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Class Information
Number: 257/522
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Integrated circuit structure with electrically isolated components > Including dielectric isolation means > Air isolation (e.g., beam lead supported semiconductor islands)
Description: Subject matter wherein the isolation means is air (e.g., islands of semiconductor material supported by beam leads and separated by air).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7439605 |
Semiconductor device and method for manufacturing the same |
Oct. 21, 2008 |
| 7404247 |
Method for making a pressure sensor |
Jul. 29, 2008 |
| 7405459 |
Semiconductor device comprising porous film |
Jul. 29, 2008 |
| 7402886 |
Memory with self-aligned trenches for narrow gap isolation regions |
Jul. 22, 2008 |
| 7400024 |
Formation of deep trench airgaps and related applications |
Jul. 15, 2008 |
| 7394144 |
Trench semiconductor device and method of manufacturing it |
Jul. 1, 2008 |
| 7351661 |
Semiconductor device having trench isolation layer and a method of forming the same |
Apr. 1, 2008 |
| 7352019 |
Capacitance reduction by tunnel formation for use with a semiconductor device |
Apr. 1, 2008 |
| 7339253 |
Retrograde trench isolation structures |
Mar. 4, 2008 |
| 7335931 |
Monolithic microwave integrated circuit compatible FET structure |
Feb. 26, 2008 |
| 7335965 |
Packaging of electronic chips with air-bridge structures |
Feb. 26, 2008 |
| 7312512 |
Interconnect structure with polygon cell structures |
Dec. 25, 2007 |
| 7304358 |
MOS transistor with a deformable gate |
Dec. 4, 2007 |
| 7291919 |
Interlayer dielectric film, and method for forming the same and interconnection |
Nov. 6, 2007 |
| 7285839 |
Coating of copper and silver air bridge structures to improve electromigration resistance and other applications |
Oct. 23, 2007 |
| 7259432 |
Semiconductor device for reducing parasitic capacitance produced in the vicinity of a transistor located within the semiconductor device |
Aug. 21, 2007 |
| 7238959 |
Phase change memory device employing thermally insulating voids and sloped trench, and a method of making same |
Jul. 3, 2007 |
| 7235456 |
Method of making empty space in silicon |
Jun. 26, 2007 |
| 7233052 |
Semiconductor device including fine dummy patterns |
Jun. 19, 2007 |
| 7230315 |
Integrated chemical microreactor with large area channels and manufacturing process thereof |
Jun. 12, 2007 |
| 7224064 |
Semiconductor device having conductive interconnections and porous and nonporous insulating portions |
May. 29, 2007 |
| 7214594 |
Method of making semiconductor device using a novel interconnect cladding layer |
May. 8, 2007 |
| 7196406 |
ESD protection apparatus for an electrical device |
Mar. 27, 2007 |
| 7190043 |
Techniques to create low K ILD for beol |
Mar. 13, 2007 |
| 7190046 |
Bipolar transistor having reduced collector-base capacitance |
Mar. 13, 2007 |
| 7176487 |
Semiconductor integrated circuit |
Feb. 13, 2007 |
| 7161226 |
Multi-layered complementary wire structure and manufacturing method thereof |
Jan. 9, 2007 |
| 7145215 |
Semiconductor device with a cavity therein and a method of manufacturing the same |
Dec. 5, 2006 |
| 7138718 |
Multilevel interconnect structure with low-k dielectric |
Nov. 21, 2006 |
| 7125782 |
Air gaps between conductive lines for reduced RC delay of integrated circuits |
Oct. 24, 2006 |
| 7122888 |
Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device |
Oct. 17, 2006 |
| 7119446 |
Semiconductor device |
Oct. 10, 2006 |
| 7112866 |
Method to form a cross network of air gaps within IMD layer |
Sep. 26, 2006 |
| 7084479 |
Line level air gaps |
Aug. 1, 2006 |
| 7075166 |
Coating of copper and silver air bridge structures to improve electromigration resistance and other applications |
Jul. 11, 2006 |
| 7071532 |
Adjustable self-aligned air gap dielectric for low capacitance wiring |
Jul. 4, 2006 |
| 7061100 |
Semiconductor built-in millimeter-wave band module |
Jun. 13, 2006 |
| 7042095 |
Semiconductor device including an interconnect having copper as a main component |
May. 9, 2006 |
| 7038289 |
Deep insulating trench |
May. 2, 2006 |
| 7019364 |
Semiconductor substrate having pillars within a closed empty space |
Mar. 28, 2006 |
| 7009273 |
Semiconductor device with a cavity therein and a method of manufacturing the same |
Mar. 7, 2006 |
| 7009272 |
PECVD air gap integration |
Mar. 7, 2006 |
| 6998695 |
Semiconductor device having a mushroom gate with hollow space |
Feb. 14, 2006 |
| 6998321 |
Method for forming inductor in semiconductor device |
Feb. 14, 2006 |
| 6995073 |
Air gap integration |
Feb. 7, 2006 |
| 6995470 |
Multilevel copper interconnects with low-k dielectrics and air gaps |
Feb. 7, 2006 |
| 6992364 |
Array substrate for use in LCD device and method of fabricating same |
Jan. 31, 2006 |
| 6984892 |
Semiconductor structure implementing low-K dielectric materials and supporting stubs |
Jan. 10, 2006 |
| 6953983 |
Low dielectric constant STI with SOI devices |
Oct. 11, 2005 |
| 6953982 |
Flexible skin incorporating MEMS technology |
Oct. 11, 2005 |
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