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Browse by Category: Main > Physics
Class Information
Number: 257/619
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > With thin active central semiconductor portion surrounded by thicker inactive shoulder (e.g., for mechanical support)
Description: Subject matter wherein the device has a thin active central configuration which is surrounded by a thicker inactive shoulder region (e.g., for mechanical support).










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8710638 Socket type MEMS device with stand-off portion Apr. 29, 2014
8686542 Compliant monopolar micro device transfer head with silicon electrode Apr. 1, 2014
8679952 Method of manufacturing silicon carbide epitaxial wafer Mar. 25, 2014
8680624 Methods for forming barrier regions within regions of insulating material resulting in outgassing paths from the insulating material and related devices Mar. 25, 2014
8642434 Structure and method for mobility enhanced MOSFETS with unalloyed silicide Feb. 4, 2014
8624358 Semiconductor substrate and semiconductor device Jan. 7, 2014
8624339 Vibrating device and electronic apparatus Jan. 7, 2014
8569115 Method of forming a compliant bipolar micro device transfer head with silicon electrodes Oct. 29, 2013
8502350 Stacked layers of nitride semiconductor and method for manufacturing the same Aug. 6, 2013
8461665 Wafer and package product manufacturing method Jun. 11, 2013
8455983 Microelectronic device wafers and methods of manufacturing Jun. 4, 2013
8426945 Semiconductor device, method for manufacturing semiconductor device, and electronic appliance Apr. 23, 2013
8415767 Compliant bipolar micro device transfer head with silicon electrodes Apr. 9, 2013
8415768 Compliant monopolar micro device transfer head with silicon electrode Apr. 9, 2013
8395239 Grounded seal ring structure in semiconductor devices Mar. 12, 2013
8395240 Bond pad for low K dielectric materials and method for manufacture for semiconductor devices Mar. 12, 2013
8390111 Wafer bonding method Mar. 5, 2013
8362593 Method for stacking semiconductor dies Jan. 29, 2013
8350364 Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly Jan. 8, 2013
8349707 Process for making contact with and housing integrated circuits Jan. 8, 2013
8344484 Semiconductor device Jan. 1, 2013
8330231 Transistor having gate dielectric protection and structure Dec. 11, 2012
8314449 MIS transistor and CMOS transistor Nov. 20, 2012
8310032 Wafer and method of manufacturing semiconductor device Nov. 13, 2012
8309403 Method for encapsulating electronic components on a wafer Nov. 13, 2012
8274132 Electrical device and fabrication method Sep. 25, 2012
8222810 Substrate, fabrication method thereof and a display using the same Jul. 17, 2012
8217381 Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics Jul. 10, 2012
8198621 Stretchable form of single crystal silicon for high performance electronics on rubber substrates Jun. 12, 2012
8187907 Solder structures for fabrication of inverted metamorphic multijunction solar cells May. 29, 2012
8188574 Pedestal guard ring having continuous M1 metal barrier connected to crack stop May. 29, 2012
8169019 Metal-oxide-semiconductor chip and fabrication method thereof May. 1, 2012
8143721 Package substrate dynamic pressure structure Mar. 27, 2012
8124455 Wafer strength reinforcement system for ultra thin wafer thinning Feb. 28, 2012
8110898 Polymer-embedded semiconductor rod arrays Feb. 7, 2012
8111523 Wiring board with switching function and method of manufacturing the same Feb. 7, 2012
8092594 Carbon ribbon to be covered with a thin layer made of semiconductor material and method for depositing a layer of this type Jan. 10, 2012
8076190 Sea-of-fins structure on a semiconductor substrate and method of fabrication Dec. 13, 2011
8076169 Method of fabricating an electromechanical device including at least one active element Dec. 13, 2011
8067819 Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line Nov. 29, 2011
8063488 Semiconductor device and manufacturing method thereof Nov. 22, 2011
8049308 Bond pad for low K dielectric materials and method for manufacture for semiconductor devices Nov. 1, 2011
7994613 Semiconductor device and method for manufacturing the same Aug. 9, 2011
7956430 Semiconductor device including groove width variation portion for inspection Jun. 7, 2011
7948060 Integrated circuit structure May. 24, 2011
7938016 Multiple layer strain gauge May. 10, 2011
7923379 Multi-step process for forming high-aspect-ratio holes for MEMS devices Apr. 12, 2011
7919832 Stack resistor structure for integrated circuits Apr. 5, 2011
7911011 Methods of fabricating electromechanical non-volatile memory devices Mar. 22, 2011
7872303 FinFET with longitudinal stress in a channel Jan. 18, 2011

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