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Class Information
Number: 257/621
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > With electrical contact in hole in semiconductor (e.g., lead extends through semiconductor body)
Description: Subject matter wherein the physical configuration is a hole in the semiconductor through which an electrical contact extends.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619282 |
Hybrid circuit and electronic device using same |
Nov. 17, 2009 |
| 7616167 |
Semiconductor device and method of producing the same |
Nov. 10, 2009 |
| 7602047 |
Semiconductor device having through vias |
Oct. 13, 2009 |
| 7592703 |
RF and MMIC stackable micro-modules |
Sep. 22, 2009 |
| 7579671 |
Semiconductor device and manufacturing method thereof |
Aug. 25, 2009 |
| 7576413 |
Packaged stacked semiconductor device and method for manufacturing the same |
Aug. 18, 2009 |
| 7566968 |
Biosensor with smart card configuration |
Jul. 28, 2009 |
| 7566656 |
Method and apparatus for providing void structures |
Jul. 28, 2009 |
| 7564115 |
Tapered through-silicon via structure |
Jul. 21, 2009 |
| 7564118 |
Chip and wafer integration process using vertical connections |
Jul. 21, 2009 |
| 7560802 |
Electrical connections in substrates |
Jul. 14, 2009 |
| 7557017 |
Method of manufacturing semiconductor device with two-step etching of layer |
Jul. 7, 2009 |
| 7547958 |
Semiconductor device, electronic device, and manufacturing method of the same |
Jun. 16, 2009 |
| 7547630 |
Method for stacking semiconductor chips |
Jun. 16, 2009 |
| 7547929 |
Semiconductor HBT MMIC device and semiconductor module |
Jun. 16, 2009 |
| 7545045 |
Dummy via for reducing proximity effect and method of using the same |
Jun. 9, 2009 |
| 7534722 |
Back-to-front via process |
May. 19, 2009 |
| 7531455 |
Method for forming storage node contact in semiconductor device using nitride-based hard mask |
May. 12, 2009 |
| 7531890 |
Multi-chip package (MCP) with a conductive bar and method for manufacturing the same |
May. 12, 2009 |
| 7524753 |
Semiconductor device having through electrode and method of manufacturing the same |
Apr. 28, 2009 |
| 7521807 |
Semiconductor device with inclined through holes |
Apr. 21, 2009 |
| 7511359 |
Dual die package with high-speed interconnect |
Mar. 31, 2009 |
| 7498661 |
Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus |
Mar. 3, 2009 |
| 7495316 |
Methods of forming conductive vias and methods of forming multichip modules including such conductive vias |
Feb. 24, 2009 |
| 7491582 |
Method for manufacturing semiconductor device and semiconductor device |
Feb. 17, 2009 |
| 7485948 |
Front-end processing of nickel plated bond pads |
Feb. 3, 2009 |
| 7473616 |
Method and system for wafer bonding of structured substrates for electro-mechanical devices |
Jan. 6, 2009 |
| 7473984 |
Method for fabricating a metal-insulator-metal capacitor |
Jan. 6, 2009 |
| 7456098 |
Building metal pillars in a chip for structure support |
Nov. 25, 2008 |
| 7452751 |
Semiconductor device and method of manufacturing the same |
Nov. 18, 2008 |
| 7446418 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 4, 2008 |
| 7446424 |
Interconnect structure for semiconductor package |
Nov. 4, 2008 |
| 7443030 |
Thin silicon based substrate |
Oct. 28, 2008 |
| 7436068 |
Components for film forming device |
Oct. 14, 2008 |
| 7429762 |
Semiconductor device and method of fabricating the same |
Sep. 30, 2008 |
| 7420262 |
Electronic component and semiconductor wafer, and method for producing the same |
Sep. 2, 2008 |
| 7416963 |
Manufacturing method of semiconductor device |
Aug. 26, 2008 |
| 7413925 |
Method for fabricating semiconductor package |
Aug. 19, 2008 |
| 7408249 |
Packaged integrated circuits and methods of producing thereof |
Aug. 5, 2008 |
| 7393770 |
Backside method for fabricating semiconductor components with conductive interconnects |
Jul. 1, 2008 |
| 7391107 |
Signal routing on redistribution layer |
Jun. 24, 2008 |
| 7388277 |
Chip and wafer integration process using vertical connections |
Jun. 17, 2008 |
| 7387958 |
MMIC having back-side multi-layer signal routing |
Jun. 17, 2008 |
| 7381627 |
Dual wired integrated circuit chips |
Jun. 3, 2008 |
| 7371602 |
Semiconductor package structure and method for manufacturing the same |
May. 13, 2008 |
| 7365413 |
Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern |
Apr. 29, 2008 |
| 7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
Apr. 15, 2008 |
| 7358616 |
Semiconductor stacked die/wafer configuration and packaging and method thereof |
Apr. 15, 2008 |
| 7355267 |
Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements |
Apr. 8, 2008 |
| 7341938 |
Single mask via method and device |
Mar. 11, 2008 |
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