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Class Information
Number: 257/203
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Gate arrays > With particular chip input/output means
Description: Subject matter wherein the gate array integrated circuit is provided with specific means to input and output electrical signals to operate the device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7582921 |
Semiconductor device and method for patterning |
Sep. 1, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7573066 |
Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus |
Aug. 11, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7554133 |
Pad current splitting |
Jun. 30, 2009 |
| 7550790 |
D/A conversion circuit and semiconductor device |
Jun. 23, 2009 |
| 7531852 |
Electronic unit with a substrate where an electronic circuit is fabricated |
May. 12, 2009 |
| 7525132 |
Semiconductor integrated circuit wiring design method and semiconductor integrated circuit |
Apr. 28, 2009 |
| 7521735 |
Multiple layer and crystal plane orientation semiconductor substrate |
Apr. 21, 2009 |
| 7522405 |
High current electrical switch and method |
Apr. 21, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7514728 |
Semiconductor integrated circuit device using four-terminal transistors |
Apr. 7, 2009 |
| 7508238 |
Semiconductor integrated circuit device |
Mar. 24, 2009 |
| 7499340 |
Semiconductor memory device and defect remedying method thereof |
Mar. 3, 2009 |
| 7495269 |
Semiconductor device and electronic apparatus using the same |
Feb. 24, 2009 |
| 7491986 |
Semiconductor integrated circuit device |
Feb. 17, 2009 |
| 7492013 |
Systems and arrangements to interconnect components of a semiconductor device |
Feb. 17, 2009 |
| 7488994 |
Coiled circuit device and method of making the same |
Feb. 10, 2009 |
| 7488995 |
Semiconductor integrated circuit device and I/O cell for the same |
Feb. 10, 2009 |
| 7465971 |
Integrated circuit structures for increasing resistance to single event upset |
Dec. 16, 2008 |
| 7459779 |
Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package |
Dec. 2, 2008 |
| 7453159 |
Semiconductor chip having bond pads |
Nov. 18, 2008 |
| 7453105 |
Integrated circuit power supply network |
Nov. 18, 2008 |
| 7449752 |
Post passivation interconnection schemes on top of the IC chips |
Nov. 11, 2008 |
| 7446418 |
Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
Nov. 4, 2008 |
| 7422945 |
Cell based integrated circuit and unit cell architecture therefor |
Sep. 9, 2008 |
| 7420229 |
Failure analysis vehicle for yield enhancement with self test at speed burnin capability for reliability testing |
Sep. 2, 2008 |
| 7414275 |
Multi-level interconnections for an integrated circuit chip |
Aug. 19, 2008 |
| 7414323 |
Tab tape and method of manufacturing the same |
Aug. 19, 2008 |
| 7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
Aug. 12, 2008 |
| 7408262 |
Semiconductor integrated circuit device |
Aug. 5, 2008 |
| 7408209 |
Semiconductor device with noise control |
Aug. 5, 2008 |
| 7402846 |
Electrostatic discharge (ESD) protection structure and a circuit using the same |
Jul. 22, 2008 |
| 7399990 |
Wafer-level package having test terminal |
Jul. 15, 2008 |
| 7372155 |
Top layers of metal for high performance IC's |
May. 13, 2008 |
| 7365376 |
Semiconductor integrated circuit |
Apr. 29, 2008 |
| 7365377 |
Semiconductor integrated circuit device using four-terminal transistors |
Apr. 29, 2008 |
| 7358548 |
Semiconductor integrated circuit having layout in which buffers or protection circuits are arranged in concentrated manner |
Apr. 15, 2008 |
| 7355219 |
Integrated circuit with reduced coupling noise |
Apr. 8, 2008 |
| 7348640 |
Memory device |
Mar. 25, 2008 |
| 7348610 |
Multiple layer and crystal plane orientation semiconductor substrate |
Mar. 25, 2008 |
| 7345929 |
Semiconductor memory device and defect remedying method thereof |
Mar. 18, 2008 |
| 7339210 |
Compound semiconductor switching circuit device |
Mar. 4, 2008 |
| 7321140 |
Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier |
Jan. 22, 2008 |
| 7321139 |
Transistor layout for standard cell with optimized mechanical stress effect |
Jan. 22, 2008 |
| 7307293 |
Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths |
Dec. 11, 2007 |
| 7307295 |
Method and an apparatus for a hard-coded bit value changeable in any layer of metal |
Dec. 11, 2007 |
| 7291930 |
Input and output circuit of an integrated circuit chip |
Nov. 6, 2007 |
| 7285862 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Oct. 23, 2007 |
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