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Class Information
Number: 228/56.3
Name: Metal fusion bonding > Solder form
Description: Device comprising an article (i.e., a discrete three-dimensional body substantially in its ultimate use form) adapted to be applied to work as filler material.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8679591 Method for reducing voids in a copper-tin interface and structure formed thereby Mar. 25, 2014
8550327 Clad solder thermal interface material Oct. 8, 2013
8459529 Production method of composite silver nanoparticle Jun. 11, 2013
8418910 Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device Apr. 16, 2013
8413878 System and method for manufacturing welded structures, and a welding additive material for this purpose Apr. 9, 2013
8353444 Low temperature diffusion braze repair of single crystal components Jan. 15, 2013
8348139 Composite solder alloy preform Jan. 8, 2013
8348134 Composite silver nanoparticle, composite silver nanopaste, bonding method and patterning method Jan. 8, 2013
8329314 Hermetically bonding ceramic and titanium with a palladium braze Dec. 11, 2012
8324522 Reflow apparatus, reflow method, and package apparatus Dec. 4, 2012
8240545 Methods for minimizing component shift during soldering Aug. 14, 2012
8240542 Grooving supply device for flux cored wire solder Aug. 14, 2012
8235275 Braze foil for high-temperature brazing and methods for repairing or producing components using a braze foil Aug. 7, 2012
8227066 Annular disc of bent sheet material Jul. 24, 2012
8220692 Lead-free solder Jul. 17, 2012
8186564 Brazing preform manufacture May. 29, 2012
8117982 Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold Feb. 21, 2012
8096464 Solder-bearing articles and method of retaining a solder mass along a side edge thereof Jan. 17, 2012
8061578 Solder preform Nov. 22, 2011
8020745 Solder ball Sep. 20, 2011
7946467 Braze material and processes for making and using May. 24, 2011
7879460 Welding wire and vehicle component manufactured using the same Feb. 1, 2011
7857189 Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance Dec. 28, 2010
7793820 Solder preform and a process for its manufacture Sep. 14, 2010
7784669 Method and process for reducing undercooling in a lead-free tin-rich solder alloy Aug. 31, 2010
7780058 Braided solder Aug. 24, 2010
7775414 Consumable insert and method of using the same Aug. 17, 2010
7754343 Ternary alloy column grid array Jul. 13, 2010
7750475 Lead-free solder ball Jul. 6, 2010
7745013 Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same Jun. 29, 2010
7735718 Layered products for fluxless brazing of substrates Jun. 15, 2010
7703661 Method and process for reducing undercooling in a lead-free tin-rich solder alloy Apr. 27, 2010
7690551 Die attach by temperature gradient lead free soft solder metal sheet or film Apr. 6, 2010
7691282 Hydrofluoroether compounds and processes for their preparation and use Apr. 6, 2010
7681777 Solder paste and printed circuit board Mar. 23, 2010
7654438 Copper-based brazing alloy and brazing process Feb. 2, 2010
7611778 Simultaneous multi-alloy casting Nov. 3, 2009
7597233 Apparatus and method of mounting conductive ball Oct. 6, 2009
7569164 Solder precoating method Aug. 4, 2009
7533793 Solder preforms for use in electronic assembly May. 19, 2009
7531387 Flip chip mounting method and bump forming method May. 12, 2009
7527187 Titanium braze foil May. 5, 2009
7524698 Handling and positioning of metallic plated balls for socket application in ball grid array packages Apr. 28, 2009
7523852 Solder interconnect structure and method using injection molded solder Apr. 28, 2009
7488445 Lead-free solder and soldered article Feb. 10, 2009
7486480 Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass Feb. 3, 2009
7461770 Copper-based brazing alloy and brazing process Dec. 9, 2008
7461772 Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys Dec. 9, 2008
7451906 Products for use in low temperature fluxless brazing Nov. 18, 2008
7422141 Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale Sep. 9, 2008

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