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Class Information
Number: 257/619
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > With thin active central semiconductor portion surrounded by thicker inactive shoulder (e.g., for mechanical support)
Description: Subject matter wherein the device has a thin active central configuration which is surrounded by a thicker inactive shoulder region (e.g., for mechanical support).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7446001 |
Method for forming a semiconductor-on-insulator (SOI) body-contacted device with a portion of drain region removed |
Nov. 4, 2008 |
| 7427801 |
Integrated circuit transformer devices for on-chip millimeter-wave applications |
Sep. 23, 2008 |
| 7413920 |
Double-sided etching method using embedded alignment mark |
Aug. 19, 2008 |
| 7402856 |
Non-planar microelectronic device having isolation element to mitigate fringe effects and method to fabricate same |
Jul. 22, 2008 |
| 7368803 |
System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
May. 6, 2008 |
| 7358593 |
Microfabricated miniature grids |
Apr. 15, 2008 |
| 7352040 |
Microelectromechanical systems having trench isolated contacts, and methods for fabricating same |
Apr. 1, 2008 |
| 7342320 |
Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly |
Mar. 11, 2008 |
| 7309623 |
Method of fabricating a stacked die in die BGA package |
Dec. 18, 2007 |
| 7303976 |
Wafer bonding method |
Dec. 4, 2007 |
| 7282392 |
Method of fabricating a stacked die in die BGA package |
Oct. 16, 2007 |
| 7279774 |
Bulk substrates in FinFETs with trench insulation surrounding FIN pairs having FINs separated by recess hole shallower than trench |
Oct. 9, 2007 |
| 7230274 |
Reduction of carrot defects in silicon carbide epitaxy |
Jun. 12, 2007 |
| 7227243 |
Semiconductor device |
Jun. 5, 2007 |
| 7214995 |
Mechanism to prevent actuation charging in microelectromechanical actuators |
May. 8, 2007 |
| 7208794 |
High-density NROM-FINFET |
Apr. 24, 2007 |
| 7193295 |
Process and apparatus for thinning a semiconductor workpiece |
Mar. 20, 2007 |
| 7176555 |
Flip chip package with reduced thermal stress |
Feb. 13, 2007 |
| 7138672 |
Apparatus and method for making a tensile diaphragm with an insert |
Nov. 21, 2006 |
| 7132737 |
Package for electronic component and method of manufacturing piezoelectric device |
Nov. 7, 2006 |
| 7129550 |
Fin-shaped semiconductor device |
Oct. 31, 2006 |
| 7129565 |
Semiconductor device, method of manufacturing the same, and phase shift mask |
Oct. 31, 2006 |
| 7129566 |
Scribe street structure for backend interconnect semiconductor wafer integration |
Oct. 31, 2006 |
| 7102181 |
Structure and method for dual-gate FET with SOI substrate |
Sep. 5, 2006 |
| 7091566 |
Dual gate FinFet |
Aug. 15, 2006 |
| 7081657 |
MEMS and method of manufacturing MEMS |
Jul. 25, 2006 |
| 7075161 |
Apparatus and method for making a low capacitance artificial nanopore |
Jul. 11, 2006 |
| 7012319 |
System for integrating a circuit on an isolation layer and method thereof |
Mar. 14, 2006 |
| 6992388 |
Formation of micro rough polysurface for low sheet resistant salicided sub-quarter micron polylines |
Jan. 31, 2006 |
| 6972477 |
Circuit device with conductive patterns separated by insulating resin-filled grooves |
Dec. 6, 2005 |
| 6972461 |
Channel MOSFET with strained silicon channel on strained SiGe |
Dec. 6, 2005 |
| 6967351 |
Finfet SRAM cell using low mobility plane for cell stability and method for forming |
Nov. 22, 2005 |
| 6963123 |
IC package, optical transmitter, and optical receiver |
Nov. 8, 2005 |
| 6919261 |
Method and resulting structure for manufacturing semiconductor substrates |
Jul. 19, 2005 |
| 6908829 |
Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal lines |
Jun. 21, 2005 |
| 6906394 |
Method of manufacturing semiconductor device capable of sensing dynamic quantity |
Jun. 14, 2005 |
| 6891991 |
Optical path method and apparatus |
May. 10, 2005 |
| 6888222 |
Semiconductor device |
May. 3, 2005 |
| 6885055 |
Double-gate FinFET device and fabricating method thereof |
Apr. 26, 2005 |
| 6855990 |
Strained-channel multiple-gate transistor |
Feb. 15, 2005 |
| 6828657 |
Active matrix substrate and method of manufacturing the same |
Dec. 7, 2004 |
| 6815825 |
Semiconductor devices having gradual slope contacts |
Nov. 9, 2004 |
| 6803637 |
Micromechanical component with different doping types so that one type is anodized into porous silicon |
Oct. 12, 2004 |
| 6787929 |
Semiconductor device having a flat protective adhesive sheet |
Sep. 7, 2004 |
| 6774491 |
Conductive lines, coaxial lines, integrated circuitry, and methods of forming conductive lines, coaxial lines, and integrated circuitry |
Aug. 10, 2004 |
| 6765279 |
Membrane 3D IC fabrication |
Jul. 20, 2004 |
| 6753238 |
Semiconductor device and manufacturing method thereof |
Jun. 22, 2004 |
| 6737729 |
Anisotropic etching of a semiconductor device using tilted etching holes |
May. 18, 2004 |
| 6710680 |
Reduced size, low loss MEMS torsional hinges and MEMS resonators employing such hinges |
Mar. 23, 2004 |
| 6696743 |
Semiconductor transistor having gate electrode and/or gate wiring |
Feb. 24, 2004 |
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