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Class Information
Number: 252/79.4
Name: Compositions > Etching or brightening compositions > Inorganic acid containing > With organic material
Description: Compositions which contain an organic material in addition to the acid.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6372027 |
Process for promoting adhesion between an inorganic substrate and an organic polymer |
Apr. 16, 2002 |
| 6361712 |
Composition for selective etching of oxides over metals |
Mar. 26, 2002 |
| 6358853 |
Ceria based slurry for chemical-mechanical polishing |
Mar. 19, 2002 |
| 6337029 |
Method and composition for etching glass ceramic and porcelain surfaces |
Jan. 8, 2002 |
| 6331487 |
Removal of polishing residue from substrate using supercritical fluid process |
Dec. 18, 2001 |
| 6328905 |
Residue removal by CO2 water rinse in conjunction with post metal etch plasma strip |
Dec. 11, 2001 |
| 6316370 |
Method for etching doped polysilicon with high selectivity to undoped polysilicon |
Nov. 13, 2001 |
| 6312487 |
Polishing compound and an edge polishing method thereby |
Nov. 6, 2001 |
| 6309560 |
Chemical mechanical polishing slurry useful for copper substrates |
Oct. 30, 2001 |
| 6306775 |
Methods of selectively etching polysilicon relative to at least one of deposited oxide, thermally grown oxide and nitride, and methods of selectively etching polysilicon relative to BPSG |
Oct. 23, 2001 |
| 6299795 |
Polishing slurry |
Oct. 9, 2001 |
| 6294105 |
Chemical mechanical polishing slurry and method for polishing metal/oxide layers |
Sep. 25, 2001 |
| 6284151 |
Chemical mechanical polishing slurry for tungsten |
Sep. 4, 2001 |
| 6280651 |
Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent |
Aug. 28, 2001 |
| 6277753 |
Removal of CMP residue from semiconductors using supercritical carbon dioxide process |
Aug. 21, 2001 |
| 6261969 |
Method of manufacturing semiconductor apparatus and apparatus thereof |
Jul. 17, 2001 |
| 6245251 |
Method for production of slide fastener or stringers thereof |
Jun. 12, 2001 |
| 6234875 |
Method of modifying a surface |
May. 22, 2001 |
| 6224785 |
Aqueous ammonium fluoride and amine containing compositions for cleaning inorganic residues on semiconductor substrates |
May. 1, 2001 |
| 6200909 |
Method for selective etching of antireflective coatings |
Mar. 13, 2001 |
| 6197212 |
Kit for use in the conditioning of dental cavities |
Mar. 6, 2001 |
| 6190443 |
Polishing composition |
Feb. 20, 2001 |
| 6177026 |
CMP slurry containing a solid catalyst |
Jan. 23, 2001 |
| 6174454 |
Slurry formulation for selective CMP of organic spin-on-glass insulating layer with low dielectric constant |
Jan. 16, 2001 |
| 6159865 |
Wafer treating solution and method for preparing the same |
Dec. 12, 2000 |
| 6149828 |
Supercritical etching compositions and method of using same |
Nov. 21, 2000 |
| 6147002 |
Process for removing contaminant from a surface and composition useful therefor |
Nov. 14, 2000 |
| 6136218 |
Planarization fluid composition including chelating agents |
Oct. 24, 2000 |
| 6126853 |
Chemical mechanical polishing slurry useful for copper substrates |
Oct. 3, 2000 |
| 6120697 |
Method of etching using hydrofluorocarbon compounds |
Sep. 19, 2000 |
| 6107166 |
Vapor phase cleaning of alkali and alkaline earth metals |
Aug. 22, 2000 |
| 6095161 |
Processing and post-processing compositions and methods of using same |
Aug. 1, 2000 |
| 6096652 |
Method of chemical mechanical planarization using copper coordinating ligands |
Aug. 1, 2000 |
| 6090766 |
Stone cleaning agent and preparation thereof |
Jul. 18, 2000 |
| 6086779 |
Copper etching compositions and method for etching copper |
Jul. 11, 2000 |
| 6083840 |
Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys |
Jul. 4, 2000 |
| 6074949 |
Method of preventing copper dendrite formation and growth |
Jun. 13, 2000 |
| 6074566 |
Thin film inductive write head with minimal organic insulation material and method for its manufacture |
Jun. 13, 2000 |
| 6071827 |
Method for manufacturing semiconductor devices |
Jun. 6, 2000 |
| 6068788 |
Wafer-cleaning solution and process for the production thereof |
May. 30, 2000 |
| 6066267 |
Etching of silicon nitride |
May. 23, 2000 |
| 6063306 |
Chemical mechanical polishing slurry useful for copper/tantalum substrate |
May. 16, 2000 |
| 6044851 |
Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication |
Apr. 4, 2000 |
| 6042741 |
Composition for polishing a composite of silica and silicon nitride |
Mar. 28, 2000 |
| 6039891 |
Multi-oxidizer precursor for chemical mechanical polishing |
Mar. 21, 2000 |
| 6033996 |
Process for removing etching residues, etching mask and silicon nitride and/or silicon dioxide |
Mar. 7, 2000 |
| 6033596 |
Multi-oxidizer slurry for chemical mechanical polishing |
Mar. 7, 2000 |
| 6027571 |
Surface treatment for micromachining |
Feb. 22, 2000 |
| 6017463 |
Point of use mixing for LI/plug tungsten polishing slurry to improve existing slurry |
Jan. 25, 2000 |
| 6010966 |
Hydrocarbon gases for anisotropic etching of metal-containing layers |
Jan. 4, 2000 |
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