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Class Information
Number: 228/46
Name: Metal fusion bonding > With means to cool work or product
Description: Device having means for bringing work or product*, and a heat absorbent medium, into mutual engagement.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8501545 Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime Aug. 6, 2013
8459528 Assembly for head welding Jun. 11, 2013
8459527 Apparatus for ensuring concentric weld deposition of material on a pipe interior Jun. 11, 2013
8381962 Injection molded solder method for forming solder bumps on substrates Feb. 26, 2013
8353443 Device and method for cooling rail weld zone Jan. 15, 2013
8328076 Apparatus and method for ensuring concentric weld deposition of material on a pipe interior Dec. 11, 2012
8286853 Bonding apparatus and bonding method Oct. 16, 2012
8274161 Flux-free chip to substrate joint serial linear thermal processor arrangement Sep. 25, 2012
8252678 Flux-free chip to wafer joint serial thermal processor arrangement Aug. 28, 2012
8210417 Bonding apparatus Jul. 3, 2012
8011563 Compliant mold fill head with integrated cavity venting and solder cooling Sep. 6, 2011
7878386 Method and device for heat treatment, especially connection by soldering Feb. 1, 2011
7766211 Temperature control of a bonding stage Aug. 3, 2010
7708183 Reflow solder oven with cooling diffuser May. 4, 2010
7581961 Method for preventing solder rise to electric contact and electric contact produced by the same Sep. 1, 2009
7392925 Handheld fluid cooled electric solder tweezers Jul. 1, 2008
7156279 System and method for mounting electronic components onto flexible substrates Jan. 2, 2007
7150387 Process and apparatus for flow soldering Dec. 19, 2006
7014092 Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconduc Mar. 21, 2006
6910614 Vacuum compression brazing furnace and method of using same Jun. 28, 2005
6827249 Fluxless tube seal Dec. 7, 2004
6827253 Method and means for rapid heat-sink soldering Dec. 7, 2004
6796483 Method and device for producing a soldered joint Sep. 28, 2004
6772935 Method and device for friction stir welding with simultaneous cooling Aug. 10, 2004
6702173 Reflow apparatus in continuous printing and mounting apparatus for film-like printing body Mar. 9, 2004
6691910 Method of joining different metal materials by friction welding Feb. 17, 2004
6642485 System and method for mounting electronic components onto flexible substrates Nov. 4, 2003
6585149 Packaging method using lead-free solder Jul. 1, 2003
6550668 Method and means for rapid heat-sink soldering Apr. 22, 2003
6443355 Soldering method and apparatus Sep. 3, 2002
6412681 Soldering machine Jul. 2, 2002
6402011 Reflow method and reflow device Jun. 11, 2002
6386422 Solder reflow oven May. 14, 2002
6347732 Circuit board component retention Feb. 19, 2002
6347734 Methods and apparatus for installing a module on a circuit board using heating and cooling techniques Feb. 19, 2002
6345756 Defectively joined portion removal apparatus for use in a continuous hot rolling process Feb. 12, 2002
6318622 High power hybrid modules assembly using vacuum oven for permanent electrical connections Nov. 20, 2001
6230962 Process for cooling soldered objects May. 15, 2001
6164516 Soldering apparatus and method Dec. 26, 2000
6123247 Electronic unit soldering apparatus Sep. 26, 2000
6059170 Method and apparatus for insulating moisture sensitive PBGA's May. 9, 2000
6045032 Method of preventing solder reflow of electrical components during wave soldering Apr. 4, 2000
6039236 Reflow soldering apparatus with improved cooling Mar. 21, 2000
5942289 Hardfacing a surface utilizing a method and apparatus having a chill block Aug. 24, 1999
5927588 Constant-heat type heating device and soldering method and soldering apparatus with heating device Jul. 27, 1999
5860583 Evaporative cooling vessel for controlling the temperature of a portion of an electronic part during solder reflow Jan. 19, 1999
5842627 Soldering apparatus and a method thereof Dec. 1, 1998
5813595 Method for wave-soldering printed circuit boards Sep. 29, 1998
5785233 Apparatus and method for solder reflow bottom cooling Jul. 28, 1998
5685475 Apparatus for cooling printed circuit boards in wave soldering Nov. 11, 1997

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