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Class Information
Number: 257/620
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > With peripheral feature due to separation of smaller semiconductor chip from larger wafer (e.g., scribe region, or means to prevent edge effects such as leakage current at peripheral chip separation area)
Description: Subject matter wherein the physical configuration is at the periphery of the semiconductor chip due to the separation of the chip from a larger wafer.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459768 |
Semiconductor wafer and dicing method |
Dec. 2, 2008 |
| 7456489 |
Wafer with optical control modules in IC fields |
Nov. 25, 2008 |
| 7456507 |
Die seal structure for reducing stress induced during die saw process |
Nov. 25, 2008 |
| 7443010 |
Matrix form semiconductor package substrate having an electrode of serpentine shape |
Oct. 28, 2008 |
| 7439161 |
Semiconductor device and method for manufacturing the same |
Oct. 21, 2008 |
| 7435990 |
Arrangement for testing semiconductor chips while incorporated on a semiconductor wafer |
Oct. 14, 2008 |
| 7436047 |
Wafer having scribe lanes suitable for sawing process, reticle used in manufacturing the same, and method of manufacturing the same |
Oct. 14, 2008 |
| 7429522 |
Dicing die-bonding film |
Sep. 30, 2008 |
| 7420263 |
DBG system and method with adhesive layer severing |
Sep. 2, 2008 |
| 7420262 |
Electronic component and semiconductor wafer, and method for producing the same |
Sep. 2, 2008 |
| 7417304 |
Electronic device and method for fabricating the same |
Aug. 26, 2008 |
| 7411294 |
Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer |
Aug. 12, 2008 |
| 7399990 |
Wafer-level package having test terminal |
Jul. 15, 2008 |
| 7400028 |
Semiconductor device |
Jul. 15, 2008 |
| 7388272 |
Chip package and producing method thereof |
Jun. 17, 2008 |
| 7387950 |
Method for forming a metal structure |
Jun. 17, 2008 |
| 7387948 |
Structure and method of forming a semiconductor material wafer |
Jun. 17, 2008 |
| 7387911 |
Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking |
Jun. 17, 2008 |
| 7382037 |
Semiconductor device with a peeling prevention layer |
Jun. 3, 2008 |
| 7382038 |
Semiconductor wafer and method for making the same |
Jun. 3, 2008 |
| 7382039 |
Edge seal for improving integrated circuit noise isolation |
Jun. 3, 2008 |
| 7378330 |
Cleaving process to fabricate multilayered substrates using low implantation doses |
May. 27, 2008 |
| 7378720 |
Integrated stress relief pattern and registration structure |
May. 27, 2008 |
| 7371618 |
Method of manufacturing wafer-level chip-size package and molding apparatus used in the method |
May. 13, 2008 |
| 7364983 |
Method and apparatus for creating RFID devices |
Apr. 29, 2008 |
| 7361971 |
Semiconductor wafer protection structure and laminated protective sheet for use therein |
Apr. 22, 2008 |
| 7358153 |
Method for cutting junction board, and chip |
Apr. 15, 2008 |
| 7358616 |
Semiconductor stacked die/wafer configuration and packaging and method thereof |
Apr. 15, 2008 |
| 7344899 |
Die assembly and method for forming a die on a wafer |
Mar. 18, 2008 |
| 7344960 |
Separation method for cutting semiconductor package assemblage for separation into semiconductor packages |
Mar. 18, 2008 |
| 7342296 |
Wafer street buffer layer |
Mar. 11, 2008 |
| 7342320 |
Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly |
Mar. 11, 2008 |
| 7339256 |
Semiconductor device |
Mar. 4, 2008 |
| 7337425 |
Structured ASIC device with configurable die size and selectable embedded functions |
Feb. 26, 2008 |
| 7332374 |
Prealignment and gapping for RF substrates |
Feb. 19, 2008 |
| 7332430 |
Method for improving the mechanical properties of BOC module arrangements |
Feb. 19, 2008 |
| 7327014 |
Semiconductor integrated circuit device and process for manufacturing the same |
Feb. 5, 2008 |
| 7323397 |
Method and apparatus of fabricating a semiconductor device by back grinding and dicing |
Jan. 29, 2008 |
| 7314782 |
Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method |
Jan. 1, 2008 |
| 7314811 |
Method to make corner cross-grid structures in copper metallization |
Jan. 1, 2008 |
| 7309925 |
Dicing die-bonding film |
Dec. 18, 2007 |
| 7307337 |
Resin-molded semiconductor device having posts with bumps and method for fabricating the same |
Dec. 11, 2007 |
| 7301222 |
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages |
Nov. 27, 2007 |
| 7298022 |
Semiconductor sensor |
Nov. 20, 2007 |
| 7288848 |
Overlay mark for measuring and correcting alignment errors |
Oct. 30, 2007 |
| 7279775 |
Semiconductor die with protective layer and related method of processing a semiconductor wafer |
Oct. 9, 2007 |
| 7271026 |
Method for producing chip stacks and chip stacks formed by integrated devices |
Sep. 18, 2007 |
| 7269803 |
System and method for mapping logical components to physical locations in an integrated circuit design environment |
Sep. 11, 2007 |
| 7265032 |
Protective layer during scribing |
Sep. 4, 2007 |
| 7265436 |
Non-repeated and non-uniform width seal ring structure |
Sep. 4, 2007 |
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