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Browse by Category: Main > Physics
Class Information
Number: 257/621
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > With electrical contact in hole in semiconductor (e.g., lead extends through semiconductor body)
Description: Subject matter wherein the physical configuration is a hole in the semiconductor through which an electrical contact extends.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8710629 Apparatus and method for controlling semiconductor die warpage Apr. 29, 2014
8710648 Wafer level packaging structure with large contact area and preparation method thereof Apr. 29, 2014
8710676 Stacked structure and stacked method for three-dimensional chip Apr. 29, 2014
8709945 Area efficient through-hole connections Apr. 29, 2014
8704364 Reducing stress in multi-die integrated circuit structures Apr. 22, 2014
8703610 Semiconductor device and method of forming conductive TSV with insulating annular ring Apr. 22, 2014
8704339 Semiconductor device Apr. 22, 2014
8704355 Semiconductor device comprising through-electrode interconnect Apr. 22, 2014
8692359 Through silicon via structure having protection ring Apr. 8, 2014
8692358 Image sensor chip package and method for forming the same Apr. 8, 2014
8691693 Methods of manufacturing semiconductor device Apr. 8, 2014
8686565 Stacked chip assembly having vertical vias Apr. 1, 2014
8686568 Semiconductor package substrates having layered circuit segments, and related methods Apr. 1, 2014
8679611 Edge protection seal for bonded substrates Mar. 25, 2014
8680654 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods Mar. 25, 2014
8674518 Chip package and method for forming the same Mar. 18, 2014
8674517 Method of assembling two integrated circuits and corresponding structure Mar. 18, 2014
8674515 3D integrated circuits structure Mar. 18, 2014
8674483 Methods and arrangements relating to semiconductor packages including multi-memory dies Mar. 18, 2014
8674482 Semiconductor chip with through-silicon-via and sidewall pad Mar. 18, 2014
8669642 Semiconductor chip and fabricating method thereof Mar. 11, 2014
8669643 Wiring board, semiconductor device, and method for manufacturing wiring board Mar. 11, 2014
8664772 Interface substrate with interposer Mar. 4, 2014
8658911 Through-hole-vias in multi-layer printed circuit boards Feb. 25, 2014
8659051 Semiconductor light emitting device and method for manufacturing thereof Feb. 25, 2014
8659126 Integrated circuit ground shielding structure Feb. 25, 2014
8643191 On-chip radial cavity power divider/combiner Feb. 4, 2014
8643190 Through substrate via including variable sidewall profile Feb. 4, 2014
8643149 Stress barrier structures for semiconductor chips Feb. 4, 2014
8637962 Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate Jan. 28, 2014
8633572 Low ohmic through substrate interconnection for semiconductor carriers Jan. 21, 2014
8629057 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods Jan. 14, 2014
8629060 Methods of forming through substrate interconnects Jan. 14, 2014
8629499 Vertical MOSFET device Jan. 14, 2014
8624360 Cooling channels in 3DIC stacks Jan. 7, 2014
8618648 Methods for flip chip stacking Dec. 31, 2013
8618637 Semiconductor package using through-electrodes having voids Dec. 31, 2013
8614145 Through substrate via formation processing using sacrificial material Dec. 24, 2013
8611127 Stacked memory device having a scalable bandwidth interface Dec. 17, 2013
8609535 Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the same Dec. 17, 2013
8610284 Semiconductor device and electronic device Dec. 17, 2013
8604619 Through silicon via keep out zone formation along different crystal orientations Dec. 10, 2013
8604594 Structures for preventing cross-talk between through-silicon vias and integrated circuits Dec. 10, 2013
8604593 Reconfiguring through silicon vias in stacked multi-die packages Dec. 10, 2013
8598687 Semiconductor having a high aspect ratio via Dec. 3, 2013
8592981 Via structure and method thereof Nov. 26, 2013
8592952 Semiconductor chip and semiconductor package with stack chip structure Nov. 26, 2013
8592310 Methods of manufacturing a semiconductor device Nov. 26, 2013
8586983 Semiconductor chip embedded with a test circuit Nov. 19, 2013
8581412 Semiconductor device comprising an electromagnetic waveguide Nov. 12, 2013

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