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Class Information
Number: 257/208
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Gate arrays > With particular signal path connections
Description: Subject matter wherein the gate array is provided with specific signal path connections.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622757 |
Semiconductor device having multiple wiring layers |
Nov. 24, 2009 |
| 7605434 |
Semiconductor memory device to which test data is written |
Oct. 20, 2009 |
| 7606082 |
Semiconductor circuit, inverter circuit, semiconductor apparatus, and manufacturing method thereof |
Oct. 20, 2009 |
| 7601998 |
Semiconductor memory device having metallization comprising select lines, bit lines and word lines |
Oct. 13, 2009 |
| 7598543 |
Semiconductor memory component with body region of memory cell having a depression and a graded dopant concentration |
Oct. 6, 2009 |
| 7595561 |
Semiconductor device including multiple rows of peripheral circuit units |
Sep. 29, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7592649 |
Memory word lines with interlaced metal layers |
Sep. 22, 2009 |
| 7589362 |
Configurable non-volatile logic structure for characterizing an integrated circuit device |
Sep. 15, 2009 |
| 7586132 |
Power FET with low on-resistance using merged metal layers |
Sep. 8, 2009 |
| 7582921 |
Semiconductor device and method for patterning |
Sep. 1, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7573068 |
Transistor array substrate and display panel |
Aug. 11, 2009 |
| 7557449 |
Flexible via design to improve reliability |
Jul. 7, 2009 |
| 7554133 |
Pad current splitting |
Jun. 30, 2009 |
| 7550790 |
D/A conversion circuit and semiconductor device |
Jun. 23, 2009 |
| 7550788 |
Semiconductor device having fuse element arranged between electrodes formed in different wiring layers |
Jun. 23, 2009 |
| 7547977 |
Semiconductor chip having bond pads |
Jun. 16, 2009 |
| 7544977 |
Mixed-scale electronic interface |
Jun. 9, 2009 |
| 7540970 |
Methods of fabricating a semiconductor device |
Jun. 2, 2009 |
| 7535023 |
Display devices and power devices |
May. 19, 2009 |
| 7535035 |
Cross-point nonvolatile memory devices using binary metal oxide layer as data storage material layer and methods of fabricating the same |
May. 19, 2009 |
| 7535036 |
Semiconductor device and method of manufacturing the same |
May. 19, 2009 |
| 7525132 |
Semiconductor integrated circuit wiring design method and semiconductor integrated circuit |
Apr. 28, 2009 |
| 7521736 |
Electromechanical three-trace junction devices |
Apr. 21, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7514713 |
Liquid crystal display panel |
Apr. 7, 2009 |
| 7514292 |
Individualized low parasitic power distribution lines deposited over active integrated circuits |
Apr. 7, 2009 |
| 7495294 |
Flash devices with shared word lines |
Feb. 24, 2009 |
| 7491986 |
Semiconductor integrated circuit device |
Feb. 17, 2009 |
| 7488996 |
Thin film transistor array panel for a liquid crystal display |
Feb. 10, 2009 |
| 7482644 |
Integrated semiconductor memory and method for electrically stressing an integrated semiconductor memory |
Jan. 27, 2009 |
| 7479671 |
Thin film phase change memory cell formed on silicon-on-insulator substrate |
Jan. 20, 2009 |
| 7476943 |
Semiconductor device having diffusion layers as bit lines and method for manufacturing the same |
Jan. 13, 2009 |
| 7476915 |
Semiconductor integrated circuit including a first region and a second region |
Jan. 13, 2009 |
| 7468296 |
Thin film germanium diode with low reverse breakdown |
Dec. 23, 2008 |
| 7468551 |
Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
Dec. 23, 2008 |
| 7465974 |
Integrated circuit device and method for forming the same |
Dec. 16, 2008 |
| 7465975 |
Top layers of metal for high performance IC's |
Dec. 16, 2008 |
| 7466028 |
Semiconductor contact structure |
Dec. 16, 2008 |
| 7462895 |
Signal line for display device and thin film transistor array panel including the signal line |
Dec. 9, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7449731 |
Semiconductor gate circuit and delay circuit comprising series connected CMOS transistors |
Nov. 11, 2008 |
| 7446418 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 4, 2008 |
| 7436008 |
Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
Oct. 14, 2008 |
| 7425764 |
Top layers of metal for high performance IC's |
Sep. 16, 2008 |
| 7425735 |
Multi-layer phase-changeable memory devices |
Sep. 16, 2008 |
| 7425739 |
Nonvolatile semiconductor memory |
Sep. 16, 2008 |
| 7423300 |
Single-mask phase change memory element |
Sep. 9, 2008 |
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