Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.) > Patents

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Class Information
Number: 257/618
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.)
Description: Subject matter wherein the device has a particular physical form, such as a mesa or bevel or groove.

Sub-classes under this class:

Class Number	Class Name	Patents
257/622	Groove	611
257/623	Mesa structure (e.g., including undercut or stepped mesa configuration or having constant slope taper)	393
257/621	With electrical contact in hole in semiconductor (e.g., lead extends through semiconductor body)	252
257/620	With peripheral feature due to separation of smaller semiconductor chip from larger wafer (e.g., scribe region, or means to prevent edge effects such as leakage current at peripheral chip separation area)	451
257/627	With specified crystal plane or axis	339
257/619	With thin active central semiconductor portion surrounded by thicker inactive shoulder (e.g., for mechanical support)	120

Patents under this class:

1 2 3 4 5 6 7 8 9 10

Patent Number	Title Of Patent	Date Issued
6772509	Method of separating and handling a thin semiconductor die on a wafer	Aug. 10, 2004
6762483	Narrow fin FinFET	Jul. 13, 2004
6762448	FinFET device with multiple fin structures	Jul. 13, 2004
6753593	Quantum wire field-effect transistor and method of making the same	Jun. 22, 2004
6750481	Semiconductor laminated substrate, semiconductor crystal substrate and semiconductor device and method of manufacturing the same	Jun. 15, 2004
6737725	Multilevel interconnect structure containing air gaps and method for making	May. 18, 2004
6734529	Vertically mountable interposer and assembly	May. 11, 2004
6730988	Method of fabrication to sharpen corners of Y-branches in integrated optical components and other micro-devices	May. 4, 2004
6724068	Optical semiconductor device and fabricating method thereof	Apr. 20, 2004
6720664	Submount-holder for flip chip package	Apr. 13, 2004
6720236	Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument	Apr. 13, 2004
6720640	Method for reclaiming delaminated wafer and reclaimed delaminated wafer	Apr. 13, 2004
6717254	Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture	Apr. 6, 2004
6717271	Semiconductor device with mushroom electrode and manufacture method thereof	Apr. 6, 2004
6710680	Reduced size, low loss MEMS torsional hinges and MEMS resonators employing such hinges	Mar. 23, 2004
6707160	Semiconductor device using substrate having cubic structure and method of manufacturing the same	Mar. 16, 2004
6700178	Package of a chip with beveled edges	Mar. 2, 2004
6700139	GaP-base semiconductor light emitting device	Mar. 2, 2004
6700142	Semiconductor wafer on which is fabricated an integrated circuit including an array of discrete functional modules	Mar. 2, 2004
6696705	Power semiconductor component having a mesa edge termination	Feb. 24, 2004
6683367	Thin-film opto-electronic device and a method of making it	Jan. 27, 2004
6683376	Direct bonding of small parts and module of combined small parts without an intermediate layer inbetween	Jan. 27, 2004
6680514	Contact capping local interconnect	Jan. 20, 2004
6673220	System and method for fabricating silicon targets	Jan. 6, 2004
6666337	Method and apparatus for determining wafer identity and orientation	Dec. 23, 2003
6664650	Method of forming an alignment key on a semiconductor wafer	Dec. 16, 2003
6664639	Contact and via structure and method of fabrication	Dec. 16, 2003
6664592	Semiconductor device with groove type channel structure	Dec. 16, 2003
6660654	Fabrication method and apparatus for fabricating a spatial structure in a semiconductor substrate	Dec. 9, 2003
6661044	Method of manufacturing MOSEFT and structure thereof	Dec. 9, 2003
6657282	Semiconductor device having a ball grid array and a fabrication process thereof	Dec. 2, 2003
6657258	Semiconductor device having quasi-SOI structure	Dec. 2, 2003
6657225	Semiconductor component, active matrix substrate for a liquid crystal display, and methods of manufacturing such component and substrate	Dec. 2, 2003
6646325	Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same	Nov. 11, 2003
6639302	Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries	Oct. 28, 2003
6635952	Semiconductor device	Oct. 21, 2003
6621148	Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts, and gallium nitride semiconductor structures fabricated thereby	Sep. 16, 2003
6621174	Apparatus for fabricating encapsulated micro-channels in a substrate	Sep. 16, 2003
6617674	Semiconductor package and method of preparing same	Sep. 9, 2003
6614064	Transistor having a gate stick comprised of a metal, and a method of making same	Sep. 2, 2003
6611030	Cmosfet with conductive, grounded backside connected to the wiring layer through a hole that separates the Mosfets	Aug. 26, 2003
6607970	Semiconductor device and method of manufacturing the same	Aug. 19, 2003
6605362	Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography	Aug. 12, 2003
6605860	Semiconductor structures and manufacturing methods	Aug. 12, 2003
6603190	Semiconductor device	Aug. 5, 2003
6600213	Semiconductor structure and package including a chip having chamfered edges	Jul. 29, 2003
6580152	Semiconductor with plural side faces	Jun. 17, 2003
6580151	Mechanical resistance of a single-crystal silicon wafer	Jun. 17, 2003
6577013	Chip size semiconductor packages with stacked dies	Jun. 10, 2003
6573596	Non-rectangular thermo module wafer cooling device using the same	Jun. 3, 2003