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Class Information
Number: 257/506
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Integrated circuit structure with electrically isolated components > Including dielectric isolation means
Description: Subject matter wherein the means to electrically isolate different devices in the same monolithic chip from each other includes a region of electrical insulator material.

Sub-classes under this class:

Class Number Class Name Patents
257/522 Air isolation (e.g., beam lead supported semiconductor islands) 381
257/509 Combined with pn junction isolation (e.g., isoplanar, locos) 229
257/524 Full dielectric isolation with polycrystalline semiconductor substrate 179
257/523 Isolation by region of intrinsic (undoped) semiconductor material (e.g., including region physically damaged by proton bombardment) 94
257/526 With bipolar transistor structure 154
257/508 With metallic conductor within isolating dielectric or between semiconductor and isolating dielectric (e.g., metal shield layer or internal connection layer) 491
257/507 With single crystal insulating substrate (e.g., sapphire) 143

Patents under this class:

Patent Number Title Of Patent Date Issued
8710617 Semiconductor device element formed on SOI substrate comprising a hollow region, and having capacitors in an electric field alleviation region Apr. 29, 2014
8709901 Method of forming an isolation structure Apr. 29, 2014
8709898 Fabrication method of semiconductor device and fabrication method of dynamic threshold transistor Apr. 29, 2014
8704331 MEMS integrated chip with cross-area interconnection Apr. 22, 2014
8703577 Method for fabrication deep trench isolation structure Apr. 22, 2014
8703575 Method of forming isolation area and structure thereof Apr. 22, 2014
8692350 Semiconductor device and method of manufacturing the same Apr. 8, 2014
8692299 Two-step shallow trench isolation (STI) process Apr. 8, 2014
8692266 Circuit substrate structure Apr. 8, 2014
8686534 Trench isolation structure and method for forming the same Apr. 1, 2014
8686533 Isolation structure Apr. 1, 2014
8680645 Semiconductor device and a method for forming a semiconductor device Mar. 25, 2014
8664742 Semiconductor substrates with undercut structures Mar. 4, 2014
8664080 Vertical ESD protection device Mar. 4, 2014
8659116 Isolated transistor Feb. 25, 2014
8659115 Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating Feb. 25, 2014
8659114 Semiconductor device Feb. 25, 2014
8653568 Semiconductor substrate with stripes of different crystal plane directions and semiconductor device including the same Feb. 18, 2014
8652934 Semiconductor substrate for photonic and electronic structures and method of manufacture Feb. 18, 2014
8648643 Semiconductor power modules and devices Feb. 11, 2014
8642441 Self-aligned STI with single poly for manufacturing a flash memory device Feb. 4, 2014
8642429 Wide and deep oxide trench in a semiconductor substrate with interspersed vertical oxide ribs Feb. 4, 2014
8637955 Semiconductor structure with reduced junction leakage and method of fabrication thereof Jan. 28, 2014
8633564 Semicondutor isolation structure Jan. 21, 2014
8633090 Method for forming substrate with buried insulating layer Jan. 21, 2014
8629553 3D integrated circuit device fabrication with precisely controllable substrate removal Jan. 14, 2014
8629527 Semiconductor structures Jan. 14, 2014
8629433 Method for manufacturing semiconductor device Jan. 14, 2014
8629038 FinFETs with vertical fins and methods for forming the same Jan. 14, 2014
8629028 Metal oxide semiconductor field effect transistor (MOSFET) gate termination Jan. 14, 2014
8624350 Semiconductor device and method of fabricating the same Jan. 7, 2014
8624349 Simultaneous isolation trench and handle wafer contact formation Jan. 7, 2014
8623713 Trench isolation structure Jan. 7, 2014
8618580 Integrated circuit chips with fine-line metal and over-passivation metal Dec. 31, 2013
8617962 Method for finishing a substrate of the semiconductor-on-insulator type Dec. 31, 2013
8614501 Method of producing a layer of cavities Dec. 24, 2013
8610240 Integrated circuit with multi recessed shallow trench isolation Dec. 17, 2013
8610238 Crack stop trenches Dec. 17, 2013
8609505 Method of forming MIM capacitor structure in FEOL Dec. 17, 2013
8604562 Post CMP planarization by cluster ion beam etch Dec. 10, 2013
8598686 Electronic device package structure with a hydrophilic protection layer and method for fabricating the same Dec. 3, 2013
8598676 Barrier structure Dec. 3, 2013
8598675 Isolation structure profile for gap filling Dec. 3, 2013
8598630 Photo alignment mark for a gate last process Dec. 3, 2013
8592940 Topography based patterning Nov. 26, 2013
8587085 Semiconductor device with trench isolation having a diffusion preventing film and manufacturing method thereof Nov. 19, 2013
8581316 Semiconductor device and method of manufacturing the same Nov. 12, 2013
8575040 Low temperature process for polysilazane oxidation/densification Nov. 5, 2013
8569860 Semiconductor devices having line type active regions and methods of fabricating the same Oct. 29, 2013
8569859 Display device and method of manufacturing the same Oct. 29, 2013

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