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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Material Science
Class Information
Number: 228/56.3
Name: Metal fusion bonding > Solder form
Description: Device comprising an article (i.e., a discrete three-dimensional body substantially in its ultimate use form) adapted to be applied to work as filler material.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
6457632 Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy Oct. 1, 2002
6427903 Solder ball placement apparatus Aug. 6, 2002
6399475 Process for producing electrical connections on the surface of a semiconductor package with electrical-connection drops Jun. 4, 2002
6386426 Solder material and method of manufacturing solder material May. 14, 2002
6361626 Solder alloy and soldered bond Mar. 26, 2002
6352195 Method of forming an electronic package with a solder seal Mar. 5, 2002
6347901 Solder interconnect techniques Feb. 19, 2002
6340111 Micro grid array solder interconnection structure for second level packaging joining a module and a printed circuit board Jan. 22, 2002
6329631 Solder strip exclusively for semiconductor packaging Dec. 11, 2001
6326088 Diffusion-soldered joint and method for making diffusion-soldered joints Dec. 4, 2001
6318624 Solder balltape and method for making electrical connection between a head transducer and an electrical lead Nov. 20, 2001
6313412 Method of assembling substrates and electronic components Nov. 6, 2001
6295730 Method and apparatus for forming metal contacts on a substrate Oct. 2, 2001
6296722 Lead-free solder alloy Oct. 2, 2001
6296173 Method and apparatus for soldering ball grid array modules to substrates Oct. 2, 2001
6280584 Compliant bond structure for joining ceramic to metal Aug. 28, 2001
6278184 Solder disc connection Aug. 21, 2001
6253992 Solder ball placement fixtures and methods Jul. 3, 2001
6253986 Solder disc connection Jul. 3, 2001
6231691 Lead-free solder May. 15, 2001
6230397 Method of constructing an electrical connector May. 15, 2001
6221506 Bushing base with mounted nozzles Apr. 24, 2001
6216939 Method for making a hermetically sealed package comprising at least one optical fiber feedthrough Apr. 17, 2001
6203929 Gold plated solder material and method of fluxless soldering using solder Mar. 20, 2001
6202299 Semiconductor chip connection components with adhesives and methods of making same Mar. 20, 2001
6196444 Method and apparatus for soldering ball grid array modules to substrates Mar. 6, 2001
6193131 Solder sleeve and a method for the forming thereof Feb. 27, 2001
6186390 Solder material and method of manufacturing solder material Feb. 13, 2001
6187114 Solder material and electronic part using the same Feb. 13, 2001
6178628 Apparatus and method for direct attachment of heat sink to surface mount Jan. 30, 2001
6179631 Electrical contact for a printed circuit board Jan. 30, 2001
6170737 Solder ball placement method Jan. 9, 2001
6164517 Seamless, ring-shaped brazing material and method for producing same Dec. 26, 2000
6158644 Method for enhancing fatigue life of ball grid arrays Dec. 12, 2000
6156408 Device for reworkable direct chip attachment Dec. 5, 2000
6148900 Connecting board for connection between base plate and mounting board Nov. 21, 2000
6139972 Solder paste containment device Oct. 31, 2000
6119920 Method of forming an electronic package with a solder seal Sep. 19, 2000
6105851 Method of casting I/O columns on an electronic component with a high yield Aug. 22, 2000
6095400 Reinforced solder preform Aug. 1, 2000
6076726 Pad-on-via assembly technique Jun. 20, 2000
6073829 Method and arrangement for attaching a component Jun. 13, 2000
6070782 Socketable bump grid array shaped-solder on copper spheres Jun. 6, 2000
6068176 Brazing alloy transfer tape having a visually distinctive carrier May. 30, 2000
6059173 Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board May. 9, 2000
6056190 Solder ball placement apparatus May. 2, 2000
6056191 Method and apparatus for forming solder bumps May. 2, 2000
6054171 Method for forming protruding electrode Apr. 25, 2000
6051273 Method for forming features upon a substrate Apr. 18, 2000
6044549 Assembly of electronic components onto substrates Apr. 4, 2000

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