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Class Information
Number: 228/56.3
Name: Metal fusion bonding > Solder form
Description: Device comprising an article (i.e., a discrete three-dimensional body substantially in its ultimate use form) adapted to be applied to work as filler material.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
6029882 Plastic solder array using injection molded solder Feb. 29, 2000
6012626 Method of forming ball grid array contacts Jan. 11, 2000
6001493 Substrate for transferring bumps and method of use Dec. 14, 1999
5984163 Method of producing and utilizing deformable workpieces for high-pressure forming and products formed thereby Nov. 16, 1999
5984161 Flux-encased resilient solder preforms and process for the preparation thereof Nov. 16, 1999
5968670 Enhanced ceramic ball grid array using in-situ solder stretch with spring Oct. 19, 1999
5964398 Vane member and method for producing joint Oct. 12, 1999
5957364 Integrated solder preform array having a tin outer coating Sep. 28, 1999
5957365 Brazing rod for depositing diamond coating to metal substrate using gas or electric brazing techniques Sep. 28, 1999
5954262 Soldering apparatus for providing a fixed quantity of solder piece onto target plate and method of soldering circuit component Sep. 21, 1999
5938862 Fatigue-resistant lead-free alloy Aug. 17, 1999
5924622 Method and apparatus for soldering ball grid array modules to substrates Jul. 20, 1999
5887779 Solder sleeve having improved heat transfer characteristics and method therefor Mar. 30, 1999
5881944 Multi-layer solder seal band for semiconductor substrates Mar. 16, 1999
5855993 Electronic devices having metallurgies containing copper-semiconductor compounds Jan. 5, 1999
5845836 Friction welding non-metallics to metallics Dec. 8, 1998
5845837 Polymer-based material for carbon deposition during brazing operations Dec. 8, 1998
5842274 Method of forming discrete solder portions on respective contact pads of a printed circuit board Dec. 1, 1998
5832595 Method of modifying conductive lines of an electronic circuit board and its apparatus Nov. 10, 1998
5820014 Solder preforms Oct. 13, 1998
5806179 Method for connecting a cable to a printed circuit board Sep. 15, 1998
5803340 Composite solder paste for flip chip bumping Sep. 8, 1998
5789068 Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors Aug. 4, 1998
5775569 Method for building interconnect structures by injection molded solder and structures built Jul. 7, 1998
5762258 Method of making an electronic package having spacer elements Jun. 9, 1998
5761779 Method of producing fine metal spheres of uniform size Jun. 9, 1998
5741410 Apparatus for forming spherical electrodes Apr. 21, 1998
5722160 Packaging method of BGA type electronic component Mar. 3, 1998
5718361 Apparatus and method for forming mold for metallic material Feb. 17, 1998
5695109 Solder paste inter-layer alignment apparatus for area-array on-board rework Dec. 9, 1997
5673846 Solder anchor decal and method Oct. 7, 1997
5662262 Tape withh solder forms and methods for transferring solder forms to chip assemblies Sep. 2, 1997
5626278 Solder delivery and array apparatus May. 6, 1997
5620129 Device and method for forming and attaching an array of conductive balls Apr. 15, 1997
5617992 Soldering strip and method of using Apr. 8, 1997
5609286 Brazing rod for depositing diamond coating metal substrate using gas or electric brazing techniques Mar. 11, 1997
5591037 Method for interconnecting an electronic device using a removable solder carrying medium Jan. 7, 1997
5577655 Flexible metal-containing tapes or films and associated adhesives Nov. 26, 1996
5551627 Alloy solder connect assembly and method of connection Sep. 3, 1996
5547517 Brazing agent and a brazing sheet both comprising an aluminum alloy containing a flux Aug. 20, 1996
5545465 Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits Aug. 13, 1996
5535939 Controlled atmosphere brazing using aluminum-lithium alloy Jul. 16, 1996
5516032 Method for forming bump electrode May. 14, 1996
5509203 Method for manufacturing a sheet formed connector for inspection of an integrated circuit Apr. 23, 1996
5509815 Solder medium for circuit interconnection Apr. 23, 1996
5497938 Tape with solder forms and methods for transferring solder to chip assemblies Mar. 12, 1996
5457880 Embedded features for monitoring electronics assembly manufacturing processes Oct. 17, 1995
5456004 Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards Oct. 10, 1995
5447264 Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon Sep. 5, 1995
5427865 Multiple alloy solder preform Jun. 27, 1995

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