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Browse by Category: Main > Material Science
Class Information
Number: 228/56.5
Name: Metal fusion bonding > With signal, indicator, gauge, or stop
Description: Device having means for either:


Patents under this class:
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Patent Number Title Of Patent Date Issued
6962281 Bonding apparatus and bonding method having process for judging bonding state Nov. 8, 2005
6899264 Apparatus for producing a sleeve-shaped printing form May. 31, 2005
6691908 Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed Feb. 17, 2004
6412682 Wave soldering method and system used for the method Jul. 2, 2002
6409069 Apparatus for manufacturing unit elements for chip components, and chip components mounting structure Jun. 25, 2002
6382497 Reflow soldering apparatus and method May. 7, 2002
6273319 Wave soldering method and system used for the method Aug. 14, 2001
6172318 Base for wire bond checking Jan. 9, 2001
6149047 Die-bonding machine Nov. 21, 2000
6119915 Alignment fixture for solder-wave machines Sep. 19, 2000
6085960 Apparatus for measuring the height of a solder wave Jul. 11, 2000
6070783 Conductive ball attaching apparatus and method Jun. 6, 2000
6001493 Substrate for transferring bumps and method of use Dec. 14, 1999
5992727 Apparatus for producing a sleeve-type printing form Nov. 30, 1999
5988482 Discharge abnormality detection device and method for use in wire bonding apparatus Nov. 23, 1999
5979740 Solder wave height set-up gauge Nov. 9, 1999
5971247 Friction stir welding with roller stops for controlling weld depth Oct. 26, 1999
5934543 Wire bonding capillary having alignment features Aug. 10, 1999
5918793 Weld test apparatus and method Jul. 6, 1999
5893508 Circuit board having a terminal for detecting disconnection of a bonding wire and a wire bonding apparatus using such a board Apr. 13, 1999
5862974 Wire bonding method and apparatus Jan. 26, 1999
5836504 Method and apparatus for soldering inspection of a surface mounted circuit board Nov. 17, 1998
5732873 Magnetic energy monitor for an ultrasonic wirebonder Mar. 31, 1998
5685571 Pipe socket Nov. 11, 1997
5676302 Method and apparatus for crescent boundary thresholding on wire-bonded leads Oct. 14, 1997
5617988 Device for measuring the height of a solder wave Apr. 8, 1997
5615823 Soldering ball mounting apparatus and method Apr. 1, 1997
5603446 Bonding apparatus Feb. 18, 1997
5537876 Apparatus and method for nondestructive evaluation of butt welds Jul. 23, 1996
5533663 Solder wave measurement device Jul. 9, 1996
5516028 Process and system for temperature control and in-line testing of electronic, electromechanical and mechanical modules May. 14, 1996
5494206 Wire bonding method and apparatus Feb. 27, 1996
5472133 Soldering iron rack with a power saving control Dec. 5, 1995
5447264 Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon Sep. 5, 1995
5439157 Automated butt weld inspection system Aug. 8, 1995
5435477 Wire clampers Jul. 25, 1995
5388468 Solder wave parameters analyzer Feb. 14, 1995
5377894 Wire bonder system Jan. 3, 1995
5361963 Dispenser Nov. 8, 1994
5340011 Adjustable height work holder for bonding semiconductor dies Aug. 23, 1994
5249727 Weld penetration depth inspection Oct. 5, 1993
5248075 IC pin forming machine with integrated IC testing capability Sep. 28, 1993
5179282 Method for ascertaining the content of an ingredient of flux in automatic soldering machines Jan. 12, 1993
5169051 Strip welding machine Dec. 8, 1992
5145101 Tweezer handpiece for installation and removal of electronic components with respect to a substrate and tips and tool for use therewith Sep. 8, 1992
5137200 Portable ultrasonic welding device Aug. 11, 1992
5108024 Method of inspecting solder joints Apr. 28, 1992
5040716 Pipe welding apparatus Aug. 20, 1991
5024366 Desoldering vat Jun. 18, 1991
5022580 Vernier structure for flip chip bonded devices Jun. 11, 1991

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