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Class Information
Number: 257/618
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Physical configuration of semiconductor (e.g., mesa, bevel, groove, etc.)
Description: Subject matter wherein the device has a particular physical form, such as a mesa or bevel or groove.


Sub-classes under this class:

Class Number Class Name Patents
257/622 Groove 611
257/623 Mesa structure (e.g., including undercut or stepped mesa configuration or having constant slope taper) 393
257/621 With electrical contact in hole in semiconductor (e.g., lead extends through semiconductor body) 252
257/620 With peripheral feature due to separation of smaller semiconductor chip from larger wafer (e.g., scribe region, or means to prevent edge effects such as leakage current at peripheral chip separation area) 451
257/627 With specified crystal plane or axis 339
257/619 With thin active central semiconductor portion surrounded by thicker inactive shoulder (e.g., for mechanical support) 120


Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
7012319 System for integrating a circuit on an isolation layer and method thereof Mar. 14, 2006
7009270 Substrate for stressed systems and method of making same Mar. 7, 2006
7002237 Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof Feb. 21, 2006
7002177 Test region layout for shallow trench isolation Feb. 21, 2006
6998700 Notched compound semiconductor wafer Feb. 14, 2006
6984873 Method of forming a stacked device filler Jan. 10, 2006
6975016 Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof Dec. 13, 2005
6972477 Circuit device with conductive patterns separated by insulating resin-filled grooves Dec. 6, 2005
6958512 Non-volatile memory device Oct. 25, 2005
6958285 Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings Oct. 25, 2005
6954002 System and method of enhancing alignment marks Oct. 11, 2005
6943429 Wafer having alignment marks extending from a first to a second surface of the wafer Sep. 13, 2005
6936868 Sequential mesa avalanche photodiode capable of realizing high sensitization and method of manufacturing the same Aug. 30, 2005
6930375 Silicon on insulator structure having an epitaxial layer and intrinsic gettering Aug. 16, 2005
6930021 Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument Aug. 16, 2005
6921961 Semiconductor device having electrical contact from opposite sides including a via with an end formed at a bottom surface of the diffusion region Jul. 26, 2005
6921916 Overlay marks, methods of overlay mark design and methods of overlay measurements Jul. 26, 2005
6921963 Narrow fin FinFET Jul. 26, 2005
6913951 Method of making a lead-on-chip device Jul. 5, 2005
6909122 Semiconductor light-emitting device with isolation trenches, and method of fabricating same Jun. 21, 2005
6903428 Semiconductor device capable of preventing a pattern collapse Jun. 7, 2005
6900523 Termination structure for MOSgated power devices May. 31, 2005
6900502 Strained channel on insulator device May. 31, 2005
6900522 Chamfered semiconductor wafer and method of manufacturing the same May. 31, 2005
6894337 System and method for forming stacked fin structure using metal-induced-crystallization May. 17, 2005
6891252 Electronic component with a semiconductor chip and method of producing an electronic component May. 10, 2005
6888222 Semiconductor device May. 3, 2005
6888178 Method and system for magnetically assisted statistical assembly of wafers May. 3, 2005
6885055 Double-gate FinFET device and fabricating method thereof Apr. 26, 2005
6876051 Aspherical microstructure, and method of fabricating the same Apr. 5, 2005
6873050 Intermediate construction having an edge defined feature Mar. 29, 2005
6867450 Semiconductor memory device with surface strap and method of fabricating the same Mar. 15, 2005
6858881 Radiation-emitting semiconductor chip, and method for producing the semiconductor chip Feb. 22, 2005
6855582 FinFET gate formation using reverse trim and oxide polish Feb. 15, 2005
6855962 Semiconductor light emitting device Feb. 15, 2005
6847045 High-current avalanche-tunneling and injection-tunneling semiconductor-dielectric-metal stable cold emitter, which emulates the negative electron affinity mechanism of emission Jan. 25, 2005
6841848 Composite semiconductor wafer and a method for forming the composite semiconductor wafer Jan. 11, 2005
6830838 Chemical vapor deposition of titanium Dec. 14, 2004
6825547 Semiconductor device including edge bond pads Nov. 30, 2004
6818436 Micro array chip Nov. 16, 2004
6818959 MEMS devices with voltage driven flexible elements Nov. 16, 2004
6818967 Fabricating method of low temperature poly-silicon film and low temperature poly-silicon thin film transistor Nov. 16, 2004
6812547 Transposed split of ion cut materials Nov. 2, 2004
6806583 Light source Oct. 19, 2004
6794273 Semiconductor device and manufacturing method thereof Sep. 21, 2004
6787884 Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production Sep. 7, 2004
6787804 Semiconductor acceleration sensor Sep. 7, 2004
6787909 High frequency semiconductor device Sep. 7, 2004
6787885 Low temperature hydrophobic direct wafer bonding Sep. 7, 2004
6777820 Semiconductor wafer Aug. 17, 2004

1 2 3 4 5 6 7 8 9 10


 
 
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