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Browse by Category: Main > Physics
Class Information
Number: 257/622
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > Groove
Description: Subject matter in which there is a physical groove in a surface of the semiconductor device.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Patent Number Title Of Patent Date Issued
8692357 Semiconductor wafer and processing method therefor Apr. 8, 2014
8686435 Silicon carbide semiconductor device Apr. 1, 2014
8673748 Method for fabricating semiconductor thin film using substrate irradiated with focused light, apparatus for fabricating semiconductor thin film using substrate irradiated with focused light, m Mar. 18, 2014
8664117 Method for manufacturing semiconductor device using anisotropic etching Mar. 4, 2014
8664747 Trenched substrate for crystal growth and wafer bonding Mar. 4, 2014
8653630 Layout for multiple-Fin SRAM cell Feb. 18, 2014
8647961 Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches Feb. 11, 2014
8648445 Metal-oxide-semiconductor device having trenched diffusion region and method of forming same Feb. 11, 2014
8633594 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8633595 Semiconductor device having groove-shaped via-hole Jan. 21, 2014
8629533 Pillars for vertical transistors Jan. 14, 2014
8629532 Semiconductor wafer with assisting dicing structure and dicing method thereof Jan. 14, 2014
8624358 Semiconductor substrate and semiconductor device Jan. 7, 2014
8624361 Self-formation of high-density defect-free and aligned nanostructures Jan. 7, 2014
8617968 Strained silicon and strained silicon germanium on insulator metal oxide semiconductor field effect transistors (MOSFETs) Dec. 31, 2013
8618650 Flange package for a semiconductor device Dec. 31, 2013
8614149 Critical dimension reduction and roughness control Dec. 24, 2013
8598689 Methods of manufacturing semiconductor structures and devices including nanotubes, and semiconductor structures, devices, and systems fabricated using such methods Dec. 3, 2013
8598688 Semiconductor device Dec. 3, 2013
8598683 Semiconductor structure having varactor with parallel DC path adjacent thereto Dec. 3, 2013
8598000 Two step poly etch LDMOS gate formation Dec. 3, 2013
8592955 Accurate deposition of nano-objects on a surface Nov. 26, 2013
8592811 Active matrix substrate and display panel Nov. 26, 2013
8581263 Laser-induced flaw formation in nitride semiconductors Nov. 12, 2013
8575726 Semiconductor device and method of manufacturing the same Nov. 5, 2013
8575727 Gate structures Nov. 5, 2013
8563361 Packaging method of molded wafer level chip scale package (WLCSP) Oct. 22, 2013
8564103 Method of manufacturing an electronic device Oct. 22, 2013
8558344 Small size and fully integrated power converter with magnetics on chip Oct. 15, 2013
8531007 Semiconductor device and the method for manufacturing the same Sep. 10, 2013
8519416 Method of fabricating nitride-based semiconductor light-emitting device and nitride-based semiconductor light-emitting device Aug. 27, 2013
8513089 Discontinuous thin semiconductor wafer surface features Aug. 20, 2013
8502249 Semiconductor light-emitting device having groove in P-type semiconductor layer and method for manufacturing the same Aug. 6, 2013
8497528 Method for fabricating a strained structure Jul. 30, 2013
8482137 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its Jul. 9, 2013
8482105 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same Jul. 9, 2013
8476734 Semiconductor component and methods for producing a semiconductor component Jul. 2, 2013
8476738 Electronic package with stacked semiconductor chips Jul. 2, 2013
8471368 Polysilicon control etch back indicator Jun. 25, 2013
RE44292 Method of etching silicon nitride by a mixture of CH.sub.2F.sub.2, CH.sub.3F or CHF.sub.3 and an inert gas Jun. 11, 2013
8455926 Systems, methods, and apparatus of a low conductance silicon micro-leak for mass spectrometer inlet Jun. 4, 2013
8455301 Method of fabricating stacked chips in a semiconductor package Jun. 4, 2013
8445994 Discontinuous thin semiconductor wafer surface features May. 21, 2013
8445995 Semiconductor structure with conductive plug in an oxide layer May. 21, 2013
8441107 Gate structures May. 14, 2013
8426949 Mesa type semiconductor device Apr. 23, 2013
8426948 Laminated semiconductor wafer, laminated chip package and method of manufacturing the same Apr. 23, 2013
8426947 Laminated semiconductor wafer, laminated chip package and method of manufacturing the same Apr. 23, 2013
8426945 Semiconductor device, method for manufacturing semiconductor device, and electronic appliance Apr. 23, 2013
8421194 Sub-lithographic printing method Apr. 16, 2013

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