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Class Information
Number: 257/207
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Gate arrays > With particular power supply distribution means
Description: Subject matter wherein the gate array is provided with specific means to provide electrical power to the array.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612391 |
Semiconductor integrated circuit device |
Nov. 3, 2009 |
| 7606082 |
Semiconductor circuit, inverter circuit, semiconductor apparatus, and manufacturing method thereof |
Oct. 20, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7586132 |
Power FET with low on-resistance using merged metal layers |
Sep. 8, 2009 |
| 7573066 |
Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus |
Aug. 11, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7571415 |
Layout of power device |
Aug. 4, 2009 |
| 7569428 |
Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same |
Aug. 4, 2009 |
| 7557645 |
Semiconductor device |
Jul. 7, 2009 |
| 7557449 |
Flexible via design to improve reliability |
Jul. 7, 2009 |
| 7554133 |
Pad current splitting |
Jun. 30, 2009 |
| 7550788 |
Semiconductor device having fuse element arranged between electrodes formed in different wiring layers |
Jun. 23, 2009 |
| 7535023 |
Display devices and power devices |
May. 19, 2009 |
| 7525198 |
Wiring structure of a semiconductor device |
Apr. 28, 2009 |
| 7514292 |
Individualized low parasitic power distribution lines deposited over active integrated circuits |
Apr. 7, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7501710 |
Semiconductor integrated circuit and method of manufacturing the same |
Mar. 10, 2009 |
| 7498839 |
Low power zones for programmable logic devices |
Mar. 3, 2009 |
| 7491986 |
Semiconductor integrated circuit device |
Feb. 17, 2009 |
| 7479671 |
Thin film phase change memory cell formed on silicon-on-insulator substrate |
Jan. 20, 2009 |
| 7479666 |
Driving circuit of a liquid crystal display panel |
Jan. 20, 2009 |
| 7476915 |
Semiconductor integrated circuit including a first region and a second region |
Jan. 13, 2009 |
| 7468530 |
Structure and method for failure analysis in a semiconductor device |
Dec. 23, 2008 |
| 7465975 |
Top layers of metal for high performance IC's |
Dec. 16, 2008 |
| 7466028 |
Semiconductor contact structure |
Dec. 16, 2008 |
| 7465974 |
Integrated circuit device and method for forming the same |
Dec. 16, 2008 |
| 7459934 |
Semiconductor integrated circuit |
Dec. 2, 2008 |
| 7456447 |
Semiconductor integrated circuit device |
Nov. 25, 2008 |
| 7456659 |
Semiconductor integrated circuit |
Nov. 25, 2008 |
| 7453105 |
Integrated circuit power supply network |
Nov. 18, 2008 |
| 7446418 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 4, 2008 |
| 7439943 |
Electro-optical device, wiring substrate, and electronic apparatus |
Oct. 21, 2008 |
| 7436008 |
Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
Oct. 14, 2008 |
| 7425764 |
Top layers of metal for high performance IC's |
Sep. 16, 2008 |
| 7425735 |
Multi-layer phase-changeable memory devices |
Sep. 16, 2008 |
| 7423300 |
Single-mask phase change memory element |
Sep. 9, 2008 |
| 7417328 |
External power ring with multiple tapings to reduce IR drop in integrated circuit |
Aug. 26, 2008 |
| 7414275 |
Multi-level interconnections for an integrated circuit chip |
Aug. 19, 2008 |
| 7405450 |
Semiconductor devices having high conductivity gate electrodes with conductive line patterns thereon |
Jul. 29, 2008 |
| 7402846 |
Electrostatic discharge (ESD) protection structure and a circuit using the same |
Jul. 22, 2008 |
| 7399990 |
Wafer-level package having test terminal |
Jul. 15, 2008 |
| 7394156 |
Semiconductor integrated circuit device and method of producing the same |
Jul. 1, 2008 |
| 7391114 |
Electrode pad section for external connection |
Jun. 24, 2008 |
| 7388292 |
Top layers of metal for high performance IC's |
Jun. 17, 2008 |
| 7385273 |
Power semiconductor device |
Jun. 10, 2008 |
| 7385291 |
Top layers of metal for high performance IC's |
Jun. 10, 2008 |
| 7378739 |
Capacitor and light emitting display using the same |
May. 27, 2008 |
| 7372155 |
Top layers of metal for high performance IC's |
May. 13, 2008 |
| 7372085 |
Top layers of metal for high performance IC's |
May. 13, 2008 |
| 7372164 |
Semiconductor device with parallel interconnects |
May. 13, 2008 |
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