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Class Information
Number: 228/46
Name: Metal fusion bonding > With means to cool work or product
Description: Device having means for bringing work or product*, and a heat absorbent medium, into mutual engagement.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8501545 |
Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime |
Aug. 6, 2013 |
| 8459528 |
Assembly for head welding |
Jun. 11, 2013 |
| 8459527 |
Apparatus for ensuring concentric weld deposition of material on a pipe interior |
Jun. 11, 2013 |
| 8381962 |
Injection molded solder method for forming solder bumps on substrates |
Feb. 26, 2013 |
| 8353443 |
Device and method for cooling rail weld zone |
Jan. 15, 2013 |
| 8328076 |
Apparatus and method for ensuring concentric weld deposition of material on a pipe interior |
Dec. 11, 2012 |
| 8286853 |
Bonding apparatus and bonding method |
Oct. 16, 2012 |
| 8274161 |
Flux-free chip to substrate joint serial linear thermal processor arrangement |
Sep. 25, 2012 |
| 8252678 |
Flux-free chip to wafer joint serial thermal processor arrangement |
Aug. 28, 2012 |
| 8210417 |
Bonding apparatus |
Jul. 3, 2012 |
| 8011563 |
Compliant mold fill head with integrated cavity venting and solder cooling |
Sep. 6, 2011 |
| 7878386 |
Method and device for heat treatment, especially connection by soldering |
Feb. 1, 2011 |
| 7766211 |
Temperature control of a bonding stage |
Aug. 3, 2010 |
| 7708183 |
Reflow solder oven with cooling diffuser |
May. 4, 2010 |
| 7581961 |
Method for preventing solder rise to electric contact and electric contact produced by the same |
Sep. 1, 2009 |
| 7392925 |
Handheld fluid cooled electric solder tweezers |
Jul. 1, 2008 |
| 7156279 |
System and method for mounting electronic components onto flexible substrates |
Jan. 2, 2007 |
| 7150387 |
Process and apparatus for flow soldering |
Dec. 19, 2006 |
| 7014092 |
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconduc |
Mar. 21, 2006 |
| 6910614 |
Vacuum compression brazing furnace and method of using same |
Jun. 28, 2005 |
| 6827249 |
Fluxless tube seal |
Dec. 7, 2004 |
| 6827253 |
Method and means for rapid heat-sink soldering |
Dec. 7, 2004 |
| 6796483 |
Method and device for producing a soldered joint |
Sep. 28, 2004 |
| 6772935 |
Method and device for friction stir welding with simultaneous cooling |
Aug. 10, 2004 |
| 6702173 |
Reflow apparatus in continuous printing and mounting apparatus for film-like printing body |
Mar. 9, 2004 |
| 6691910 |
Method of joining different metal materials by friction welding |
Feb. 17, 2004 |
| 6642485 |
System and method for mounting electronic components onto flexible substrates |
Nov. 4, 2003 |
| 6585149 |
Packaging method using lead-free solder |
Jul. 1, 2003 |
| 6550668 |
Method and means for rapid heat-sink soldering |
Apr. 22, 2003 |
| 6443355 |
Soldering method and apparatus |
Sep. 3, 2002 |
| 6412681 |
Soldering machine |
Jul. 2, 2002 |
| 6402011 |
Reflow method and reflow device |
Jun. 11, 2002 |
| 6386422 |
Solder reflow oven |
May. 14, 2002 |
| 6347732 |
Circuit board component retention |
Feb. 19, 2002 |
| 6347734 |
Methods and apparatus for installing a module on a circuit board using heating and cooling techniques |
Feb. 19, 2002 |
| 6345756 |
Defectively joined portion removal apparatus for use in a continuous hot rolling process |
Feb. 12, 2002 |
| 6318622 |
High power hybrid modules assembly using vacuum oven for permanent electrical connections |
Nov. 20, 2001 |
| 6230962 |
Process for cooling soldered objects |
May. 15, 2001 |
| 6164516 |
Soldering apparatus and method |
Dec. 26, 2000 |
| 6123247 |
Electronic unit soldering apparatus |
Sep. 26, 2000 |
| 6059170 |
Method and apparatus for insulating moisture sensitive PBGA's |
May. 9, 2000 |
| 6045032 |
Method of preventing solder reflow of electrical components during wave soldering |
Apr. 4, 2000 |
| 6039236 |
Reflow soldering apparatus with improved cooling |
Mar. 21, 2000 |
| 5942289 |
Hardfacing a surface utilizing a method and apparatus having a chill block |
Aug. 24, 1999 |
| 5927588 |
Constant-heat type heating device and soldering method and soldering apparatus with heating device |
Jul. 27, 1999 |
| 5860583 |
Evaporative cooling vessel for controlling the temperature of a portion of an electronic part during solder reflow |
Jan. 19, 1999 |
| 5842627 |
Soldering apparatus and a method thereof |
Dec. 1, 1998 |
| 5813595 |
Method for wave-soldering printed circuit boards |
Sep. 29, 1998 |
| 5785233 |
Apparatus and method for solder reflow bottom cooling |
Jul. 28, 1998 |
| 5685475 |
Apparatus for cooling printed circuit boards in wave soldering |
Nov. 11, 1997 |
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