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Class Information
Number: 257/181
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Regenerative type switching device (e.g., scr, comfet, thyristor) > With housing or external electrode > With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, (e.g., ring)
Description: Subject matter wherein the housing is provided with large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element (e.g., ring).










Sub-classes under this class:

Class Number Class Name Patents
257/182 With lead feedthrough means on side of housing 59


Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8618557 Wide-band-gap reverse-blocking MOS-type semiconductor device Dec. 31, 2013
8456001 Pressure-contact semiconductor device Jun. 4, 2013
8421087 Semiconductor module including a switch and non-central diode Apr. 16, 2013
8304819 Semiconductor device including metal silicide layer and method for manufacturing the same Nov. 6, 2012
8304889 Power semiconductor module and fabrication method thereof Nov. 6, 2012
8283763 Power semiconductor module and fabrication method thereof Oct. 9, 2012
8222741 Semiconductor module with current connection element Jul. 17, 2012
8168985 Semiconductor module including a switch and non-central diode May. 1, 2012
8163651 Method of fabricating semiconductor substrate by use of heterogeneous substrate and recycling heterogeneous substrate during fabrication thereof Apr. 24, 2012
8143645 Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors Mar. 27, 2012
8072084 Integrated circuit, circuit system, and method of manufacturing Dec. 6, 2011
7948007 Power semiconductor module with flush terminal elements May. 24, 2011
7943956 Semiconductor device comprising a housing containing a triggering unit May. 17, 2011
7732817 Pattern formed structure, method of forming pattern, device, electrooptical device and electronic equipment Jun. 8, 2010
7705474 Connection structure for connecting flexible printed circuit to main substrate using a potting resin in a through-hole Apr. 27, 2010
7692293 Semiconductor switching module Apr. 6, 2010
7671382 Semiconductor device with thermoplastic resin to reduce warpage Mar. 2, 2010
7619289 MEMS switch and method for manufacturing the same Nov. 17, 2009
7615863 Multi-dimensional wafer-level integrated antenna sensor micro packaging Nov. 10, 2009
7582919 Functional coating of the SCFM preform Sep. 1, 2009
7420224 Active rectifier module for three-phase generators of vehicles Sep. 2, 2008
7397066 Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers Jul. 8, 2008
7262444 Power semiconductor packaging method and structure Aug. 28, 2007
7221004 Semiconductor module May. 22, 2007
7132698 Compression assembled electronic package having a plastic molded insulation ring Nov. 7, 2006
6995409 Module for high voltage power for converting a base of IGBT components Feb. 7, 2006
6933541 Emitter turn-off thyristors (ETO) Aug. 23, 2005
6930333 Semiconductor device wiring structure Aug. 16, 2005
6888234 Semiconductor device and manufacturing method for the same May. 3, 2005
6866255 Sputtered spring films with low stress anisotropy Mar. 15, 2005
6863769 Configuration and method for making contact with the back surface of a semiconductor substrate Mar. 8, 2005
6849879 Crosstalk reduction in a crosspoint thyristor switching array using a shielded dielectric stack Feb. 1, 2005
6831307 Semiconductor mounting system Dec. 14, 2004
6828600 Power semiconductor module with ceramic substrate Dec. 7, 2004
6781227 Compression assembled electronic package having a plastic molded insulation ring Aug. 24, 2004
6759735 High power semiconductor device having semiconductor chips Jul. 6, 2004
6710443 INTEGRATED CIRCUIT PROVIDING THERMALLY CONDUCTIVE STRUCTURES SUBSTANTIALLY HORIZONTALLY COUPLED TO ONE ANOTHER WITHIN ONE OR MORE HEAT DISSIPATION LAYERS TO DISSIPATE HEAT FROM A HEAT GENERATI Mar. 23, 2004
6686658 Semiconductor device, including an arrangement to provide a uniform press contact and converter using same Feb. 3, 2004
6683329 Semiconductor device with slot above guard ring Jan. 27, 2004
6614105 Chip-type semiconductor device Sep. 2, 2003
6504185 Compound semiconductor device and method for controlling characteristics of the same Jan. 7, 2003
6495924 Semiconductor device, including an arrangement to provide a uniform press contact and converter using same Dec. 17, 2002
6445013 Gate commutated turn-off semiconductor device Sep. 3, 2002
6423988 Pressure-contact semiconductor device Jul. 23, 2002
6373129 Semiconductor apparatus with pressure contact semiconductor chips Apr. 16, 2002
6369411 Semiconductor device for controlling high-power electricity with improved heat dissipation Apr. 9, 2002
6365965 Power semiconductor module with terminals having holes for better adhesion Apr. 2, 2002
6323547 Pressure contact type semiconductor device with ringshaped gate terminal Nov. 27, 2001
6320254 Plug structure Nov. 20, 2001
6307239 CMOS sense structure having silicon dioxide outer ring around sense region Oct. 23, 2001

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