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Class Information
Number: 257/625
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > Mesa structure (e.g., including undercut or stepped mesa configuration or having constant slope taper) > Semiconductor body including mesa is intimately bonded to thick electrical and/or thermal conductor member of larger lateral extent than semiconductor body (e.g., "plated heat sink" microwave diode)
Description: Subject matter wherein the mesa semiconductor body is intimately bonded (e.g., by electroplating the semiconductor with a thick metal layer) to a thick electrical and/or thermal conductor member of larger lateral extent than the semiconductor body.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8618585 Semiconductor apparatus including cooling base with projections Dec. 31, 2013
8581385 Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same Nov. 12, 2013
8547465 Imaging device module Oct. 1, 2013
8476656 Light-emitting diode Jul. 2, 2013
8466486 Thermal management system for multiple heat source devices Jun. 18, 2013
8426945 Semiconductor device, method for manufacturing semiconductor device, and electronic appliance Apr. 23, 2013
8367521 Manufacture of thin silicon-on-insulator (SOI) structures Feb. 5, 2013
8299630 Microstructure with reactive bonding Oct. 30, 2012
8288843 Semiconductor light-emitting device and method for manufacturing same Oct. 16, 2012
8247905 Formation of vertical devices by electroplating Aug. 21, 2012
8217423 Structure and method for mobility enhanced MOSFETs with unalloyed silicide Jul. 10, 2012
8193553 Semiconductor high-power light-emitting module with heat isolation Jun. 5, 2012
8193070 Method for bonding layers, corresponding device and organic light-emitting diode Jun. 5, 2012
8174094 Bonded structures formed by plasma enhanced bonding May. 8, 2012
8106486 Electronic apparatus with an electrical conductor in the form of a liquid and an electrical insulator with a light-curing property Jan. 31, 2012
8058736 Semiconductor device having heat spreader with center opening Nov. 15, 2011
8017450 Method of forming assymetrical encapsulant bead Sep. 13, 2011
7989839 Method and apparatus for using light emitting diodes Aug. 2, 2011
7982278 Thermoelectric module Jul. 19, 2011
7952173 Nanometric device with a hosting structure of nanometric elements May. 31, 2011
7936049 Nitride semiconductor device and manufacturing method thereof May. 3, 2011
7902639 Printable electric circuits, electronic components and method of forming the same Mar. 8, 2011
7893432 Thermal interface Feb. 22, 2011
7863641 Method and apparatus for using light emitting diodes for the treatment of biological tissue Jan. 4, 2011
7839908 Mode control waveguide laser device Nov. 23, 2010
7834433 Semiconductor power device Nov. 16, 2010
7834434 LED illumination system Nov. 16, 2010
7786606 Resin-sealed electronic device and method of manufacturing the same Aug. 31, 2010
7777305 Nitride semiconductor device and manufacturing method thereof Aug. 17, 2010
7759761 Semiconductor wafer substrate for power semiconductor components and method for producing the same Jul. 20, 2010
7750442 High-frequency switch Jul. 6, 2010
7701055 Light emitter assembly Apr. 20, 2010
7675143 Semiconductor element, semiconductor device and mounting board Mar. 9, 2010
7671377 Silicon based light emitting diode Mar. 2, 2010
7612370 Thermal interface Nov. 3, 2009
7611927 Method of minimizing kerf width on a semiconductor substrate panel Nov. 3, 2009
7608538 Formation of vertical devices by electroplating Oct. 27, 2009
7535100 Wafer bonding of thinned electronic materials and circuits to high performance substrates May. 19, 2009
7535060 Charge storage structure formation in transistor with vertical channel region May. 19, 2009
7495276 Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement Feb. 24, 2009
7476967 Composite carbon nanotube thermal interface device Jan. 13, 2009
7400029 LED illumination system Jul. 15, 2008
7368801 Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same May. 6, 2008
7321161 LED package assembly with datum reference feature Jan. 22, 2008
7288438 Solder deposition on wafer backside for thin-die thermal interface material Oct. 30, 2007
7288828 Metal oxide semiconductor transistor device Oct. 30, 2007
7235875 Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module Jun. 26, 2007
7211891 Electronic heat pump device, laser component, optical pickup and electronic equipment May. 1, 2007
7196403 Semiconductor package with heat spreader Mar. 27, 2007
7166914 Semiconductor package with heat sink Jan. 23, 2007

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