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Class Information
Number: 257/633
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > With means to control surface effects > Insulating coating > With thermal expansion compensation (e.g., thermal expansion of glass passivant matched to that of semiconductor)
Description: Subject matter wherein the insulating coating includes means to compensate for mismatches in thermal expansion coefficient between different portions of the device, such as forming the insulating coating of a material which closely matches the thermal expansion coefficient of the underlying semiconductor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7301223 |
High temperature electronic devices |
Nov. 27, 2007 |
| 7285856 |
Package for semiconductor devices |
Oct. 23, 2007 |
| 7253514 |
Self-supporting connecting element for a semiconductor chip |
Aug. 7, 2007 |
| 7202146 |
Process for producing doped semiconductor wafers from silicon, and the wafers produced thereby |
Apr. 10, 2007 |
| 7183204 |
Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same |
Feb. 27, 2007 |
| 7075187 |
Coating material over electrodes to support organic synthesis |
Jul. 11, 2006 |
| 7038302 |
Glass substrate assembly, semiconductor device and method of heat-treating glass substrate |
May. 2, 2006 |
| 7030468 |
Low k and ultra low k SiCOH dielectric films and methods to form the same |
Apr. 18, 2006 |
| 7019343 |
SnO.sub.2 ISFET device, manufacturing method, and methods and apparatus for use thereof |
Mar. 28, 2006 |
| 7009253 |
Method and apparatus for preventing microcircuit thermo-mechanical damage during an ESD event |
Mar. 7, 2006 |
| 6987284 |
Active matrix type display device and method of manufacturing the same |
Jan. 17, 2006 |
| 6960822 |
Solder mask and structure of a substrate |
Nov. 1, 2005 |
| 6849922 |
Organic electro-luminescent display device and method of fabricating the same |
Feb. 1, 2005 |
| 6847097 |
Glass substrate assembly, semiconductor device and method of heat-treating glass substrate |
Jan. 25, 2005 |
| 6828579 |
Thermoelectric device with Si/SiC superlattice N-legs |
Dec. 7, 2004 |
| 6812550 |
Wafer pattern variation of integrated circuit fabrication |
Nov. 2, 2004 |
| 6787803 |
Test patterns for measurement of low-k dielectric cracking thresholds |
Sep. 7, 2004 |
| 6730619 |
Method of manufacturing insulating layer and semiconductor device including insulating layer |
May. 4, 2004 |
| 6713844 |
Semiconductor-chip mounting substrate having at least one projection thereon and a pressure holding means |
Mar. 30, 2004 |
| 6653660 |
Vertical cavity-type semiconductor light-emitting device and optical module using vertical cavity-type semiconductor light-emitting device |
Nov. 25, 2003 |
| 6639321 |
Balanced coefficient of thermal expansion for flip chip ball grid array |
Oct. 28, 2003 |
| 6559519 |
Integrated circuit device having cyanate ester buffer coat and method of fabricating same |
May. 6, 2003 |
| 6521991 |
Thermoelectric module |
Feb. 18, 2003 |
| 6426545 |
Integrated circuit structures and methods employing a low modulus high elongation photodielectric |
Jul. 30, 2002 |
| 6313517 |
Vertically integrated semiconductor component |
Nov. 6, 2001 |
| 6268631 |
Glass substrate assembly, semiconductor device and method of heat-treating glass substrate |
Jul. 31, 2001 |
| 6144931 |
Wafer expansion-and-contraction simulating method |
Nov. 7, 2000 |
| 6144050 |
Electronic devices with strontium barrier film and process for making same |
Nov. 7, 2000 |
| 6127629 |
Hermetically sealed microelectronic device and method of forming same |
Oct. 3, 2000 |
| 6117765 |
Method of preventing cracks in insulating spaces between metal wiring patterns |
Sep. 12, 2000 |
| 6069400 |
Semiconductor device and method of fabricating the same |
May. 30, 2000 |
| 6046503 |
Metalization system having an enhanced thermal conductivity |
Apr. 4, 2000 |
| 5950067 |
Method of fabricating a thermoelectric module |
Sep. 7, 1999 |
| 5917231 |
Semiconductor device including an insulative layer having a gap |
Jun. 29, 1999 |
| 5760466 |
Semiconductor device having improved heat resistance |
Jun. 2, 1998 |
| 5712506 |
Semiconductor device with passivation layer of benzocyclobutene polymer and silicon powder |
Jan. 27, 1998 |
| 5640045 |
Thermal stress minimization in power semiconductor devices |
Jun. 17, 1997 |
| 5448096 |
Semiconductor device with reduced stress applied to gate electrode |
Sep. 5, 1995 |
| 5402005 |
Semiconductor device having a multilayered wiring structure |
Mar. 28, 1995 |
| 5378905 |
Ferroelectric field effect transistor with fluoride buffer and IV-VI ferroelectric |
Jan. 3, 1995 |
| 5341015 |
Semiconductor device with reduced stress on gate electrode |
Aug. 23, 1994 |
| 5198884 |
Semiconductor devices having a double-layer interconnection structure |
Mar. 30, 1993 |
| 5160998 |
Semiconductor device and method of manufacturing the same |
Nov. 3, 1992 |
| 4996586 |
Crimp-type semiconductor device having non-alloy structure |
Feb. 26, 1991 |
| 4989063 |
Hybrid wafer scale microcircuit integration |
Jan. 29, 1991 |
| 4982269 |
Blanar-type microwave integrated circuit with at least one mesa component, method of fabrication thereof |
Jan. 1, 1991 |
| 4972251 |
Multilayer glass passivation structure and method for forming the same |
Nov. 20, 1990 |
| 4486945 |
Method of manufacturing semiconductor device with plated bump |
Dec. 11, 1984 |
| 4224636 |
Semiconductor device with thermally compensating SiO.sub.2 -silicate glass-SiC passivation layer |
Sep. 23, 1980 |
| 4216491 |
Semiconductor integrated circuit isolated through dielectric material |
Aug. 5, 1980 |
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