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Class Information
Number: 257/626
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > Mesa structure (e.g., including undercut or stepped mesa configuration or having constant slope taper) > Combined with passivating coating
Description: Subject matter wherein there is a surface protectant or passivating coating on the surface of the mesa physical configuration.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7432582 |
Method of forming a through-substrate interconnect |
Oct. 7, 2008 |
| 7423291 |
Semiconductor device and electronic device |
Sep. 9, 2008 |
| 7345368 |
Semiconductor device and the manufacturing method for the same |
Mar. 18, 2008 |
| 7245002 |
Semiconductor substrate having a stepped profile |
Jul. 17, 2007 |
| 7193301 |
Semiconductor device and manufacturing method thereof |
Mar. 20, 2007 |
| 7187058 |
Semiconductor component having a pn junction and a passivation layer applied on a surface |
Mar. 6, 2007 |
| 7166861 |
Thin-film transistor and method for manufacturing the same |
Jan. 23, 2007 |
| 7112545 |
Passivation of material using ultra-fast pulsed laser |
Sep. 26, 2006 |
| 7054469 |
Passivation layer structure |
May. 30, 2006 |
| 6992325 |
Active matrix organic electroluminescence display device |
Jan. 31, 2006 |
| 6972477 |
Circuit device with conductive patterns separated by insulating resin-filled grooves |
Dec. 6, 2005 |
| 6936868 |
Sequential mesa avalanche photodiode capable of realizing high sensitization and method of manufacturing the same |
Aug. 30, 2005 |
| 6924197 |
Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source |
Aug. 2, 2005 |
| 6921937 |
Integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source |
Jul. 26, 2005 |
| 6906401 |
Method to fabricate high-performance NPN transistors in a BiCMOS process |
Jun. 14, 2005 |
| 6900523 |
Termination structure for MOSgated power devices |
May. 31, 2005 |
| 6888171 |
Light emitting diode |
May. 3, 2005 |
| 6883159 |
Patterning semiconductor layers using phase shifting and assist features |
Apr. 19, 2005 |
| 6882031 |
Ammonia gas passivation on nitride encapsulated devices |
Apr. 19, 2005 |
| 6879020 |
Semiconductor device |
Apr. 12, 2005 |
| 6876062 |
Seal ring and die corner stress relief pattern design to protect against moisture and metallic impurities |
Apr. 5, 2005 |
| 6828220 |
Flip chip-in-leadframe package and process |
Dec. 7, 2004 |
| 6825501 |
Robust Group III light emitting diode for high reliability in standard packaging applications |
Nov. 30, 2004 |
| 6825547 |
Semiconductor device including edge bond pads |
Nov. 30, 2004 |
| 6815805 |
Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source |
Nov. 9, 2004 |
| 6803656 |
Semiconductor device including combed bond pad opening |
Oct. 12, 2004 |
| 6797991 |
Nitride semiconductor device |
Sep. 28, 2004 |
| 6696705 |
Power semiconductor component having a mesa edge termination |
Feb. 24, 2004 |
| 6661080 |
Structure for backside saw cavity protection |
Dec. 9, 2003 |
| 6653663 |
Nitride semiconductor device |
Nov. 25, 2003 |
| 6635952 |
Semiconductor device |
Oct. 21, 2003 |
| 6621147 |
In-process device with grooved coating layer on a semiconductor wafer for relieving surface tension |
Sep. 16, 2003 |
| 6611012 |
Semiconductor device |
Aug. 26, 2003 |
| 6580153 |
Structure for protecting a micromachine with a cavity in a UV tape |
Jun. 17, 2003 |
| 6566736 |
Die seal for semiconductor device moisture protection |
May. 20, 2003 |
| 6555895 |
Devices and methods for addressing optical edge effects in connection with etched trenches |
Apr. 29, 2003 |
| 6448629 |
Semiconductor device and method of making same |
Sep. 10, 2002 |
| 6429042 |
Method of reducing shear stresses on IC chips and structure formed thereby |
Aug. 6, 2002 |
| 6426546 |
Reducing relative stress between HDP layer and passivation layer |
Jul. 30, 2002 |
| 6414374 |
Semiconductor device including edge bond pads and methods |
Jul. 2, 2002 |
| 6335561 |
Semiconductor device having a passivation film |
Jan. 1, 2002 |
| 6268642 |
Wafer level package |
Jul. 31, 2001 |
| 6268655 |
Semiconductor device including edge bond pads and methods |
Jul. 31, 2001 |
| 6229192 |
Image sensor or LCD including switching pin diodes |
May. 8, 2001 |
| 6222255 |
Method of creating an interconnect in a substrate and semiconductor device employing the same |
Apr. 24, 2001 |
| 6184584 |
Miniaturized contact in semiconductor substrate and method for forming the same |
Feb. 6, 2001 |
| 6147349 |
Method for fabricating a self-focusing detector pixel and an array fabricated in accordance with the method |
Nov. 14, 2000 |
| 6107657 |
Semiconductor device having capacitor and manufacturing method thereof |
Aug. 22, 2000 |
| 6108210 |
Flip chip devices with flexible conductive adhesive |
Aug. 22, 2000 |
| 6100577 |
Contact process using Y-contact etching |
Aug. 8, 2000 |
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