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Class Information
Number: 257/621
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > With electrical contact in hole in semiconductor (e.g., lead extends through semiconductor body)
Description: Subject matter wherein the physical configuration is a hole in the semiconductor through which an electrical contact extends.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456098 |
Building metal pillars in a chip for structure support |
Nov. 25, 2008 |
| 7452751 |
Semiconductor device and method of manufacturing the same |
Nov. 18, 2008 |
| 7446418 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 4, 2008 |
| 7446424 |
Interconnect structure for semiconductor package |
Nov. 4, 2008 |
| 7443030 |
Thin silicon based substrate |
Oct. 28, 2008 |
| 7436068 |
Components for film forming device |
Oct. 14, 2008 |
| 7429762 |
Semiconductor device and method of fabricating the same |
Sep. 30, 2008 |
| 7420262 |
Electronic component and semiconductor wafer, and method for producing the same |
Sep. 2, 2008 |
| 7416963 |
Manufacturing method of semiconductor device |
Aug. 26, 2008 |
| 7413925 |
Method for fabricating semiconductor package |
Aug. 19, 2008 |
| 7408249 |
Packaged integrated circuits and methods of producing thereof |
Aug. 5, 2008 |
| 7393770 |
Backside method for fabricating semiconductor components with conductive interconnects |
Jul. 1, 2008 |
| 7391107 |
Signal routing on redistribution layer |
Jun. 24, 2008 |
| 7388277 |
Chip and wafer integration process using vertical connections |
Jun. 17, 2008 |
| 7387958 |
MMIC having back-side multi-layer signal routing |
Jun. 17, 2008 |
| 7381627 |
Dual wired integrated circuit chips |
Jun. 3, 2008 |
| 7371602 |
Semiconductor package structure and method for manufacturing the same |
May. 13, 2008 |
| 7365413 |
Reduced power distribution mesh resistance using a modified swiss-cheese slotting pattern |
Apr. 29, 2008 |
| 7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
Apr. 15, 2008 |
| 7358616 |
Semiconductor stacked die/wafer configuration and packaging and method thereof |
Apr. 15, 2008 |
| 7355267 |
Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements |
Apr. 8, 2008 |
| 7341938 |
Single mask via method and device |
Mar. 11, 2008 |
| 7329943 |
Microelectronic devices and methods for forming interconnects in microelectronic devices |
Feb. 12, 2008 |
| 7327022 |
Assembly, contact and coupling interconnection for optoelectronics |
Feb. 5, 2008 |
| 7312521 |
Semiconductor device with holding member |
Dec. 25, 2007 |
| 7300857 |
Through-wafer interconnects for photoimager and memory wafers |
Nov. 27, 2007 |
| 7294907 |
Solid-state imaging device and method for manufacturing the same |
Nov. 13, 2007 |
| 7291899 |
Power semiconductor component |
Nov. 6, 2007 |
| 7285477 |
Dual wired integrated circuit chips |
Oct. 23, 2007 |
| 7282784 |
Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures |
Oct. 16, 2007 |
| 7279776 |
Method of manufacturing semiconductor device and semiconductor device |
Oct. 9, 2007 |
| 7276780 |
Semiconductor device and chip-stack semiconductor device |
Oct. 2, 2007 |
| 7273810 |
Semiconductor apparatus and method of fabricating the same |
Sep. 25, 2007 |
| 7271466 |
Semiconductor device with sidewall wiring |
Sep. 18, 2007 |
| 7271472 |
Circuit board and method for producing a circuit board |
Sep. 18, 2007 |
| 7262486 |
SOI substrate and method for manufacturing the same |
Aug. 28, 2007 |
| 7245001 |
Multi-layer integrated circuit package |
Jul. 17, 2007 |
| 7230318 |
RF and MMIC stackable micro-modules |
Jun. 12, 2007 |
| 7221051 |
Semiconductor device, module for optical devices, and manufacturing method of semiconductor device |
May. 22, 2007 |
| 7217988 |
Bipolar transistor with isolation and direct contacts |
May. 15, 2007 |
| 7211510 |
Stacking circuit elements |
May. 1, 2007 |
| 7208415 |
Plasma treatment method for electromigration reduction |
Apr. 24, 2007 |
| 7205638 |
Silicon building blocks in integrated circuit packaging |
Apr. 17, 2007 |
| 7202140 |
Method to fabricate Ge and Si devices together for performance enhancement |
Apr. 10, 2007 |
| 7202158 |
Method for fabricating a metal-insulator-metal capacitor |
Apr. 10, 2007 |
| 7193301 |
Semiconductor device and manufacturing method thereof |
Mar. 20, 2007 |
| 7193297 |
Semiconductor device, method for manufacturing the same, circuit substrate and electronic device |
Mar. 20, 2007 |
| 7192864 |
Method of forming interconnection lines for semiconductor device |
Mar. 20, 2007 |
| 7190078 |
Interlocking via for package via integrity |
Mar. 13, 2007 |
| 7176556 |
Semiconductor system-in-package |
Feb. 13, 2007 |
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