| |
 |
|
Class Information
Number: 228/56.3
Name: Metal fusion bonding > Solder form
Description: Device comprising an article (i.e., a discrete three-dimensional body substantially in its ultimate use form) adapted to be applied to work as filler material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7611778 |
Simultaneous multi-alloy casting |
Nov. 3, 2009 |
| 7597233 |
Apparatus and method of mounting conductive ball |
Oct. 6, 2009 |
| 7569164 |
Solder precoating method |
Aug. 4, 2009 |
| 7533793 |
Solder preforms for use in electronic assembly |
May. 19, 2009 |
| 7531387 |
Flip chip mounting method and bump forming method |
May. 12, 2009 |
| 7527187 |
Titanium braze foil |
May. 5, 2009 |
| 7523852 |
Solder interconnect structure and method using injection molded solder |
Apr. 28, 2009 |
| 7524698 |
Handling and positioning of metallic plated balls for socket application in ball grid array packages |
Apr. 28, 2009 |
| 7488445 |
Lead-free solder and soldered article |
Feb. 10, 2009 |
| 7486480 |
Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass |
Feb. 3, 2009 |
| 7461772 |
Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys |
Dec. 9, 2008 |
| 7461770 |
Copper-based brazing alloy and brazing process |
Dec. 9, 2008 |
| 7451906 |
Products for use in low temperature fluxless brazing |
Nov. 18, 2008 |
| 7422721 |
Lead-free solder and soldered article |
Sep. 9, 2008 |
| 7422141 |
Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale |
Sep. 9, 2008 |
| 7410088 |
Solder preform for low heat stress laser solder attachment |
Aug. 12, 2008 |
| 7407713 |
Simultaneous multi-alloy casting |
Aug. 5, 2008 |
| 7387230 |
Brazing filter metal sheet and method for production thereof |
Jun. 17, 2008 |
| 7357291 |
Solder metal, soldering flux and solder paste |
Apr. 15, 2008 |
| 7331498 |
Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder |
Feb. 19, 2008 |
| 7318547 |
Method for assembling parts made of materials based on SiC by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method |
Jan. 15, 2008 |
| 7293688 |
Gold/nickel/copper/aluminum/silver brazing alloys for brazing WC-Co to titanium alloys |
Nov. 13, 2007 |
| 7276296 |
Immersion plating and plated structures |
Oct. 2, 2007 |
| 7222776 |
Printed wiring board and manufacturing method therefor |
May. 29, 2007 |
| 7224067 |
Intermetallic solder with low melting point |
May. 29, 2007 |
| 7220493 |
Lead-free solder, and a lead-free joint |
May. 22, 2007 |
| 7219825 |
SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same |
May. 22, 2007 |
| 7189083 |
Method of retaining a solder mass on an article |
Mar. 13, 2007 |
| 7160504 |
Alloy type thermal fuse and fuse element thereof |
Jan. 9, 2007 |
| 7157150 |
Brazing titanium to stainless steel using layered particulate |
Jan. 2, 2007 |
| 7156280 |
Braze alloy compositions |
Jan. 2, 2007 |
| 7100815 |
Diebond strip |
Sep. 5, 2006 |
| 7097090 |
Solder ball |
Aug. 29, 2006 |
| 7036710 |
Method and structures for implementing impedance-controlled coupled noise suppressor for differential interface solder column array |
May. 2, 2006 |
| 7036709 |
Method and structure for implementing column attach coupled noise suppressor |
May. 2, 2006 |
| 7021518 |
Micromagnetic device for power processing applications and method of manufacture therefor |
Apr. 4, 2006 |
| 7022415 |
Layered sphere braze material |
Apr. 4, 2006 |
| 7014093 |
Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
Mar. 21, 2006 |
| 7007834 |
Contact bump construction for the production of a connector construction for substrate connecting surfaces |
Mar. 7, 2006 |
| 6989200 |
Ceramic to noble metal braze and method of manufacture |
Jan. 24, 2006 |
| 6955285 |
Apparatus for aligning and dispensing solder columns in an array |
Oct. 18, 2005 |
| 6938815 |
Heat-resistant electronic systems and circuit boards |
Sep. 6, 2005 |
| 6933449 |
Selective area solder placement |
Aug. 23, 2005 |
| 6917113 |
Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly |
Jul. 12, 2005 |
| 6913184 |
Alloy composition and method for low temperature fluxless brazing |
Jul. 5, 2005 |
| 6900393 |
Solder-bearing wafer for use in soldering operations |
May. 31, 2005 |
| 6892925 |
Solder hierarchy for lead free solder joint |
May. 17, 2005 |
| 6890844 |
Methods and apparatus for forming solder balls |
May. 10, 2005 |
| 6872465 |
Solder |
Mar. 29, 2005 |
| 6869007 |
Oxidation-resistant reactive solders and brazes |
Mar. 22, 2005 |
|
|
|
