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Class Information
Number: 257/182
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Regenerative type switching device (e.g., scr, comfet, thyristor) > With housing or external electrode > With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, (e.g., ring) > With lead feedthrough means on side of housing
Description: Subject matter wherein means are provided on a side of the housing through which electrical leads extending to or from the device can be located.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710648 Wafer level packaging structure with large contact area and preparation method thereof Apr. 29, 2014
8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Apr. 22, 2014
8629060 Methods of forming through substrate interconnects Jan. 14, 2014
8456001 Pressure-contact semiconductor device Jun. 4, 2013
8446002 Multilayer wiring substrate having a castellation structure May. 21, 2013
8378462 Semiconductor device having through substrate vias Feb. 19, 2013
8344501 Multilayer wiring substrate having a castellation structure Jan. 1, 2013
8304889 Power semiconductor module and fabrication method thereof Nov. 6, 2012
8039363 Small chips with fan-out leads Oct. 18, 2011
7863737 Integrated circuit package system with wire bond pattern Jan. 4, 2011
7745944 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Jun. 29, 2010
7692293 Semiconductor switching module Apr. 6, 2010
7632718 Semiconductor power component with a vertical current path through a semiconductor power chip Dec. 15, 2009
7615852 Semiconductor component in a housing with mechanically inforcing flat conductor webs Nov. 10, 2009
7470939 Semiconductor device Dec. 30, 2008
7449726 Power semiconductor apparatus Nov. 11, 2008
7256431 Insulating substrate and semiconductor device having a thermally sprayed circuit pattern Aug. 14, 2007
7192868 Method of obtaining release-standing micro structures and devices by selective etch removal of protective and sacrificial layer using the same Mar. 20, 2007
7186664 Methods and structures for metal interconnections in integrated circuits Mar. 6, 2007
7164193 Optical semiconductor apparatus Jan. 16, 2007
6995409 Module for high voltage power for converting a base of IGBT components Feb. 7, 2006
6979843 Power semiconductor device Dec. 27, 2005
6914325 Power semiconductor module Jul. 5, 2005
6696709 Low voltage protection module Feb. 24, 2004
6686658 Semiconductor device, including an arrangement to provide a uniform press contact and converter using same Feb. 3, 2004
6605870 Pressure-contact type semiconductor device Aug. 12, 2003
6495924 Semiconductor device, including an arrangement to provide a uniform press contact and converter using same Dec. 17, 2002
6445013 Gate commutated turn-off semiconductor device Sep. 3, 2002
6369411 Semiconductor device for controlling high-power electricity with improved heat dissipation Apr. 9, 2002
6323547 Pressure contact type semiconductor device with ringshaped gate terminal Nov. 27, 2001
6166402 Pressure-contact type semiconductor element and power converter thereof Dec. 26, 2000
6081039 Pressure assembled motor cube Jun. 27, 2000
5866944 Multichip press-contact type semiconductor device Feb. 2, 1999
5777351 Compression bonded type semiconductor element and semiconductor device Jul. 7, 1998
5739556 Pressure contact housing for semiconductor components Apr. 14, 1998
5641976 Pressure contact type semiconductor device with axial bias and radial restraint between a distortion buffer plate and a semiconductor body Jun. 24, 1997
5635757 Power semiconductor module and circuit arrangement comprising at least two power semiconductor switch modules Jun. 3, 1997
5345096 Turn-off high-power semiconductor component with low inductive housing Sep. 6, 1994
5278434 Pressure engagement structure for a full press-pack type semiconductor device Jan. 11, 1994
5198882 Crimp-type power semiconductor device Mar. 30, 1993
5053854 Semiconductor components Oct. 1, 1991
5043795 Semiconductor device Aug. 27, 1991
4958215 Press-contact flat type semiconductor device Sep. 18, 1990
4956696 Compression loaded semiconductor device Sep. 11, 1990
4953004 Housing for a gate turn-off power thyristor (GTO) Aug. 28, 1990
4918514 Press-contact type semiconductor device Apr. 17, 1990
4843452 Thyrister housing gate lead and method of manufacturing same Jun. 27, 1989
4835119 Semiconductor device and a process of producing same May. 30, 1989
4757367 Light triggered semiconductor device with detachable auxiliary thyrister Jul. 12, 1988
4719500 Semiconductor device and a process of producing same Jan. 12, 1988

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