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Class Information
Number: 257/622
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > Groove
Description: Subject matter in which there is a physical groove in a surface of the semiconductor device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459793 |
Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device |
Dec. 2, 2008 |
| 7449766 |
Methods of forming a contact opening in a semiconductor assembly using a disposable hard mask |
Nov. 11, 2008 |
| 7439578 |
Semiconductor device |
Oct. 21, 2008 |
| 7436009 |
Via structures and trench structures and dual damascene structures |
Oct. 14, 2008 |
| 7436035 |
Method of fabricating a field effect transistor structure with abrupt source/drain junctions |
Oct. 14, 2008 |
| 7432148 |
Shallow trench isolation by atomic-level silicon reconstruction |
Oct. 7, 2008 |
| 7429752 |
Method and structure for forming strained SI for CMOS devices |
Sep. 30, 2008 |
| 7411269 |
Isolation structure configurations for modifying stresses in semiconductor devices |
Aug. 12, 2008 |
| 7405138 |
Manufacturing method of stack-type semiconductor device |
Jul. 29, 2008 |
| 7402867 |
Semiconductor device |
Jul. 22, 2008 |
| 7397126 |
Semiconductor device |
Jul. 8, 2008 |
| 7391087 |
MOS transistor structure and method of fabrication |
Jun. 24, 2008 |
| 7387951 |
Method of dicing semiconductor wafer into chips, and apparatus using this method |
Jun. 17, 2008 |
| 7378744 |
Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistance |
May. 27, 2008 |
| 7368385 |
Method for producing a structure on the surface of a substrate |
May. 6, 2008 |
| 7365413 |
Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern |
Apr. 29, 2008 |
| 7365437 |
Method of wet etching vias and articles formed thereby |
Apr. 29, 2008 |
| 7361972 |
Chip packaging structure for improving reliability |
Apr. 22, 2008 |
| 7358587 |
Semiconductor structures |
Apr. 15, 2008 |
| 7358612 |
Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistance |
Apr. 15, 2008 |
| 7355244 |
Electrical devices with multi-walled recesses |
Apr. 8, 2008 |
| 7352052 |
Semiconductor device and manufacturing method therefor |
Apr. 1, 2008 |
| 7348634 |
Shallow trench isolation formation |
Mar. 25, 2008 |
| 7345353 |
Silicon carrier having increased flexibility |
Mar. 18, 2008 |
| 7335968 |
High permeability composite films to reduce noise in high speed interconnects |
Feb. 26, 2008 |
| 7332428 |
Metal interconnect structure and method |
Feb. 19, 2008 |
| 7332772 |
Semiconductor device having a recessed gate and asymmetric dopant regions and method of manufacturing the same |
Feb. 19, 2008 |
| 7326981 |
Methods and apparatuses for producing a polymer memory device |
Feb. 5, 2008 |
| 7327009 |
Selective nitride liner formation for shallow trench isolation |
Feb. 5, 2008 |
| 7323746 |
Recess gate-type semiconductor device and method of manufacturing the same |
Jan. 29, 2008 |
| 7321159 |
Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs |
Jan. 22, 2008 |
| 7304325 |
Group III nitride compound semiconductor light-emitting device |
Dec. 4, 2007 |
| 7301222 |
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages |
Nov. 27, 2007 |
| 7288783 |
Optical semiconductor device and method for fabricating the same |
Oct. 30, 2007 |
| 7288821 |
Structure and method of three dimensional hybrid orientation technology |
Oct. 30, 2007 |
| 7282104 |
Method of fixing a sealing object to a base object |
Oct. 16, 2007 |
| 7279774 |
Bulk substrates in FinFETs with trench insulation surrounding FIN pairs having FINs separated by recess hole shallower than trench |
Oct. 9, 2007 |
| 7262491 |
Die pad for semiconductor packages and methods of making and using same |
Aug. 28, 2007 |
| 7256475 |
On-chip test circuit for assessing chip integrity |
Aug. 14, 2007 |
| 7253500 |
Semiconductor wafer and a method for manufacturing a semiconductor wafer |
Aug. 7, 2007 |
| 7233028 |
Gallium nitride material devices and methods of forming the same |
Jun. 19, 2007 |
| 7230315 |
Integrated chemical microreactor with large area channels and manufacturing process thereof |
Jun. 12, 2007 |
| 7227242 |
Structure and method for enhanced performance in semiconductor substrates |
Jun. 5, 2007 |
| 7224043 |
Semiconductor element with improved adhesion characteristics of the non-metallic surfaces |
May. 29, 2007 |
| 7199016 |
Integrated circuit resistor |
Apr. 3, 2007 |
| 7199448 |
Integrated circuit configuration comprising a sheet-like substrate |
Apr. 3, 2007 |
| 7199450 |
Materials and method to seal vias in silicon substrates |
Apr. 3, 2007 |
| 7193301 |
Semiconductor device and manufacturing method thereof |
Mar. 20, 2007 |
| 7190050 |
Integrated circuit on corrugated substrate |
Mar. 13, 2007 |
| 7166861 |
Thin-film transistor and method for manufacturing the same |
Jan. 23, 2007 |
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