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Browse by Category: Main > Physics
Class Information
Number: 257/620
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > With peripheral feature due to separation of smaller semiconductor chip from larger wafer (e.g., scribe region, or means to prevent edge effects such as leakage current at peripheral chip separation area)
Description: Subject matter wherein the physical configuration is at the periphery of the semiconductor chip due to the separation of the chip from a larger wafer.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710595 Semiconductor device Apr. 29, 2014
8704223 Semiconductor device Apr. 22, 2014
8704336 Selective removal of on-die redistribution interconnects from scribe-lines Apr. 22, 2014
8704337 Semiconductor device and method for manufacturing the same Apr. 22, 2014
8704338 Chip comprising a fill structure Apr. 22, 2014
8704384 Stacked die assembly Apr. 22, 2014
8692245 Crack stop structure and method for forming the same Apr. 8, 2014
8693209 Wiring board and method for manufacturing the same Apr. 8, 2014
8692392 Crack stop barrier and method of manufacturing thereof Apr. 8, 2014
8692357 Semiconductor wafer and processing method therefor Apr. 8, 2014
8669166 Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereon Mar. 11, 2014
8669641 Diffusion region routing for narrow scribe-line devices Mar. 11, 2014
8664748 Package-level integrated circuit connection without top metal pads or bonding wire Mar. 4, 2014
8653629 Semiconductor device and wafer Feb. 18, 2014
8648444 Wafer scribe line structure for improving IC reliability Feb. 11, 2014
8643148 Chip-on-Wafer structures and methods for forming the same Feb. 4, 2014
8643147 Seal ring structure with improved cracking protection and reduced problems Feb. 4, 2014
8642447 Semiconductor wafer and manufacturing method of semiconductor device Feb. 4, 2014
8637961 MEMS actuator device Jan. 28, 2014
8637967 Method for fabricating a semiconductor chip and semiconductor chip Jan. 28, 2014
8633571 Semiconductor device and test method Jan. 21, 2014
8629532 Semiconductor wafer with assisting dicing structure and dicing method thereof Jan. 14, 2014
8624359 Wafer level chip scale package and method of manufacturing the same Jan. 7, 2014
8618618 Semiconductor device Dec. 31, 2013
8610252 Scribe line structure for wafer dicing Dec. 17, 2013
8604618 Structure and method for reducing vertical crack propagation Dec. 10, 2013
8604592 Semiconductor device Dec. 10, 2013
8597967 Method and system for dicing substrates containing gallium and nitrogen material Dec. 3, 2013
8598465 Hermetic circuit ring for BCB WSA circuits Dec. 3, 2013
8598653 FinFET having cross-hair cells Dec. 3, 2013
8598686 Electronic device package structure with a hydrophilic protection layer and method for fabricating the same Dec. 3, 2013
8592951 Semiconductor wafer having W-shaped dummy metal filling section within monitor region Nov. 26, 2013
8592950 Semiconductor device and method of forming through vias with reflowed conductive material Nov. 26, 2013
8592107 Method and apparatus of providing overlay Nov. 26, 2013
8587089 Seal ring structure with polyimide layer adhesion Nov. 19, 2013
8587090 Die seal ring structure Nov. 19, 2013
8587091 Wafer-leveled chip packaging structure and method thereof Nov. 19, 2013
8581369 Semiconductor chip and semiconductor wafer Nov. 12, 2013
8581368 Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer Nov. 12, 2013
8575723 Detection circuit and method for detecting damage to a semiconductor chip Nov. 5, 2013
8564100 Semiconductor device Oct. 22, 2013
8563404 Process for dividing wafer into individual chips and semiconductor chips Oct. 22, 2013
8563359 Method for manufacturing semiconductor device, and semiconductor substrate Oct. 22, 2013
8563349 Method of forming semiconductor device Oct. 22, 2013
8558352 Semiconductor integrated circuit device and process for manufacturing the same Oct. 15, 2013
8552534 Laminated semiconductor substrate, semiconductor substrate, laminated chip package and method of manufacturing the same Oct. 8, 2013
8541317 Deposition method for passivation of silicon wafers Sep. 24, 2013
8530997 Double seal ring Sep. 10, 2013
8531007 Semiconductor device and the method for manufacturing the same Sep. 10, 2013
8531008 Material structure in scribe line and method of separating chips Sep. 10, 2013

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