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Class Information
Number: 257/625
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > Mesa structure (e.g., including undercut or stepped mesa configuration or having constant slope taper) > Semiconductor body including mesa is intimately bonded to thick electrical and/or thermal conductor member of larger lateral extent than semiconductor body (e.g., "plated heat sink" microwave diode)
Description: Subject matter wherein the mesa semiconductor body is intimately bonded (e.g., by electroplating the semiconductor with a thick metal layer) to a thick electrical and/or thermal conductor member of larger lateral extent than the semiconductor body.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7400029 |
LED illumination system |
Jul. 15, 2008 |
| 7368801 |
Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same |
May. 6, 2008 |
| 7321161 |
LED package assembly with datum reference feature |
Jan. 22, 2008 |
| 7288438 |
Solder deposition on wafer backside for thin-die thermal interface material |
Oct. 30, 2007 |
| 7288828 |
Metal oxide semiconductor transistor device |
Oct. 30, 2007 |
| 7235875 |
Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module |
Jun. 26, 2007 |
| 7211891 |
Electronic heat pump device, laser component, optical pickup and electronic equipment |
May. 1, 2007 |
| 7196403 |
Semiconductor package with heat spreader |
Mar. 27, 2007 |
| 7166914 |
Semiconductor package with heat sink |
Jan. 23, 2007 |
| 7091603 |
Semiconductor device |
Aug. 15, 2006 |
| 7091602 |
Miniature moldlocks for heatsink or flag for an overmolded plastic package |
Aug. 15, 2006 |
| 7084495 |
Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
Aug. 1, 2006 |
| 7067903 |
Heat spreader and semiconductor device and package using the same |
Jun. 27, 2006 |
| 7057298 |
Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
Jun. 6, 2006 |
| 7053426 |
Semiconductor device with heat sink |
May. 30, 2006 |
| 7015073 |
Method of forming heat spreader with down set leg attachment feature |
Mar. 21, 2006 |
| 7002247 |
Thermal interposer for thermal management of semiconductor devices |
Feb. 21, 2006 |
| 6995467 |
Semiconductor component |
Feb. 7, 2006 |
| 6977424 |
Electrically pumped semiconductor active region with a backward diode, for enhancing optical signals |
Dec. 20, 2005 |
| 6946686 |
Method of fabricating semiconductor device and semiconductor device |
Sep. 20, 2005 |
| 6940720 |
Integrated circuit having a thermally shielded electric resistor trace |
Sep. 6, 2005 |
| 6936868 |
Sequential mesa avalanche photodiode capable of realizing high sensitization and method of manufacturing the same |
Aug. 30, 2005 |
| 6919630 |
Semiconductor package with heat spreader |
Jul. 19, 2005 |
| 6888178 |
Method and system for magnetically assisted statistical assembly of wafers |
May. 3, 2005 |
| 6876061 |
Chip scale surface mount package for semiconductor device and process of fabricating the same |
Apr. 5, 2005 |
| 6861730 |
Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
Mar. 1, 2005 |
| 6844214 |
Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication |
Jan. 18, 2005 |
| 6831351 |
Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
Dec. 14, 2004 |
| 6797991 |
Nitride semiconductor device |
Sep. 28, 2004 |
| 6756669 |
Heat spreader with down set leg attachment feature |
Jun. 29, 2004 |
| 6730990 |
Mountable microstructure and optical transmission apparatus |
May. 4, 2004 |
| 6730936 |
Light-emitting diode array |
May. 4, 2004 |
| 6730991 |
Integrated circuit chip package |
May. 4, 2004 |
| 6727524 |
P-n junction structure |
Apr. 27, 2004 |
| 6717261 |
Integrated semiconductor circuit |
Apr. 6, 2004 |
| 6713937 |
Minitab rectifier for alternators |
Mar. 30, 2004 |
| 6707160 |
Semiconductor device using substrate having cubic structure and method of manufacturing the same |
Mar. 16, 2004 |
| 6667548 |
Diamond heat spreading and cooling technique for integrated circuits |
Dec. 23, 2003 |
| 6653663 |
Nitride semiconductor device |
Nov. 25, 2003 |
| 6646340 |
Thermally coupling electrically decoupling cooling device for integrated circuits |
Nov. 11, 2003 |
| 6642601 |
Low current substantially silicide fuse for integrated circuits |
Nov. 4, 2003 |
| 6627975 |
Minitab rectifying diode package with two different types of diodes for alternators |
Sep. 30, 2003 |
| 6621159 |
Semiconductor light emitting device and method for manufacturing the same |
Sep. 16, 2003 |
| 6614107 |
Thin-film heat sink and method of manufacturing same |
Sep. 2, 2003 |
| 6566743 |
Electronics package with specific areas having low coefficient of thermal expansion |
May. 20, 2003 |
| 6552436 |
Semiconductor device having a ball grid array and method therefor |
Apr. 22, 2003 |
| 6525419 |
Thermally coupling electrically decoupling cooling device for integrated circuits |
Feb. 25, 2003 |
| 6518589 |
Dual mode FET & logic circuit having negative differential resistance mode |
Feb. 11, 2003 |
| 6518637 |
Cubic (zinc-blende) aluminum nitride |
Feb. 11, 2003 |
| 6501153 |
Semiconductor device and drive circuit using the semiconductor devices |
Dec. 31, 2002 |
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