |
| 7015501 |
Substrate and organic electroluminescence device using the substrate |
Mar. 21, 2006 |
| 6979882 |
Electronic device and method for manufacturing the same |
Dec. 27, 2005 |
| 6979888 |
LOC semiconductor assembled with room temperature adhesive |
Dec. 27, 2005 |
| 6965158 |
Multi-layer substrates and fabrication processes |
Nov. 15, 2005 |
| 6943388 |
Sheet-type .beta.-FeSi.sub.2 element, and method and device for manufacturing the same |
Sep. 13, 2005 |
| 6888224 |
Methods and systems for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials |
May. 3, 2005 |
| 6879020 |
Semiconductor device |
Apr. 12, 2005 |
| 6864192 |
Langmuir-blodgett chemically amplified photoresist |
Mar. 8, 2005 |
| 6864181 |
Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition |
Mar. 8, 2005 |
| 6861755 |
Semiconductor device |
Mar. 1, 2005 |
| 6849926 |
Low dielectric constant composite material containing nano magnetic particles, and optical and semiconductor devices using the low dielectric constant composite material |
Feb. 1, 2005 |
| 6849927 |
Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals |
Feb. 1, 2005 |
| 6815265 |
Method of fabricating a semiconductor device with a passivation film |
Nov. 9, 2004 |
| 6794732 |
Semiconductor device and method of manufacturing the same |
Sep. 21, 2004 |
| 6791114 |
Fused passive organic light emitting displays |
Sep. 14, 2004 |
| 6787887 |
Semiconductor device |
Sep. 7, 2004 |
| 6781216 |
Semiconductor device having wiring patterns with insulating layer |
Aug. 24, 2004 |
| 6747339 |
Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate |
Jun. 8, 2004 |
| 6747289 |
Semiconductor device and method of fabricating thereof |
Jun. 8, 2004 |
| 6727589 |
Dual damascene flowable oxide insulation structure and metallic barrier |
Apr. 27, 2004 |
| 6727515 |
Insulation film forming material, insulation film, method for forming the insulation film, and semiconductor device |
Apr. 27, 2004 |
| 6724069 |
Spin-on cap layer, and semiconductor device containing same |
Apr. 20, 2004 |
| 6667533 |
Triple damascene fuse |
Dec. 23, 2003 |
| 6657303 |
Integrated circuit with low solubility metal-conductor interconnect cap |
Dec. 2, 2003 |
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