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Class Information
Number: 228/8
Name: Metal fusion bonding > With control means responsive to sensed condition
Description: Device including means for: (1) detecting any of the following characteristics: a state or property, a change in a state or property, or the occurrence of a predetermined event, in any of the following: the work, the product of a machine, the machine itself, any part of the machine, or the environment of the machine affecting the operation thereof; and (2) initiating (as a direct result of such detection) a force or energy impulse other than that generated or transmitted by the detecting means; and (3) regulating or modifying (as a direct result of such initiation) the operation of said machine.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7617962 |
Conductive ball mounting method, and apparatus therefor |
Nov. 17, 2009 |
| 7597234 |
Method for mounting a flip chip on a substrate |
Oct. 6, 2009 |
| 7591408 |
Camera-assisted adjustment of bonding head elements |
Sep. 22, 2009 |
| 7493191 |
Auxiliary control apparatus for micro-manipulators used in ultrasonic bonding machines |
Feb. 17, 2009 |
| 7475801 |
Systems for providing controlled power to ultrasonic welding probes |
Jan. 13, 2009 |
| 7461768 |
Camera-assisted adjustment of bonding head elements |
Dec. 9, 2008 |
| 7413106 |
Method for fixing a miniaturized component to a carrier plate |
Aug. 19, 2008 |
| 7407081 |
Methods and apparatus for transferring conductive pieces during semiconductor device fabrication |
Aug. 5, 2008 |
| 7392924 |
Automated ball mounting process and system with solder ball testing |
Jul. 1, 2008 |
| 7387229 |
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore |
Jun. 17, 2008 |
| 7380697 |
Welding condition monitoring device |
Jun. 3, 2008 |
| 7353976 |
Wire bonder |
Apr. 8, 2008 |
| 7299963 |
Temperature sensor for combustion nailer |
Nov. 27, 2007 |
| 7296727 |
Apparatus and method for mounting electronic components |
Nov. 20, 2007 |
| 7296725 |
Feed devices and methods for injection molded solder systems |
Nov. 20, 2007 |
| 7255259 |
Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication |
Aug. 14, 2007 |
| 7219419 |
Component mounting apparatus including a polishing device |
May. 22, 2007 |
| 7131565 |
Feed devices and methods for injection molded solder systems |
Nov. 7, 2006 |
| 7121449 |
Method and device for applying material to a workpiece |
Oct. 17, 2006 |
| 7104433 |
Safety apparatus of air impact driver |
Sep. 12, 2006 |
| 7096912 |
Bonding apparatus |
Aug. 29, 2006 |
| 7086576 |
Machine for constructing the side wall of a cylindrical tank |
Aug. 8, 2006 |
| 7083077 |
Method and contact point for establishing an electrical connection |
Aug. 1, 2006 |
| 7044354 |
Soldering system with indicator lights displaying system status |
May. 16, 2006 |
| 7017792 |
Integrated piping plate, machining method for same, machining apparatus for same, and machining equipment for same |
Mar. 28, 2006 |
| 7014092 |
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconduc |
Mar. 21, 2006 |
| 7004370 |
Device and method for determining parameters of a welding system |
Feb. 28, 2006 |
| 6983538 |
Method of mounting component on a circuit board |
Jan. 10, 2006 |
| 6983872 |
Substrate alignment method and apparatus |
Jan. 10, 2006 |
| 6935551 |
Ultrasonic bonding method of coated electric wires and ultrasonic bonding apparatus using same |
Aug. 30, 2005 |
| 6913183 |
Selective gas knife for wave soldering |
Jul. 5, 2005 |
| 6910615 |
Solder reflow type electrical apparatus packaging having integrated circuit and discrete components |
Jun. 28, 2005 |
| 6886732 |
Friction stir welding device with detector for detecting torque current of friction stir welding tool |
May. 3, 2005 |
| 6871772 |
Wire bonding apparatus |
Mar. 29, 2005 |
| 6827248 |
Cutting device for bonded wires |
Dec. 7, 2004 |
| 6815120 |
Battery electrode and manufacturing method and apparatus for the same |
Nov. 9, 2004 |
| 6796483 |
Method and device for producing a soldered joint |
Sep. 28, 2004 |
| 6789720 |
Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
Sep. 14, 2004 |
| 6786385 |
Semiconductor device with gold bumps, and method and apparatus of producing the same |
Sep. 7, 2004 |
| 6779703 |
Method and device for pressing workpiece |
Aug. 24, 2004 |
| 6758382 |
Auto-adjustable tool for self-reacting and conventional friction stir welding |
Jul. 6, 2004 |
| 6729528 |
Recognition device, bonding device, and method of manufacturing a circuit device |
May. 4, 2004 |
| 6722553 |
Controlled and programmed deposition of flux on a flip-chip die by spraying |
Apr. 20, 2004 |
| 6715660 |
Recognition device, bonding device, and method of manufacturing a circuit device |
Apr. 6, 2004 |
| 6708863 |
Heat bonding method and heat bonding device |
Mar. 23, 2004 |
| 6691908 |
Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed |
Feb. 17, 2004 |
| 6688511 |
Wave solder apparatus and method |
Feb. 10, 2004 |
| 6676006 |
Flux supply device in which liquid flux is supplied through liquid holding portion, and liquid flux supply method |
Jan. 13, 2004 |
| 6673178 |
Method for the constant maintenance of the mean gap width between a sonotrode of an ultrasonic system and a tool of an ultrasonic cutting device designed as a counter surface |
Jan. 6, 2004 |
| 6669076 |
Wire bonding device |
Dec. 30, 2003 |
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