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Class Information
Number: 257/276
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Field effect device > Junction field effect transistor (unipolar transistor) > Junction field effect transistor in integrated circuit > Microwave integrated circuit (e.g., microstrip type) > With contact or heat sink extending through hole in semiconductor substrate, or with electrode suspended over substrate (e.g., air bridge)
Description: Subject matter containing a hole in the semiconductor substrate and an electrical contact or a heat dissipation means extending through the hole.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Sep. 8, 2009 |
| 7573081 |
Method to fabricate horizontal air columns underneath metal inductor |
Aug. 11, 2009 |
| 7560344 |
Semiconductor device having a pair of fins and method of manufacturing the same |
Jul. 14, 2009 |
| 7498622 |
Latchup robust gate array using through wafer via |
Mar. 3, 2009 |
| 7494909 |
Method of manufacturing a chip |
Feb. 24, 2009 |
| 7482261 |
Interconnect structure for BEOL applications |
Jan. 27, 2009 |
| 7476967 |
Composite carbon nanotube thermal interface device |
Jan. 13, 2009 |
| 7476918 |
Semiconductor integrated circuit device and vehicle-mounted radar system using the same |
Jan. 13, 2009 |
| 7465977 |
Method for producing a packaged integrated circuit |
Dec. 16, 2008 |
| 7457334 |
Semiconductor laser diode package |
Nov. 25, 2008 |
| 7391067 |
Hybrid microwave integrated circuit |
Jun. 24, 2008 |
| 7388277 |
Chip and wafer integration process using vertical connections |
Jun. 17, 2008 |
| 7352019 |
Capacitance reduction by tunnel formation for use with a semiconductor device |
Apr. 1, 2008 |
| 7338840 |
Method of forming a semiconductor die with heat and electrical pipes |
Mar. 4, 2008 |
| 7335931 |
Monolithic microwave integrated circuit compatible FET structure |
Feb. 26, 2008 |
| 7335599 |
Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate |
Feb. 26, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7285839 |
Coating of copper and silver air bridge structures to improve electromigration resistance and other applications |
Oct. 23, 2007 |
| 7262440 |
Light emitting diode package and fabrication method thereof |
Aug. 28, 2007 |
| 7238959 |
Phase change memory device employing thermally insulating voids and sloped trench, and a method of making same |
Jul. 3, 2007 |
| 7223992 |
Thermal conducting trench in a semiconductor structure |
May. 29, 2007 |
| 7214594 |
Method of making semiconductor device using a novel interconnect cladding layer |
May. 8, 2007 |
| 7208831 |
Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layer |
Apr. 24, 2007 |
| 7196403 |
Semiconductor package with heat spreader |
Mar. 27, 2007 |
| 7196406 |
ESD protection apparatus for an electrical device |
Mar. 27, 2007 |
| 7176578 |
Method for processing a thin film substrate |
Feb. 13, 2007 |
| 7095114 |
Semiconductor device with via hole group generating high frequency electromagnetic bonding, manufacturing method thereof, and monolithic microwave integrated circuit |
Aug. 22, 2006 |
| 7091534 |
Semiconductor device using low dielectric constant material film and method of fabricating the same |
Aug. 15, 2006 |
| 7091603 |
Semiconductor device |
Aug. 15, 2006 |
| 7075133 |
Semiconductor die with heat and electrical pipes |
Jul. 11, 2006 |
| 7075166 |
Coating of copper and silver air bridge structures to improve electromigration resistance and other applications |
Jul. 11, 2006 |
| 7053426 |
Semiconductor device with heat sink |
May. 30, 2006 |
| 7030448 |
Mask ROM and the method of forming the same and the scheme of reading the device |
Apr. 18, 2006 |
| 7026211 |
Semiconductor component and method of manufacture |
Apr. 11, 2006 |
| 7018020 |
Structure with through hole, production method thereof, and liquid discharge head |
Mar. 28, 2006 |
| 7012298 |
Non-volatile memory device |
Mar. 14, 2006 |
| 6992386 |
Semiconductor device and a method of manufacturing the same |
Jan. 31, 2006 |
| 6984855 |
Manufacturing method of semiconductor device and semiconductor device |
Jan. 10, 2006 |
| 6956255 |
Semiconductor device and drive circuit using the semiconductor devices |
Oct. 18, 2005 |
| 6909128 |
Capacitance reduction by tunnel formation for use with a semiconductor device |
Jun. 21, 2005 |
| 6903392 |
Semiconductor device and its manufacturing method |
Jun. 7, 2005 |
| 6900482 |
Semiconductor device having divided active regions with comb-teeth electrodes thereon |
May. 31, 2005 |
| 6888247 |
Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same |
May. 3, 2005 |
| 6876076 |
Multilayer semiconductor device for transmitting microwave signals and associated methods |
Apr. 5, 2005 |
| 6858888 |
Stress control of semiconductor microstructures for thin film growth |
Feb. 22, 2005 |
| 6841844 |
Air gaps copper interconnect structure |
Jan. 11, 2005 |
| 6818931 |
Chip design with power rails under transistors |
Nov. 16, 2004 |
| 6800886 |
Semiconductor device and method for fabricating the same |
Oct. 5, 2004 |
| 6774416 |
Small area cascode FET structure operating at mm-wave frequencies |
Aug. 10, 2004 |
| 6768143 |
Structure and method of making three finger folded field effect transistors having shared junctions |
Jul. 27, 2004 |
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