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Class Information
Number: 257/492
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > With means to increase breakdown voltage threshold > In integrated circuit > With electric field controlling semiconductor layer having a low enough doping level in relationship to its thickness to be fully depleted prior to avalanche breakdown (e.g., resurf devices)
Description: Subject matter wherein the means to increase breakdown voltage of the device includes a layer of semiconductor material having a sufficiently low doping concentration that it may be fully depleted by the depletion region of a reverse biased junction of the active device prior to avalanche breakdown of the active device, so that upon depletion of the layer of semiconductor material, the effective width of the depletion layer of the reverse biased junction of the active device is greatly expanded, thus resulting in smaller increases in electric field intensity with further increases of reverse voltage.


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
5510275 Method of making a semiconductor device with a composite drift region composed of a substrate and a second semiconductor material Apr. 23, 1996
5485030 Dielectric element isolated semiconductor device and a method of manufacturing the same Jan. 16, 1996
5448100 Breakdown diode structure Sep. 5, 1995
5432377 Dielectrically isolated semiconductor device and a method for its manufacture Jul. 11, 1995
5406110 Resurf lateral double diffused insulated gate field effect transistor Apr. 11, 1995
5382818 Lateral semiconductor-on-insulator (SOI) semiconductor device having a buried diode Jan. 17, 1995
5378912 Lateral semiconductor-on-insulator (SOI) semiconductor device having a lateral drift region Jan. 3, 1995
5374843 Lightly-doped drain MOSFET with improved breakdown characteristics Dec. 20, 1994
5373183 Integrated circuit with improved reverse bias breakdown Dec. 13, 1994
5347155 Semiconductor device having a lateral DMOST with breakdown voltage raising zones and provisions for exchanging charge with the back gate region Sep. 13, 1994
5338965 High voltage structures with oxide isolated source and RESURF drift region in bulk silicon Aug. 16, 1994
5324978 Semiconductor device having an improved breakdown voltage-raising structure Jun. 28, 1994
5319236 Semiconductor device equipped with a high-voltage MISFET Jun. 7, 1994
5294825 High breakdown voltage semiconductor device Mar. 15, 1994
5286995 Isolated resurf LDMOS devices for multiple outputs on one die Feb. 15, 1994
5223919 Photosensitive device suitable for high voltage operation Jun. 29, 1993
5216275 Semiconductor power devices with alternating conductivity type high-voltage breakdown regions Jun. 1, 1993
5113236 Integrated circuit device particularly adapted for high voltage applications May. 12, 1992
5086332 Planar semiconductor device having high breakdown voltage Feb. 4, 1992
4868921 High voltage integrated circuit devices electrically isolated from an integrated circuit substrate Sep. 19, 1989
4866495 High power MOSFET and integrated control circuit therefor for high-side switch application Sep. 12, 1989
4862242 Semiconductor wafer with an electrically-isolated semiconductor device Aug. 29, 1989
4835596 Transistor with a high collector-emitter breakthrough voltage May. 30, 1989
4811075 High voltage MOS transistors Mar. 7, 1989
4754310 High voltage semiconductor device Jun. 28, 1988
4661838 High voltage semiconductor devices electrically isolated from an integrated circuit substrate Apr. 28, 1987
4605948 Semiconductor structure for electric field distribution Aug. 12, 1986
4593458 Fabrication of integrated circuit with complementary, dielectrically-isolated, high voltage semiconductor devices Jun. 10, 1986
4422089 Semiconductor device having a reduced surface field strength Dec. 20, 1983
4409606 High breakdown voltage semiconductor device Oct. 11, 1983
4292642 Semiconductor device Sep. 29, 1981

1 2 3 4


 
 
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