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Class Information
Number: 257/508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Integrated circuit structure with electrically isolated components > Including dielectric isolation means > With metallic conductor within isolating dielectric or between semiconductor and isolating dielectric (e.g., metal shield layer or internal connection layer)
Description: Subject matter wherein a metallic (metal or metal-like) conductor is located within the region of electrical insulator material which isolates the components on the chip from each other or is provided between the single crystal semiconductor material of the semiconductor components and the electrical insulator material forming the dielectric isolation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6710418 |
Schottky rectifier with insulation-filled trenches and method of forming the same |
Mar. 23, 2004 |
| 6710443 |
INTEGRATED CIRCUIT PROVIDING THERMALLY CONDUCTIVE STRUCTURES SUBSTANTIALLY HORIZONTALLY COUPLED TO ONE ANOTHER WITHIN ONE OR MORE HEAT DISSIPATION LAYERS TO DISSIPATE HEAT FROM A HEAT GENERATI |
Mar. 23, 2004 |
| 6710448 |
Bonding pad structure |
Mar. 23, 2004 |
| 6710421 |
Semiconductor devices and methods for manufacturing the same |
Mar. 23, 2004 |
| 6686645 |
Fuse and fuse window structure |
Feb. 3, 2004 |
| 6680517 |
Anisotropic conductive film, production method thereof, and display apparatus using anisotropic film |
Jan. 20, 2004 |
| 6677657 |
High-voltage periphery |
Jan. 13, 2004 |
| 6674146 |
Composite dielectric layers |
Jan. 6, 2004 |
| 6667531 |
Method and apparatus for a deposited fill layer |
Dec. 23, 2003 |
| 6653221 |
Method of forming a ground in SOI structures |
Nov. 25, 2003 |
| 6646319 |
Semiconductor device having isolating region for suppressing electrical noise |
Nov. 11, 2003 |
| 6635914 |
Microelectronic programmable device and methods of forming and programming the same |
Oct. 21, 2003 |
| 6617666 |
Semiconductor device with capacitor and process for manufacturing the device |
Sep. 9, 2003 |
| 6611059 |
Integrated circuitry conductive lines |
Aug. 26, 2003 |
| 6600207 |
Structure to reduce line-line capacitance with low K material |
Jul. 29, 2003 |
| 6597053 |
Integrated circuit arrangement with a number of structural elements and method for the production thereof |
Jul. 22, 2003 |
| 6583489 |
Method for forming interconnect structure with low dielectric constant |
Jun. 24, 2003 |
| 6580143 |
Thin-film circuit substrate and method of producing same |
Jun. 17, 2003 |
| 6580128 |
Semiconductor substrate, semiconductor device, and processes of production of same |
Jun. 17, 2003 |
| 6573147 |
Method of forming a semiconductor device having contact using crack-protecting layer |
Jun. 3, 2003 |
| 6555892 |
Semiconductor device with reduced line-to-line capacitance and cross talk noise |
Apr. 29, 2003 |
| 6545338 |
Methods for implementing co-axial interconnect lines in a CMOS process for high speed RF and microwave applications |
Apr. 8, 2003 |
| 6538294 |
Trenched semiconductor device with high breakdown voltage |
Mar. 25, 2003 |
| 6531755 |
Semiconductor device and manufacturing method thereof for realizing high packaging density |
Mar. 11, 2003 |
| 6531753 |
Embedded conductor for SOI devices using a buried conductive layer/conductive plug combination |
Mar. 11, 2003 |
| 6521923 |
Microwave field effect transistor structure on silicon carbide substrate |
Feb. 18, 2003 |
| 6521975 |
Scribe street seals in semiconductor devices and method of fabrication |
Feb. 18, 2003 |
| 6521947 |
Method of integrating substrate contact on SOI wafers with STI process |
Feb. 18, 2003 |
| 6515332 |
Insulated-gate field-effect semiconductor device |
Feb. 4, 2003 |
| 6512281 |
Method of forming a semiconductor device and an improved deposition system |
Jan. 28, 2003 |
| 6509590 |
Aluminum-beryllium alloys for air bridges |
Jan. 21, 2003 |
| 6504229 |
Semiconductor device and process of manufacturing the same |
Jan. 7, 2003 |
| 6504225 |
Teos seaming scribe line monitor |
Jan. 7, 2003 |
| 6504224 |
Methods and structures for metal interconnections in integrated circuits |
Jan. 7, 2003 |
| 6495899 |
Semiconductor device capable of surely fixing voltage at well |
Dec. 17, 2002 |
| 6479880 |
Floating gate isolation device |
Nov. 12, 2002 |
| 6479881 |
Low temperature process for forming intermetal gap-filling insulating layers in silicon wafer integrated circuitry |
Nov. 12, 2002 |
| 6472723 |
Substrate contacts and shielding devices in a semiconductor component |
Oct. 29, 2002 |
| 6465867 |
Amorphous and gradated barrier layer for integrated circuit interconnects |
Oct. 15, 2002 |
| 6462395 |
Semiconductor device and method of producing the same |
Oct. 8, 2002 |
| 6452267 |
Selective flip chip underfill processing for high speed signal isolation |
Sep. 17, 2002 |
| 6448651 |
Semiconductor device having a multi-level metallization and its fabricating method |
Sep. 10, 2002 |
| 6433402 |
Selective copper alloy deposition |
Aug. 13, 2002 |
| 6429486 |
Semiconductor support substrate potential fixing structure for SOI semiconductor device |
Aug. 6, 2002 |
| 6426545 |
Integrated circuit structures and methods employing a low modulus high elongation photodielectric |
Jul. 30, 2002 |
| 6424036 |
Semiconductor device and method for manufacturing the same |
Jul. 23, 2002 |
| 6384676 |
Signal processing semiconductor integrated circuit device |
May. 7, 2002 |
| 6380606 |
Locos isolation process using a layered pad nitride and dry field oxidation stack and semiconductor device employing the same |
Apr. 30, 2002 |
| 6380598 |
Radiation hardened semiconductor memory |
Apr. 30, 2002 |
| 6376892 |
Semiconductor device and method of manufacturing the same |
Apr. 23, 2002 |
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