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Class Information
Number: 257/276
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Field effect device > Junction field effect transistor (unipolar transistor) > Junction field effect transistor in integrated circuit > Microwave integrated circuit (e.g., microstrip type) > With contact or heat sink extending through hole in semiconductor substrate, or with electrode suspended over substrate (e.g., air bridge)
Description: Subject matter containing a hole in the semiconductor substrate and an electrical contact or a heat dissipation means extending through the hole.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8710548 Semiconductor device and method for manufacturing the same Apr. 29, 2014
8674473 Semiconductor cell and method for forming the same Mar. 18, 2014
8664743 Air-gap formation in interconnect structures Mar. 4, 2014
8637968 Stacked microelectronic assembly having interposer connecting active chips Jan. 28, 2014
8629566 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance Jan. 14, 2014
8618585 Semiconductor apparatus including cooling base with projections Dec. 31, 2013
8581385 Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same Nov. 12, 2013
8581411 Semiconductor device Nov. 12, 2013
8569871 Semiconductor device having a molded package Oct. 29, 2013
8564114 Semiconductor package thermal tape window frame for heat sink attachment Oct. 22, 2013
8564101 Semiconductor apparatus having a through-hole interconnection Oct. 22, 2013
8546910 Semiconductor structure and method for manufacturing the same Oct. 1, 2013
8536701 Electronic device packaging structure Sep. 17, 2013
8497534 Chip package with heavily doped regions and fabrication method thereof Jul. 30, 2013
8471367 Semiconductor device and method for manufacturing semiconductor device Jun. 25, 2013
8466542 Stacked microelectronic assemblies having vias extending through bond pads Jun. 18, 2013
8466486 Thermal management system for multiple heat source devices Jun. 18, 2013
8421201 Integrated circuit packaging system with underfill and methods of manufacture thereof Apr. 16, 2013
8395255 Semiconductor device having a cooling function component Mar. 12, 2013
8304271 Integrated circuit having a bulk acoustic wave device and a transistor Nov. 6, 2012
8299592 Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules Oct. 30, 2012
8227839 Integrated circuit having TSVS including hillock suppression Jul. 24, 2012
8227840 Integrated circuit device and method of forming the same Jul. 24, 2012
8217434 Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same Jul. 10, 2012
8106468 Process for fabricating silicon-on-nothing MOSFETs Jan. 31, 2012
8097906 Semiconductor device having finger electrodes Jan. 17, 2012
8084794 Semiconductor device and manufacturing method thereof Dec. 27, 2011
8058736 Semiconductor device having heat spreader with center opening Nov. 15, 2011
7989839 Method and apparatus for using light emitting diodes Aug. 2, 2011
7982280 Integrated circuits and interconnect structure for integrated circuits Jul. 19, 2011
7982279 Method of manufacturing stacked-type semiconductor device Jul. 19, 2011
7968918 Semiconductor package Jun. 28, 2011
7947566 Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate May. 24, 2011
7939834 Light- emitting device May. 10, 2011
7936048 Power transistor and power semiconductor device May. 3, 2011
7936045 Integrated circuit with multi-stage matching circuit May. 3, 2011
7935991 Semiconductor components with conductive interconnects May. 3, 2011
7923760 Dielectric spacers for metal interconnects and method to form the same Apr. 12, 2011
7919834 Edge seal for thru-silicon-via technology Apr. 5, 2011
7911068 Component and method for producing a component Mar. 22, 2011
7875911 Semiconductor device and oscillator Jan. 25, 2011
7863641 Method and apparatus for using light emitting diodes for the treatment of biological tissue Jan. 4, 2011
7842553 Cooling micro-channels Nov. 30, 2010
7839908 Mode control waveguide laser device Nov. 23, 2010
7833830 3D interconnect with protruding contacts Nov. 16, 2010
7833894 Devices and systems having at least one dam structure Nov. 16, 2010
7833890 Semiconductor device having a pair of fins and method of manufacturing the same Nov. 16, 2010
7825440 Suspended-membrane/suspended-substrate monolithic microwave integrated circuit modules Nov. 2, 2010
7825516 Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures Nov. 2, 2010
7821124 Thin, thermally enhanced flip chip in a leaded molded package Oct. 26, 2010

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