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Class Information
Number: 257/48
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Test or calibration structure
Description: Subject matter in which structures are provided on active solid-state devices to permit or facilitate the measurement, test, or calibration of the characteristics of the devices.










Patents under this class:

Patent Number Title Of Patent Date Issued
6194739 Inline ground-signal-ground (GSG) RF tester Feb. 27, 2001
6194787 Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrier Feb. 27, 2001
6191434 Semiconductor device measuring socket having socket position adjustment member Feb. 20, 2001
6187602 CMOS integrated circuit device and its inspecting method and device Feb. 13, 2001
6188234 Method of determining dielectric time-to-breakdown Feb. 13, 2001
6184569 Semiconductor chip inspection structures Feb. 6, 2001
6184576 Packaging and interconnection of contact structure Feb. 6, 2001
6181017 System for marking electrophoretic dies while reducing damage due to electrostatic discharge Jan. 30, 2001
6181143 Method for performing a high-temperature burn-in test on integrated circuits Jan. 30, 2001
6177733 Semiconductor device Jan. 23, 2001
6175124 Method and apparatus for a wafer level system Jan. 16, 2001
6175125 Semiconductor structure for testing vias interconnecting layers of the structure Jan. 16, 2001
6172413 Chip leads constrained in dielectric media Jan. 9, 2001
6169302 Determination of parasitic capacitance between the gate and drain/source local interconnect of a field effect transistor Jan. 2, 2001
6163063 Semiconductor device Dec. 19, 2000
6157045 Semiconductor device evaluation pattern and evaluation method Dec. 5, 2000
6157046 Semiconductor reliability test chip Dec. 5, 2000
6153891 Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die Nov. 28, 2000
6153892 Semiconductor device and method for manufacture thereof Nov. 28, 2000
6150669 Combination test structures for in-situ measurements during fabrication of semiconductor devices Nov. 21, 2000
6147361 Polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures with improved sensitivity Nov. 14, 2000
6147399 Backside exposure of desired nodes in a multi-layer integrated circuit Nov. 14, 2000
6144039 Low melting pads for instant electrical connections Nov. 7, 2000
6144040 Van der pauw structure to measure the resistivity of a doped area under diffusion areas and gate structures Nov. 7, 2000
6140665 Integrated circuit probe pad metal level Oct. 31, 2000
6137119 Apparatus for isolating a conductive region from a substrate during manufacture of an integrated circuit and connecting the conductive region to the substrate after manufacture Oct. 24, 2000
6133054 Method and apparatus for testing an integrated circuit Oct. 17, 2000
6133582 Methods and apparatuses for binning partially completed integrated circuits based upon test results Oct. 17, 2000
6130442 Memory chip containing a non-volatile memory register for permanently storing information about the quality of the device and test method therefor Oct. 10, 2000
6127194 Package removal for FBGA devices Oct. 3, 2000
6127694 Semiconductor wafer and method of manufacturing the same, and semiconductor device and test board of the same Oct. 3, 2000
6127729 Semiconductor chip with corner electrode terminals and detecting wiring for defect inspection Oct. 3, 2000
6127736 Microbump interconnect for semiconductor dice Oct. 3, 2000
6124634 Micromachined chip scale package Sep. 26, 2000
6121064 STI fill for SOI which makes SOI inspectable Sep. 19, 2000
6121631 Test structure to determine the effect of LDD length upon transistor performance Sep. 19, 2000
6121677 Reduced size integrated circuits and methods using test pads located in scribe regions of integrated circuits wafers Sep. 19, 2000
6118137 Test structure responsive to electrical signals for determining lithographic misalignment of conductors relative to vias Sep. 12, 2000
6118138 Reduced terminal testing system Sep. 12, 2000
6118185 Segmented box-in-box for improving back end overlay measurement Sep. 12, 2000
6111269 Circuit, structure and method of testing a semiconductor, such as an integrated circuit Aug. 29, 2000
6107111 Circuit and method for configuring a redundant bond pad for probing a semiconductor Aug. 22, 2000
6104082 Metallization structure for altering connections Aug. 15, 2000
6093933 Method and apparatus for fabricating electronic device Jul. 25, 2000
6094144 Method and apparatus for early detection of reliability degradation of electronic devices Jul. 25, 2000
6091079 Semiconductor wafer Jul. 18, 2000
6091080 Evaluation method for wirings of semiconductor device Jul. 18, 2000
6087675 Semiconductor device with an insulation film having emitter contact windows filled with polysilicon film Jul. 11, 2000
6087676 Multi-chip module system Jul. 11, 2000
6087733 Sacrificial erosion control features for chemical-mechanical polishing process Jul. 11, 2000











 
 
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