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Class Information
Number: 257/418
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Responsive to non-electrical signal (e.g., chemical, stress, light, or magnetic field sensors) > Physical deformation > Strain sensors > With means to concentrate stress
Description: Subject matter wherein the active solid-state device has means to concentrate the physically deforming stress.










Sub-classes under this class:

Class Number Class Name Patents
257/419 With thinned central active portion of semiconductor surrounded by thick insensitive portion (e.g. diaphragm type strain gauge) 615


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8710600 Semiconductor pressure sensor Apr. 29, 2014
8692340 MEMS acoustic sensor with integrated back cavity Apr. 8, 2014
8659100 MEMS component having a diaphragm structure Feb. 25, 2014
8648432 Fully embedded micromechanical device, system on chip and method for manufacturing the same Feb. 11, 2014
8643128 Micro-electro-mechanical-system sensor and method for making same Feb. 4, 2014
8643127 Sensor device packaging Feb. 4, 2014
8643129 MEMS device Feb. 4, 2014
8629517 Wafer level packaging Jan. 14, 2014
8605920 Condenser microphone having flexure hinge diaphragm and method of manufacturing the same Dec. 10, 2013
8569850 Ultra low pressure sensor Oct. 29, 2013
8558643 Micromechanical device including N-type doping for providing temperature compensation and method of designing thereof Oct. 15, 2013
8541854 Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure Sep. 24, 2013
8530979 Semiconductor package and method for manufacturing the same Sep. 10, 2013
8530986 Manufacturing method of electronic device package, electronic device package, and oscillator Sep. 10, 2013
8519494 Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate Aug. 27, 2013
8519491 MEMS sensing device and method for making same Aug. 27, 2013
8466523 Differential pressure sensor device Jun. 18, 2013
8461656 Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS) Jun. 11, 2013
8445307 Monolithic IC and MEMS microfabrication process May. 21, 2013
8445977 Vibration transducer May. 21, 2013
8422702 Condenser microphone having flexure hinge diaphragm and method of manufacturing the same Apr. 16, 2013
8395227 MEMS device having a movable electrode Mar. 12, 2013
8384169 MEMS DC to DC switching converter Feb. 26, 2013
8383442 Methods for reduced stress anchors Feb. 26, 2013
8373240 Sensor device having a structure element Feb. 12, 2013
8363859 Microelectromechanical system microphone package structure Jan. 29, 2013
8362578 Triple-axis MEMS accelerometer Jan. 29, 2013
8350345 Three-dimensional input control device Jan. 8, 2013
8338825 Graphene/(multilayer) boron nitride heteroepitaxy for electronic device applications Dec. 25, 2012
8338898 Micro electro mechanical system (MEMS) microphone having a thin-film construction Dec. 25, 2012
8334159 MEMS pressure sensor using capacitive technique Dec. 18, 2012
8324007 Manufacturing method of an electronic device including overmolded MEMS devices Dec. 4, 2012
8299551 Semiconductor pressure sensor and method for manufacturing the same Oct. 30, 2012
8269291 Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters Sep. 18, 2012
8264051 Semiconductor device and manufacturing method of the same Sep. 11, 2012
8227879 Systems and methods for mounting inertial sensors Jul. 24, 2012
8207586 Substrate bonded MEMS sensor Jun. 26, 2012
8188556 Semiconductor sensor and method of manufacturing the same May. 29, 2012
8174085 Method of manufacturing MEMS sensor and MEMS sensor May. 8, 2012
8173471 Method for fabricating micro-electro-mechanical system (MEMS) device May. 8, 2012
8163584 Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure Apr. 24, 2012
8154094 Micromechanical component having a cap having a closure Apr. 10, 2012
8138556 Pre-released structure device Mar. 20, 2012
8138791 Stressed transistors with reduced leakage Mar. 20, 2012
8138560 Microstructure, micromachine, and manufacturing method of microstructure and micromachine Mar. 20, 2012
8120125 MEMS devices having overlying support structures Feb. 21, 2012
8115266 MEMS device having a movable electrode Feb. 14, 2012
8106471 Semiconductor dynamic quantity sensor and method of producing the same Jan. 31, 2012
8072081 Microelectromechanical system package Dec. 6, 2011
8044472 Nanotube and graphene semiconductor structures with varying electrical properties Oct. 25, 2011

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