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Browse by Category: Main > Physics
Class Information
Number: 257/434
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Responsive to non-electrical signal (e.g., chemical, stress, light, or magnetic field sensors) > Electromagnetic or particle radiation > Light > With housing or encapsulation > With window means
Description: Subject matter with means to optically couple the light to the device through a transparent window.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8686428 Semiconductor device and structure Apr. 1, 2014
8686526 Semiconductor device and method of manufacturing the same Apr. 1, 2014
8686401 Ultraviolet irradiation apparatus Apr. 1, 2014
8680636 Package-type solid-state imaging apparatus with exhausting means Mar. 25, 2014
8669631 Solid state imaging device having a back surface impurity layer Mar. 11, 2014
8653728 Photoluminescent device Feb. 18, 2014
8637949 Camera module and manufacturing method thereof Jan. 28, 2014
8633051 Semiconductor device and method for manufacturing semiconductor device Jan. 21, 2014
8624383 Integrated circuit package and method for fabrication thereof Jan. 7, 2014
8624371 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Jan. 7, 2014
8624344 Solid state imaging device and method for manufacturing the same Jan. 7, 2014
8610255 Light emitting device package Dec. 17, 2013
8604599 Semiconductor housing and method for the production of a semiconductor housing Dec. 10, 2013
8592855 Light emitting device package including a substrate having at least two recessed surfaces Nov. 26, 2013
8592932 Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers Nov. 26, 2013
8587012 LED package and mold of manufacturing the same Nov. 19, 2013
8587107 Silicon carbide semiconductor Nov. 19, 2013
8564011 Light-emitting diode package structure Oct. 22, 2013
8558938 Camera module and manufacturing method thereof Oct. 15, 2013
8541809 Light-emitting surface element and method for producing a light-emitting surface element Sep. 24, 2013
8541857 Backside illumination CMOS image sensors and methods of manufacturing the same Sep. 24, 2013
8541859 Semiconductor light receiving element and method for manufacturing the same Sep. 24, 2013
8536672 Image sensor package and fabrication method thereof Sep. 17, 2013
8530812 Solid-state image pickup apparatus, electronic apparatus, and method of manufacturing a solid-state image pickup apparatus Sep. 10, 2013
8530925 Light emitting device package and lighting system including the same Sep. 10, 2013
8525323 Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package Sep. 3, 2013
8525285 Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture Sep. 3, 2013
8513757 Cover for image sensor assembly with light absorbing layer and alignment features Aug. 20, 2013
8507309 Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing m Aug. 13, 2013
8502334 Image sensor and method for manufacturing the same Aug. 6, 2013
8482012 Chip module package structure Jul. 9, 2013
8476726 Semiconductor device and method of manufacturing the semiconductor device Jul. 2, 2013
8466527 Semiconductor package and method of manufacturing the same Jun. 18, 2013
8455902 Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device Jun. 4, 2013
8450847 Optoelectronic semiconductor chip fitted with a carrier May. 28, 2013
8450770 Light emitting package structure May. 28, 2013
8450822 Thick bond pad for chip with cavity package May. 28, 2013
8445984 Micro-optical device packaging system May. 21, 2013
8440491 Methods of forming imager device with electric connections to electrical device May. 14, 2013
8426954 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Apr. 23, 2013
8421207 Semiconductor device, electronic apparatus, and manufacturing methods thereof Apr. 16, 2013
8421175 Wafer level packaged integrated circuit Apr. 16, 2013
8410511 Methods for high temperature processing of epitaxial chips Apr. 2, 2013
8410568 Integrated photodiode for semiconductor substrates Apr. 2, 2013
8410569 Solid-state imaging device and method for producing the same Apr. 2, 2013
8404513 Solar cell Mar. 26, 2013
8399945 Semiconductor light receiving element Mar. 19, 2013
8390003 Electronic element wafer module with reduced warping Mar. 5, 2013
8390047 Miniaturized implantable sensor platform having multiple devices and sub-chips Mar. 5, 2013
8390087 Image sensor package structure with large air cavity Mar. 5, 2013

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