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Class Information
Number: 257/48
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Test or calibration structure
Description: Subject matter in which structures are provided on active solid-state devices to permit or facilitate the measurement, test, or calibration of the characteristics of the devices.










Patents under this class:

Patent Number Title Of Patent Date Issued
5525812 Retractable pin dual in-line package test clip Jun. 11, 1996
5523586 Burn-in socket used in a burn-in test for semiconductor chips Jun. 4, 1996
5504369 Apparatus for performing wafer level testing of integrated circuit dice Apr. 2, 1996
5477062 Semiconductor wafer Dec. 19, 1995
5475224 Infrared detector substrate with breakaway test tabs Dec. 12, 1995
5475236 Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process Dec. 12, 1995
5466956 Semiconductor integrated circuit device with electrode for measuring interlayer insulator capacitance Nov. 14, 1995
5466956 Semiconductor integrated circuit device with electrode for measuring interlayer insulator capacitance Nov. 14, 1995
5451801 Adaptive configurable gate array Sep. 19, 1995
5448179 Screening of conductors and contacts on microelectronic devices Sep. 5, 1995
5422498 Apparatus for diagnosing interconnections of semiconductor integrated circuits Jun. 6, 1995
5418383 Semiconductor device capable of previously evaluating characteristics of power output element May. 23, 1995
5410162 Apparatus for and method of rapid testing of semiconductor components at elevated temperature Apr. 25, 1995
5410163 Semi-conductor integrated circuit device including connection and disconnection mechanisms to connect and disconnect monitor circuit and semiconductor integrated circuit from each other Apr. 25, 1995
5408131 Circuit identifier for use with focused ion beam equipment Apr. 18, 1995
5393991 Hybrid integrated circuit device having burn-in testing means Feb. 28, 1995
5391892 Semiconductor wafers having test circuitry for individual dies Feb. 21, 1995
5386127 Semiconductor device having groups of pads which receive the same signal Jan. 31, 1995
5351001 Microwave component test method and apparatus Sep. 27, 1994
5347145 Pad arrangement for a semiconductor device Sep. 13, 1994
5334857 Semiconductor device with test-only contacts and method for making the same Aug. 2, 1994
5334858 Semiconductor device of tab structure, capable of ensuring ease of testing of same in final form Aug. 2, 1994
5329139 Semiconductor integrated circuit device analyzable by using laser beam inducing current Jul. 12, 1994
5321277 Multi-chip module testing Jun. 14, 1994
5317188 Means for and methods of testing automated tape bonded semiconductor devices May. 31, 1994
5315130 Very high density wafer scale device architecture May. 24, 1994
5294812 Semiconductor device having identification region for carrying out failure analysis Mar. 15, 1994
5286656 Individualized prepackage AC performance testing of IC dies on a wafer using DC parametric test patterns Feb. 15, 1994
5285082 Integrated test circuits having pads provided along scribe lines Feb. 8, 1994
5262665 Semiconductor device with current sensing function Nov. 16, 1993
5258627 Semiconductor structure using protein as its active element Nov. 2, 1993
5254482 Ferroelectric capacitor test structure for chip die Oct. 19, 1993
5250841 Semiconductor device with test-only leads Oct. 5, 1993
5208841 Solid state imaging element with bus breakage detector May. 4, 1993
5179433 Breakdown evaluating test element Jan. 12, 1993
5165066 Contact chain structure for troubleshooting EPROM memory circuits Nov. 17, 1992
5157476 Tape carrier having improved test pads Oct. 20, 1992
5147084 Interconnection structure and test method Sep. 15, 1992
5144228 Probe interface assembly Sep. 1, 1992
5138418 Transistor structure for testing emitter-base junction Aug. 11, 1992
5138427 Semiconductor device having a particular structure allowing for voltage stress test application Aug. 11, 1992
5095267 Method of screening A.C. performance characteristics during D.C. parametric test operation Mar. 10, 1992
5089874 Semiconductor device with infrared mapping markers Feb. 18, 1992
5059899 Semiconductor dies and wafers and methods for making Oct. 22, 1991
5051690 Apparatus and method for detecting vertically propagated defects in integrated circuits Sep. 24, 1991
5037771 Method for implementing grid-based crosscheck test structures and the structures resulting therefrom Aug. 6, 1991
5036380 Burn-in pads for tab interconnects Jul. 30, 1991
5006792 Flip-chip test socket adaptor and method Apr. 9, 1991
5005071 Semiconductor device Apr. 2, 1991
5002895 Wire bonding method with a frame, for connecting an electronic component for testing and mounting Mar. 26, 1991











 
 
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