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Class Information
Number: 257/275
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Field effect device > Junction field effect transistor (unipolar transistor) > Junction field effect transistor in integrated circuit > Microwave integrated circuit (e.g., microstrip type)
Description: Subject matter structured to operate at microwave frequencies in an integrated circuit containing microwave components (e.g., microstrip transmission lines).

Sub-classes under this class:

Class Number Class Name Patents
257/277 With capacitive or inductive elements 162
257/276 With contact or heat sink extending through hole in semiconductor substrate, or with electrode suspended over substrate (e.g., air bridge) 222

Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8710548 Semiconductor device and method for manufacturing the same Apr. 29, 2014
8461005 Method of manufacturing doping patterns Jun. 11, 2013
8373210 Semiconductor device and semiconductor device manufacturing method Feb. 12, 2013
8344430 Multiple substrate electrical circuit device Jan. 1, 2013
8338866 Microwave semiconductor device using compound semiconductor and method for manufacturing the same Dec. 25, 2012
8304271 Integrated circuit having a bulk acoustic wave device and a transistor Nov. 6, 2012
8288864 Microwave module Oct. 16, 2012
8143654 Monolithic microwave integrated circuit with diamond layer Mar. 27, 2012
8097906 Semiconductor device having finger electrodes Jan. 17, 2012
8089107 Three-dimensional integrated device Jan. 3, 2012
8084793 Microwave semiconductor device using compound semiconductor and method for manufacturing the same Dec. 27, 2011
8049117 Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capaci Nov. 1, 2011
8039759 Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capaci Oct. 18, 2011
7973630 Thin film magnetic device and method of manufacturing the same Jul. 5, 2011
7939864 Inductive bond-wire circuit May. 10, 2011
7935990 RF power amplifier and method for packaging the same May. 3, 2011
7863653 Method of enhancing hole mobility Jan. 4, 2011
7859080 Electronic component comprising a coil conductor and a capacity element Dec. 28, 2010
7851832 Semiconductor device Dec. 14, 2010
7825440 Suspended-membrane/suspended-substrate monolithic microwave integrated circuit modules Nov. 2, 2010
7825005 Multiple substrate electrical circuit device Nov. 2, 2010
7787831 High-frequency switch Aug. 31, 2010
7777307 High-frequency signal transmission circuit device Aug. 17, 2010
7641316 Ink jet head circuit board, method of manufacturing the same and ink jet head using the same Jan. 5, 2010
7615863 Multi-dimensional wafer-level integrated antenna sensor micro packaging Nov. 10, 2009
7561853 Radio frequency switch Jul. 14, 2009
7538417 Semiconductor device with signal line having decreased characteristic impedance May. 26, 2009
7538394 Compound semiconductor switch circuit device May. 26, 2009
7535100 Wafer bonding of thinned electronic materials and circuits to high performance substrates May. 19, 2009
7476918 Semiconductor integrated circuit device and vehicle-mounted radar system using the same Jan. 13, 2009
7402853 BST integration using thin buffer layer grown directly onto SiO.sub.2/Si substrate Jul. 22, 2008
7391067 Hybrid microwave integrated circuit Jun. 24, 2008
7365683 Active smart antenna system and fabrication method thereof Apr. 29, 2008
7335931 Monolithic microwave integrated circuit compatible FET structure Feb. 26, 2008
7324043 Phase shifters deposited en masse for an electronically scanned antenna Jan. 29, 2008
7288417 On-chip signal transformer for ground noise isolation Oct. 30, 2007
7262470 Semiconductor device Aug. 28, 2007
7250626 Probe testing structure Jul. 31, 2007
7193255 Semiconductor device with floating conducting region placed between device elements Mar. 20, 2007
7166877 High frequency via Jan. 23, 2007
7126172 Integration of multiple gate dielectrics by surface protection Oct. 24, 2006
7109531 High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment Sep. 19, 2006
7102447 XO-buffer robust to interference Sep. 5, 2006
7095114 Semiconductor device with via hole group generating high frequency electromagnetic bonding, manufacturing method thereof, and monolithic microwave integrated circuit Aug. 22, 2006
7081648 Lossless co-planar wave guide in CMOS process Jul. 25, 2006
7030448 Mask ROM and the method of forming the same and the scheme of reading the device Apr. 18, 2006
7019401 Multi-layer substrate structure for reducing layout area Mar. 28, 2006
6993298 Programmable controller with RF wireless interface Jan. 31, 2006
6958517 Compact, all-layers-programmable integrated circuit arrangements Oct. 25, 2005
6946717 High voltage semiconductor device Sep. 20, 2005

1 2 3 4 5

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