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Class Information
Number: 257/503
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Integrated circuit structure with electrically isolated components > With contact or metallization configuration to reduce parasitic coupling (e.g., separate ground pads for different parts of integrated circuit)
Description: Subject matter wherein the chip includes contacts or electrical interconnections, such as metal strips deposited on the surface of the chip, which contacts or interconnections are configured in such a manner as to reduce or eliminate unwanted parasitic coupling of electrical signals from one part or component of the integrated circuit to another.

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8692266 Circuit substrate structure Apr. 8, 2014
8671565 Blind via capture pad structure fabrication method Mar. 18, 2014
8669659 Semiconductor device and a method of manufacturing the same Mar. 11, 2014
8664050 Structure and method to improve ETSOI MOSFETS with back gate Mar. 4, 2014
8664754 High power semiconductor package with multiple conductive clips Mar. 4, 2014
8659113 Embedded semiconductor die package and method of making the same using metal frame carrier Feb. 25, 2014
8648643 Semiconductor power modules and devices Feb. 11, 2014
8642986 Integrated circuit having microelectromechanical system device and method of fabricating the same Feb. 4, 2014
8581361 Semiconductor apparatus Nov. 12, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8536677 Capacitor structure Sep. 17, 2013
8530997 Double seal ring Sep. 10, 2013
8507358 Composite wafer semiconductor Aug. 13, 2013
8502338 Through-substrate via waveguides Aug. 6, 2013
8503212 Semiconductor memory apparatus with power-meshed structure Aug. 6, 2013
8497573 High power semiconductor package with conductive clip on multiple transistors Jul. 30, 2013
8492868 Method, apparatus, and design structure for silicon-on-insulator high-bandwidth circuitry with reduced charge layer Jul. 23, 2013
8487400 High performance system-on-chip using post passivation process Jul. 16, 2013
8487397 Method for forming self-aligned contact Jul. 16, 2013
8476614 Memory device and fabrication process thereof Jul. 2, 2013
8470635 Keyhole-free sloped heater for phase change memory Jun. 25, 2013
8470705 Chip pad resistant to antenna effect and method Jun. 25, 2013
8471324 Semiconductor device Jun. 25, 2013
8466535 Galvanic isolation fuse and method of forming the fuse Jun. 18, 2013
8432015 Semiconductor device and wire bonding method Apr. 30, 2013
8405185 Semiconductor device and semiconductor module including the same Mar. 26, 2013
8399932 Semiconductor device, semiconductor integrated circuit, SRAM, and method for producing Dt-MOS transistor Mar. 19, 2013
8390046 Semiconductor device Mar. 5, 2013
8378445 Trench structures in direct contact Feb. 19, 2013
8357990 Semiconductor device Jan. 22, 2013
8344496 Distributing power with through-silicon-vias Jan. 1, 2013
8330254 Semiconductor device Dec. 11, 2012
8309975 Semiconductor light emitting element and semiconductor light emitting device using the same Nov. 13, 2012
8310023 Light emitting diode package and fabrication method thereof Nov. 13, 2012
8304885 Semiconductor device and electronic apparatus equipped with the semiconductor device Nov. 6, 2012
8299561 Shielding for high-voltage semiconductor-on-insulator devices Oct. 30, 2012
8258628 System and method for integrated circuit arrangement having a plurality of conductive structure levels Sep. 4, 2012
8253198 Devices for shielding a signal line over an active region Aug. 28, 2012
8253217 Seal ring structure in semiconductor devices Aug. 28, 2012
8247965 Light emitting display device and method for manufacturing the same Aug. 21, 2012
8242573 Semiconductor device with isolation formed between digital circuit and analog circuit Aug. 14, 2012
8242601 Semiconductor chip with passivation layer comprising metal interconnect and contact pads Aug. 14, 2012
8212330 Process for improving the reliability of interconnect structures and resulting structure Jul. 3, 2012
8195990 Misalignment compensation for proximity communication Jun. 5, 2012
8193087 Process for improving copper line cap formation Jun. 5, 2012
8183581 LED arrangement May. 22, 2012
8183663 Crack resistant circuit under pad structure and method of manufacturing the same May. 22, 2012
8183691 Semiconductor device with pads overlapping wiring layers including dummy wiring May. 22, 2012
8148797 Chip pad resistant to antenna effect and method Apr. 3, 2012
8110879 Controlling lateral distribution of air gaps in interconnects Feb. 7, 2012

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