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Class Information
Number: 257/503
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Integrated circuit structure with electrically isolated components > With contact or metallization configuration to reduce parasitic coupling (e.g., separate ground pads for different parts of integrated circuit)
Description: Subject matter wherein the chip includes contacts or electrical interconnections, such as metal strips deposited on the surface of the chip, which contacts or interconnections are configured in such a manner as to reduce or eliminate unwanted parasitic coupling of electrical signals from one part or component of the integrated circuit to another.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7456479 |
Method for fabricating a probing pad of an integrated circuit chip |
Nov. 25, 2008 |
| 7436040 |
Method and apparatus for diverting void diffusion in integrated circuit conductors |
Oct. 14, 2008 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Jul. 29, 2008 |
| 7400039 |
Semiconductor device and semiconductor package |
Jul. 15, 2008 |
| 7382015 |
Semiconductor device including an element isolation portion having a recess |
Jun. 3, 2008 |
| 7358548 |
Semiconductor integrated circuit having layout in which buffers or protection circuits are arranged in concentrated manner |
Apr. 15, 2008 |
| 7358560 |
Flash memory device and method of manufacturing the same |
Apr. 15, 2008 |
| 7352048 |
Integration of barrier layer and seed layer |
Apr. 1, 2008 |
| 7344936 |
Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production |
Mar. 18, 2008 |
| 7335964 |
Semiconductor structures |
Feb. 26, 2008 |
| 7319264 |
Semiconductor device |
Jan. 15, 2008 |
| 7315072 |
Semiconductor device capable of suppressing current concentration in pad and its manufacture method |
Jan. 1, 2008 |
| 7312511 |
Semiconductor device with electrically isolated ground structures |
Dec. 25, 2007 |
| 7309622 |
Integrated circuit package system with heat sink |
Dec. 18, 2007 |
| 7301103 |
Printed-wiring board, printed-circuit board and electronic apparatus |
Nov. 27, 2007 |
| 7291894 |
Vertical charge control semiconductor device with low output capacitance |
Nov. 6, 2007 |
| 7276784 |
Semiconductor device and a method of assembling a semiconductor device |
Oct. 2, 2007 |
| 7259441 |
Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuit |
Aug. 21, 2007 |
| 7253487 |
Integrated circuit chip having a seal ring, a ground ring and a guard ring |
Aug. 7, 2007 |
| 7250353 |
Method and system of releasing a MEMS structure |
Jul. 31, 2007 |
| 7227254 |
Integrated circuit package |
Jun. 5, 2007 |
| 7202546 |
Integrated circuit with copper interconnect and top level bonding/interconnect layer |
Apr. 10, 2007 |
| 7196394 |
Method and apparatus for a deposited fill layer |
Mar. 27, 2007 |
| 7173315 |
Semiconductor device |
Feb. 6, 2007 |
| 7170109 |
Heterojunction semiconductor device with element isolation structure |
Jan. 30, 2007 |
| 7138686 |
Integrated circuit with improved signal noise isolation and method for improving signal noise isolation |
Nov. 21, 2006 |
| 7135396 |
Method of making a semiconductor structure |
Nov. 14, 2006 |
| 7135774 |
Heat resistant ohmic electrode and method of manufacturing the same |
Nov. 14, 2006 |
| 7084477 |
Semiconductor device and manufacturing method of the same |
Aug. 1, 2006 |
| 7068521 |
Semiconductor device |
Jun. 27, 2006 |
| 7038926 |
Multi-port static random access memory |
May. 2, 2006 |
| 7015549 |
Integrated circuit structures including epitaxial silicon layers that extend from an active region through an insulation layer to a substrate |
Mar. 21, 2006 |
| 7015561 |
Active rectifier |
Mar. 21, 2006 |
| 6960837 |
Method of connecting core I/O pins to backside chip I/O pads |
Nov. 1, 2005 |
| 6953983 |
Low dielectric constant STI with SOI devices |
Oct. 11, 2005 |
| 6953981 |
Semiconductor device with deep substrates contacts |
Oct. 11, 2005 |
| 6917075 |
Semiconductor device |
Jul. 12, 2005 |
| 6909196 |
Method and structures for reduced parasitic capacitance in integrated circuit metallizations |
Jun. 21, 2005 |
| 6902998 |
Methods of manufacturing semiconductor devices having storage nodes |
Jun. 7, 2005 |
| 6885079 |
Methods and configuration to simplify connections between polysilicon layer and diffusion area |
Apr. 26, 2005 |
| 6882039 |
Semiconductor device |
Apr. 19, 2005 |
| 6879017 |
Methods and structures for metal interconnections in integrated circuits |
Apr. 12, 2005 |
| 6873014 |
Semiconductor device and method of manufacturing the same |
Mar. 29, 2005 |
| 6858869 |
White color light emitting device |
Feb. 22, 2005 |
| 6852585 |
Semiconductor circuit arrangement and a method for producing same |
Feb. 8, 2005 |
| 6853003 |
Semiconductor devices with capacitors of metal/insulator/metal structure and methods for forming the same |
Feb. 8, 2005 |
| 6847092 |
Microelectronic capacitor structure with radial current flow |
Jan. 25, 2005 |
| 6838773 |
Semiconductor chip and semiconductor device using the semiconductor chip |
Jan. 4, 2005 |
| 6835995 |
Low dielectric constant material for integrated circuit fabrication |
Dec. 28, 2004 |
| 6812486 |
Conductive structure and method of forming the structure |
Nov. 2, 2004 |
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