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Class Information
Number: 257/208
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Gate arrays > With particular signal path connections
Description: Subject matter wherein the gate array is provided with specific signal path connections.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7468296 |
Thin film germanium diode with low reverse breakdown |
Dec. 23, 2008 |
| 7468551 |
Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
Dec. 23, 2008 |
| 7465974 |
Integrated circuit device and method for forming the same |
Dec. 16, 2008 |
| 7465975 |
Top layers of metal for high performance IC's |
Dec. 16, 2008 |
| 7466028 |
Semiconductor contact structure |
Dec. 16, 2008 |
| 7462895 |
Signal line for display device and thin film transistor array panel including the signal line |
Dec. 9, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7449731 |
Semiconductor gate circuit and delay circuit comprising series connected CMOS transistors |
Nov. 11, 2008 |
| 7446418 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 4, 2008 |
| 7436008 |
Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
Oct. 14, 2008 |
| 7425735 |
Multi-layer phase-changeable memory devices |
Sep. 16, 2008 |
| 7425739 |
Nonvolatile semiconductor memory |
Sep. 16, 2008 |
| 7425764 |
Top layers of metal for high performance IC's |
Sep. 16, 2008 |
| 7423300 |
Single-mask phase change memory element |
Sep. 9, 2008 |
| 7420229 |
Failure analysis vehicle for yield enhancement with self test at speed burnin capability for reliability testing |
Sep. 2, 2008 |
| 7417328 |
External power ring with multiple tapings to reduce IR drop in integrated circuit |
Aug. 26, 2008 |
| 7414275 |
Multi-level interconnections for an integrated circuit chip |
Aug. 19, 2008 |
| 7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
Aug. 12, 2008 |
| 7405450 |
Semiconductor devices having high conductivity gate electrodes with conductive line patterns thereon |
Jul. 29, 2008 |
| 7402846 |
Electrostatic discharge (ESD) protection structure and a circuit using the same |
Jul. 22, 2008 |
| 7402847 |
Programmable logic circuit and method of using same |
Jul. 22, 2008 |
| 7394156 |
Semiconductor integrated circuit device and method of producing the same |
Jul. 1, 2008 |
| 7394115 |
Semiconductor integrated circuit device having clock signal transmission line and wiring method thereof |
Jul. 1, 2008 |
| 7391114 |
Electrode pad section for external connection |
Jun. 24, 2008 |
| 7388292 |
Top layers of metal for high performance IC's |
Jun. 17, 2008 |
| 7385233 |
Gate array integrated circuit including a unit cell basic layer having gate terminal regions allowing two contact pads to be disposed laterally |
Jun. 10, 2008 |
| 7385291 |
Top layers of metal for high performance IC's |
Jun. 10, 2008 |
| 7378739 |
Capacitor and light emitting display using the same |
May. 27, 2008 |
| 7372164 |
Semiconductor device with parallel interconnects |
May. 13, 2008 |
| 7372144 |
High speed electronics interconnect and method of manufacture |
May. 13, 2008 |
| 7372085 |
Top layers of metal for high performance IC's |
May. 13, 2008 |
| 7372155 |
Top layers of metal for high performance IC's |
May. 13, 2008 |
| 7365376 |
Semiconductor integrated circuit |
Apr. 29, 2008 |
| 7358968 |
Sustain driver, sustain control system, and plasma display |
Apr. 15, 2008 |
| 7358613 |
Semiconductor device and method of manufacturing the same |
Apr. 15, 2008 |
| 7358610 |
Top layers of metal for high performance IC's |
Apr. 15, 2008 |
| 7358549 |
Multi-layered metal routing technique |
Apr. 15, 2008 |
| 7355217 |
MOS transistor structure with easy access to all nodes |
Apr. 8, 2008 |
| 7355220 |
Array substrate |
Apr. 8, 2008 |
| 7352059 |
Low loss interconnect structure for use in microelectronic circuits |
Apr. 1, 2008 |
| 7348640 |
Memory device |
Mar. 25, 2008 |
| 7339231 |
Semiconductor device and an integrated circuit card |
Mar. 4, 2008 |
| 7339210 |
Compound semiconductor switching circuit device |
Mar. 4, 2008 |
| 7335992 |
Semiconductor apparatus with improved yield |
Feb. 26, 2008 |
| 7332378 |
Integrated circuit memory system with dummy active region |
Feb. 19, 2008 |
| 7332762 |
Nonvolatile semiconductor memory |
Feb. 19, 2008 |
| 7332817 |
Die and die-package interface metallization and bump design and arrangement |
Feb. 19, 2008 |
| 7326972 |
Interconnect structure in integrated circuits |
Feb. 5, 2008 |
| 7323727 |
System with meshed power and signal buses on cell array |
Jan. 29, 2008 |
| 7321139 |
Transistor layout for standard cell with optimized mechanical stress effect |
Jan. 22, 2008 |
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