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Class Information
Number: 257/48
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Test or calibration structure
Description: Subject matter in which structures are provided on active solid-state devices to permit or facilitate the measurement, test, or calibration of the characteristics of the devices.










Patents under this class:

Patent Number Title Of Patent Date Issued
6309897 Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die Oct. 30, 2001
6309900 Test structures for testing planarization systems and methods for using same Oct. 30, 2001
6310361 Electrical test structure on a semiconductor substrate and test method Oct. 30, 2001
6303944 Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor device manufactured thereby Oct. 16, 2001
6300224 Methods of dicing semiconductor wafer into chips, and structure of groove formed in dicing area Oct. 9, 2001
6300647 Characteristic-evaluating storage capacitors Oct. 9, 2001
6301121 Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process Oct. 9, 2001
6297517 Semiconductor device and method of fabricating the same Oct. 2, 2001
6291833 Apparatus for mapping scratches in an oxide film Sep. 18, 2001
6291834 Semiconductor device and testing method therefor Sep. 18, 2001
6291835 Semiconductor device Sep. 18, 2001
6288411 Defect collecting structures for photolithography Sep. 11, 2001
6285040 Internal-logic inspection circuit Sep. 4, 2001
6281024 Semiconductor device inspection and analysis method and its apparatus and a method for manufacturing a semiconductor device Aug. 28, 2001
6281695 Integrated circuit package pin indicator Aug. 28, 2001
6282679 Pattern and method of metal line package level test for semiconductor device Aug. 28, 2001
6277659 Substrate removal using thermal analysis Aug. 21, 2001
6278128 Semiconductor device having external connection terminals formed in two-dimensional area Aug. 21, 2001
6278129 Corrosion sensitivity structures for vias and contact holes in integrated circuits Aug. 21, 2001
6274883 Structure of a ball grid array substrate with charts for indicating position of defective chips Aug. 14, 2001
6271539 Electrical diagnostic technique for silicon plasma-etch induced damage characterization Aug. 7, 2001
6268616 Electrical wiring board and method for identifying same Jul. 31, 2001
6265728 Compound semiconductor device and method for controlling characteristics of the same Jul. 24, 2001
6265729 Method for detecting and characterizing plasma-etch induced damage in an integrated circuit Jul. 24, 2001
6262434 Integrated circuit structures and methods to facilitate accurate measurement of the IC devices Jul. 17, 2001
6262435 Etch bias distribution across semiconductor wafer Jul. 17, 2001
6259115 Dummy patterning for semiconductor manufacturing processes Jul. 10, 2001
6255707 Semiconductor laser reliability test structure and method Jul. 3, 2001
6255727 Contact structure formed by microfabrication process Jul. 3, 2001
6255729 Multi chip package (MCP) applicable to failure analysis mode Jul. 3, 2001
6248602 Method and apparatus for automated rework within run-to-run control semiconductor manufacturing Jun. 19, 2001
6246072 Integrated circuit test pad Jun. 12, 2001
6246073 Semiconductor device and method for producing the same Jun. 12, 2001
6246074 Thin film transistor substrate with testing circuit Jun. 12, 2001
6246075 Test structures for monitoring gate oxide defect densities and the plasma antenna effect Jun. 12, 2001
6242757 Capacitor circuit structure for determining overlay error Jun. 5, 2001
6242817 Fabricated wafer for integration in a wafer structure Jun. 5, 2001
6240329 Method and apparatus for a semiconductor wafer inspection system using a knowledge-based system May. 29, 2001
6232618 Sensor with temperature-dependent measuring resistor and its use for temperature measurement May. 15, 2001
6232619 Dosage micro uniformity measurement in ion implantation May. 15, 2001
6232669 Contact structure having silicon finger contactors and total stack-up structure using same May. 15, 2001
6229206 Bonding pad test configuration May. 8, 2001
6229378 Using programmable jumpers to set an IC device's bit-encoded output during manufacturing and testing May. 8, 2001
6222206 Wafer having top and bottom emitting vertical-cavity lasers Apr. 24, 2001
6218202 Semiconductor device testing and burn-in methodology Apr. 17, 2001
6215129 Via alignment, etch completion, and critical dimension measurement method and structure Apr. 10, 2001
6215195 Wire bonding with capillary realignment Apr. 10, 2001
6212077 Built-in inspection template for a printed circuit Apr. 3, 2001
6204516 Method and apparatus for determining the robustness of memory cells to alpha-particle/cosmic ray induced soft errors Mar. 20, 2001
6194738 Method and apparatus for storage of test results within an integrated circuit Feb. 27, 2001











 
 
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