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Browse by Category: Main > Material Science
Class Information
Number: 228/6.2
Name: Metal fusion bonding > With means to juxtapose and bond plural workpieces > Plural discrete workpieces > With electrical connection made at joint
Description: Apparatus wherein the discrete workpieces are electrical devices such that the bonded joint provides and electrically conductive path therebetween.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8646676 Electronic component mounting system and electronic component mounting method Feb. 11, 2014
8622276 Assembly jig for a semiconductor device and assembly method for a semiconductor device Jan. 7, 2014
8517245 Automatic soldering machine Aug. 27, 2013
8387851 Apparatus for aligning a bonding tool of a die bonder Mar. 5, 2013
8317076 Minute ball array apparatus Nov. 27, 2012
8231044 Solar substrate ribbon bonding system Jul. 31, 2012
8209858 Method for mounting electronic components on a support Jul. 3, 2012
8210417 Bonding apparatus Jul. 3, 2012
8196798 Solar substrate ribbon bonding system Jun. 12, 2012
8104667 Method for connecting a component with a substrate Jan. 31, 2012
8070048 Method of attaching a solder ball and method of repairing a memory module Dec. 6, 2011
7982227 Light emitting diode package Jul. 19, 2011
7975898 Joining method and reflow apparatus Jul. 12, 2011
7942305 Soldering apparatus May. 17, 2011
7882997 Method and device for mutual contacting of two wafers Feb. 8, 2011
7836583 Integrated circuit dismounter Nov. 23, 2010
7743963 Solderable lid or cover for an electronic circuit Jun. 29, 2010
7703657 Device for mounting electric component Apr. 27, 2010
7597232 Apparatus for applying conductive paste onto electronic component Oct. 6, 2009
7401393 Method for removing solder bumps from LSI Jul. 22, 2008
7357288 Component connecting apparatus Apr. 15, 2008
7308999 Die bonding apparatus Dec. 18, 2007
7296727 Apparatus and method for mounting electronic components Nov. 20, 2007
7222772 Flip chip bonder May. 29, 2007
7222773 Semiconductor bonding apparatus May. 29, 2007
7103959 Conduit for preventing oxidation of a electronic device Sep. 12, 2006
7014092 Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconduc Mar. 21, 2006
6966480 Concave face wire bond capillary and method Nov. 22, 2005
6935548 Dissipative ceramic bonding tool tip Aug. 30, 2005
6889427 Process for disengaging semiconductor die from an adhesive film May. 10, 2005
6857551 Auto-feed terminal wire clamping machine and its terminal structure Feb. 22, 2005
6820793 Apparatus for the transport and equipping of substrates with semiconductor chips Nov. 23, 2004
6814274 Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method Nov. 9, 2004
6761304 Heating head for soldering and de-soldering of SMD components Jul. 13, 2004
6742694 Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus Jun. 1, 2004
6739045 Method for removing solder bumps from LSI May. 25, 2004
6722029 Method of mounting an electrical component to a support Apr. 20, 2004
6715666 Wire bonding method, method of forming bump and bump Apr. 6, 2004
6708862 Die bonding apparatus Mar. 23, 2004
6651864 Dissipative ceramic bonding tool tip Nov. 25, 2003
6581817 Die bonding device Jun. 24, 2003
6555418 Method for separating a semiconductor element in a semiconductor element pushing-up device Apr. 29, 2003
6550669 Integral heating nozzle and pickup tube Apr. 22, 2003
6513236 Method of manufacturing bump-component mounted body and device for manufacturing the same Feb. 4, 2003
6505823 Apparatus for positioning a semiconductor pellet Jan. 14, 2003
6422452 Method and apparatus for lining up micro-balls Jul. 23, 2002
6412680 Dual-in-line BGA ball mounter Jul. 2, 2002
6409642 Assembling device Jun. 25, 2002
6401330 Apparatus for mounting an integrated circuit onto a printed circuit board and then testing the integrated circuit Jun. 11, 2002
6402009 Apparatus and method for shaping lead frame for semiconductor device and lead frame for semiconductor device Jun. 11, 2002

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