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Browse by Category: Main > Material Science
Class Information
Number: 228/904
Name: Metal fusion bonding > Wire bonding
Description: Art collection of the process peculiar to the uniting of small, elongated strands.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8684258 Process for reducing aluminium pick-up, and ultrasonic welding device Apr. 1, 2014
8678266 Wire bonding method Mar. 25, 2014
8657180 Bond pad assessment for wire bonding Feb. 25, 2014
8540135 Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same Sep. 24, 2013
8505805 Systems and methods for platinum ball bonding Aug. 13, 2013
8434669 Universal bond head for wire bonders May. 7, 2013
8313015 Gas delivery system for reducing oxidation in wire bonding operations Nov. 20, 2012
8302841 Wire payout measurement and calibration techniques for a wire bonding machine Nov. 6, 2012
8267303 Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds Sep. 18, 2012
8225982 Dual capillary IC wirebonding Jul. 24, 2012
8181845 Electrical bond connection system May. 22, 2012
8152046 Conductive bumps, wire loops, and methods of forming the same Apr. 10, 2012
8100317 Method of teaching eyepoints for wire bonding and related semiconductor processing operations Jan. 24, 2012
8016183 Adjustable clamp system and method for wire bonding die assembly Sep. 13, 2011
8008183 Dual capillary IC wirebonding Aug. 30, 2011
7975899 Work clamp and wire bonding apparatus Jul. 12, 2011
7954689 Vacuum wire tensioner for wire bonder Jun. 7, 2011
7931186 Method of teaching eyepoints for wire bonding and related semiconductor processing operations Apr. 26, 2011
7918378 Wire bonding deflector for a wire bonder Apr. 5, 2011
7817846 Method of correcting bonding coordinates using reference bond pads Oct. 19, 2010
7789289 Holding tool for fixing an electronic component and circular table manufacturing unit Sep. 7, 2010
7681775 Multi-layer thermal insulation for a bonding system Mar. 23, 2010
7658314 Tail wire cutting method and bonding apparatus Feb. 9, 2010
7621436 Wire bonding method Nov. 24, 2009
7614540 Thermal insulation for a bonding tool Nov. 10, 2009
7581666 Wire-bonding method for wire-bonding apparatus Sep. 1, 2009
7578421 Horn-holder pivot type bonding apparatus Aug. 25, 2009
7575147 Compliant wirebond pedestal Aug. 18, 2009
7565995 Roller wire brake for wire bonding machine Jul. 28, 2009
7549569 Wire clamp gap control mechanism and method Jun. 23, 2009
7527186 Method and apparatus for mapping a position of a capillary tool tip using a prism May. 5, 2009
7389805 Bonding arm swinging type bonding apparatus Jun. 24, 2008
7262124 Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus Aug. 28, 2007
7138328 Packaged IC using insulated wire Nov. 21, 2006
6877650 Compliant wirebond pedestal Apr. 12, 2005
6311890 Concave face wire bond capillary Nov. 6, 2001
6165888 Two step wire bond process Dec. 26, 2000
6158647 Concave face wire bond capillary Dec. 12, 2000
6089439 Wire cutting and feeding device for use in wire bonding apparatus Jul. 18, 2000
6080651 Wire bonding method Jun. 27, 2000
5945065 Method for wedge bonding using a gold alloy wire Aug. 31, 1999
5838071 Wire bonding method, wire bonding apparatus and semiconductor device produced by the same Nov. 17, 1998
5829663 Self locking key for ultrasonic transducers Nov. 3, 1998
5776786 Method for wire-bonding a covered wire Jul. 7, 1998
5637274 Palladium alloy thin wire for wire bonding semiconductor elements Jun. 10, 1997
5603445 Ultrasonic wire bonder and transducer improvements Feb. 18, 1997
5550083 Process of wirebond pad repair and reuse Aug. 27, 1996
5538685 Palladium bonding wire for semiconductor device Jul. 23, 1996
5538685 Palladium bonding wire for semiconductor device Jul. 23, 1996
5514912 Method for connecting semiconductor material and semiconductor device used in connecting method May. 7, 1996

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