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Class Information
Number: 257/522
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Integrated circuit structure with electrically isolated components > Including dielectric isolation means > Air isolation (e.g., beam lead supported semiconductor islands)
Description: Subject matter wherein the isolation means is air (e.g., islands of semiconductor material supported by beam leads and separated by air).
Patents under this class:
Patent Number |
Title Of Patent |
Date Issued |
8692266 |
Circuit substrate structure |
Apr. 8, 2014 |
8686533 |
Isolation structure |
Apr. 1, 2014 |
8674472 |
Low harmonic RF switch in SOI |
Mar. 18, 2014 |
8674473 |
Semiconductor cell and method for forming the same |
Mar. 18, 2014 |
8674474 |
Biosensors integrated with a microfluidic structure |
Mar. 18, 2014 |
8664743 |
Air-gap formation in interconnect structures |
Mar. 4, 2014 |
8629036 |
Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure |
Jan. 14, 2014 |
8629528 |
Semiconductor memory device and method for manufacturing the same |
Jan. 14, 2014 |
8629561 |
Air gap-containing interconnect structure having photo-patternable low k material |
Jan. 14, 2014 |
8617962 |
Method for finishing a substrate of the semiconductor-on-insulator type |
Dec. 31, 2013 |
8609508 |
Method of fabricating an integrated circuit having a strain inducing hollow trench isolation region |
Dec. 17, 2013 |
8551859 |
Biosensors integrated with a microfluidic structure |
Oct. 8, 2013 |
8546240 |
Methods of manufacturing integrated semiconductor devices with single crystalline beam |
Oct. 1, 2013 |
8546909 |
Nonvolatile semiconductor memory device having air gap proximate to element isolation region and method of manufacturing the same |
Oct. 1, 2013 |
8546910 |
Semiconductor structure and method for manufacturing the same |
Oct. 1, 2013 |
8513780 |
Semiconductor device having inter-level dielectric layer with hole-sealing and method for manufacturing the same |
Aug. 20, 2013 |
8507332 |
Method for manufacturing components |
Aug. 13, 2013 |
8497543 |
Semiconductor memory device and method for manufacturing same |
Jul. 30, 2013 |
8492904 |
Semiconductor device and manufacturing method of the same |
Jul. 23, 2013 |
8482096 |
Semiconductor photodetector and manufacturing method therefor |
Jul. 9, 2013 |
8481400 |
Semiconductor manufacturing and semiconductor device with semiconductor structure |
Jul. 9, 2013 |
8476118 |
Semiconductor device and fabrication mehtod of the semiconductor device |
Jul. 2, 2013 |
8466033 |
Light emitting diode and manufacturing method thereof |
Jun. 18, 2013 |
8409964 |
Shallow trench isolation with improved structure and method of forming |
Apr. 2, 2013 |
8394656 |
Method of creating MEMS device cavities by a non-etching process |
Mar. 12, 2013 |
8373204 |
Semiconductor device and method of manufacturing thereof |
Feb. 12, 2013 |
8344474 |
Microstructure device including a metallization structure with self-aligned air gaps and refilled air gap exclusion zones |
Jan. 1, 2013 |
8304316 |
Semiconductor device and method of forming a semiconductor device |
Nov. 6, 2012 |
8304845 |
Method for sealing an opening |
Nov. 6, 2012 |
8264060 |
Method of sealing an air gap in a layer of a semiconductor structure and semiconductor structure |
Sep. 11, 2012 |
8258630 |
Semiconductor device and method of manufacturing the same |
Sep. 4, 2012 |
8247882 |
Method of forming an isolation structure |
Aug. 21, 2012 |
8241989 |
Integrated circuit with stacked devices |
Aug. 14, 2012 |
8232618 |
Semiconductor structure having a contact-level air gap within the interlayer dielectrics above a semiconductor device and a method of forming the semiconductor structure using a self-assembly |
Jul. 31, 2012 |
8198701 |
Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same |
Jun. 12, 2012 |
8154103 |
Semiconductor device |
Apr. 10, 2012 |
8129252 |
Semiconductor devices with sealed, unlined trenches and methods of forming same |
Mar. 6, 2012 |
8125047 |
Semiconductor device and method of manufacturing the same |
Feb. 28, 2012 |
8125046 |
Micro-electromechanical system devices |
Feb. 28, 2012 |
8110879 |
Controlling lateral distribution of air gaps in interconnects |
Feb. 7, 2012 |
8103025 |
Surface mountable transducer system |
Jan. 24, 2012 |
8084794 |
Semiconductor device and manufacturing method thereof |
Dec. 27, 2011 |
8084840 |
Interposer including air gap structure, methods of forming the same, semiconductor device including the interposer, and multi-chip package including the interposer |
Dec. 27, 2011 |
8080859 |
Reducing stress between a substrate and a projecting electrode on the substrate |
Dec. 20, 2011 |
8071459 |
Method of sealing an air gap in a layer of a semiconductor structure and semiconductor structure |
Dec. 6, 2011 |
8058136 |
Self-alignment method for recess channel dynamic random access memory |
Nov. 15, 2011 |
8053865 |
MOM capacitors integrated with air-gaps |
Nov. 8, 2011 |
8048760 |
Semiconductor structure and method of manufacture |
Nov. 1, 2011 |
8039921 |
Wiring structure, semiconductor device and manufacturing method thereof |
Oct. 18, 2011 |
8039968 |
Semiconductor integrated circuit device |
Oct. 18, 2011 |
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