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Class Information
Number: 257/178
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Regenerative type switching device (e.g., scr, comfet, thyristor) > With housing or external electrode > With means to avoid stress between electrode and active device (e.g., thermal expansion matching of electrode to semiconductor)
Description: Subject matter wherein the device has electrode means connected to its terminals and is further provided with means to avoid creation of stress between the active device and the electrode means.










Sub-classes under this class:

Class Number Class Name Patents
257/179 With malleable electrode (e.g., silver electrode layer) 21


Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8624391 Chip design with robust corner bumps Jan. 7, 2014
8558290 Semiconductor device with dual metal silicide regions and methods of making same Oct. 15, 2013
8354692 Vertical semiconductor power switch, electronic component and methods of producing the same Jan. 15, 2013
8354720 Embedded stressor for semiconductor structures Jan. 15, 2013
8338258 Embedded stressor for semiconductor structures Dec. 25, 2012
8304889 Power semiconductor module and fabrication method thereof Nov. 6, 2012
8283763 Power semiconductor module and fabrication method thereof Oct. 9, 2012
8232160 Phase change memory device and method of manufacturing the same Jul. 31, 2012
8129746 Phase change memory device and method of manufacturing the same Mar. 6, 2012
8110736 Thermoelectric element device and thermoelectric module Feb. 7, 2012
8072084 Integrated circuit, circuit system, and method of manufacturing Dec. 6, 2011
8044431 Microdisplay packaging system Oct. 25, 2011
8035127 Packaging substrate structure with a semiconductor chip embedded therein Oct. 11, 2011
7943961 Strain bars in stressed layers of MOS devices May. 17, 2011
7923645 Metal etch stop fabrication method and structure Apr. 12, 2011
7868336 Semiconductor device and method of manufacturing the same Jan. 11, 2011
7863646 Dual oxide stress liner Jan. 4, 2011
7847318 Multilayer build-up wiring board including a chip mount region Dec. 7, 2010
7833830 3D interconnect with protruding contacts Nov. 16, 2010
7781851 Semiconductor device having reduced die-warpage and method of manufacturing the same Aug. 24, 2010
7692293 Semiconductor switching module Apr. 6, 2010
7615477 Method of fabricating a BGA package having decreased adhesion Nov. 10, 2009
7582919 Functional coating of the SCFM preform Sep. 1, 2009
7521276 Compliant terminal mountings with vented spaces and methods Apr. 21, 2009
7511362 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument Mar. 31, 2009
7470939 Semiconductor device Dec. 30, 2008
7470979 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument Dec. 30, 2008
7453139 Compliant terminal mountings with vented spaces and methods Nov. 18, 2008
7449726 Power semiconductor apparatus Nov. 11, 2008
7262507 Semiconductor-mounted device and method for producing same Aug. 28, 2007
7256431 Insulating substrate and semiconductor device having a thermally sprayed circuit pattern Aug. 14, 2007
7227198 Half-bridge package Jun. 5, 2007
7187074 Semiconductor and electronic device with spring terminal Mar. 6, 2007
7084517 Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit Aug. 1, 2006
7045831 Semiconductor device May. 16, 2006
7046155 Fault detection system May. 16, 2006
7009292 Package type semiconductor device Mar. 7, 2006
6949828 Wiring structure having integral wiring portion and plug portion and method of forming the same Sep. 27, 2005
6870266 Oxide semiconductor electrode and process for producing the same Mar. 22, 2005
6787815 High-isolation semiconductor device Sep. 7, 2004
6495924 Semiconductor device, including an arrangement to provide a uniform press contact and converter using same Dec. 17, 2002
6399891 Multilayer boards Jun. 4, 2002
6087682 High power semiconductor module device Jul. 11, 2000
6081039 Pressure assembled motor cube Jun. 27, 2000
5874774 Flat package semiconductor device Feb. 23, 1999
5866944 Multichip press-contact type semiconductor device Feb. 2, 1999
5739556 Pressure contact housing for semiconductor components Apr. 14, 1998
5721455 Semiconductor device having a thermal resistance detector in the heat radiating path Feb. 24, 1998
5641976 Pressure contact type semiconductor device with axial bias and radial restraint between a distortion buffer plate and a semiconductor body Jun. 24, 1997
5635734 Insulated gate type semiconductor device in which the reliability and characteristics thereof are not deteriorated due to pressing action and power inverter using the same Jun. 3, 1997

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