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Class Information
Number: 228/45
Name: Metal fusion bonding > Including means to move or guide applicator
Description: Device having means to positively impart motion to, or to direct the motion of, an applicator other than for the direct purpose of accomplishing fusion-bonding.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7546941 |
Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same |
Jun. 16, 2009 |
| 7497365 |
Paste coater and PoP automatic mounting apparatus employing the same |
Mar. 3, 2009 |
| 7494913 |
Microball placement solutions |
Feb. 24, 2009 |
| 7357288 |
Component connecting apparatus |
Apr. 15, 2008 |
| 7159751 |
Wire bonder |
Jan. 9, 2007 |
| 7096912 |
Bonding apparatus |
Aug. 29, 2006 |
| 7020942 |
Portable boring and welding machine |
Apr. 4, 2006 |
| 6921011 |
Work piece holder having top mounted robot and method of use |
Jul. 26, 2005 |
| 6871772 |
Wire bonding apparatus |
Mar. 29, 2005 |
| 6863206 |
Bonding apparatus |
Mar. 8, 2005 |
| 6786392 |
Wire bonding device and wire bonding method |
Sep. 7, 2004 |
| 6772932 |
Automated welding system utilizing overhead robots |
Aug. 10, 2004 |
| 6742695 |
Soldering machine for tape carrier package outer leads |
Jun. 1, 2004 |
| 6651866 |
Precision bond head for mounting semiconductor chips |
Nov. 25, 2003 |
| 6641025 |
Threading tool and method for bond wire capillary tubes |
Nov. 4, 2003 |
| 6561408 |
Bonding head and component mounting apparatus |
May. 13, 2003 |
| 6533159 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
Mar. 18, 2003 |
| 6471109 |
Method and apparatus for soldering and soldering land of a printed circuit board |
Oct. 29, 2002 |
| 6454155 |
Stroke and pressure adjusting device for solder machine |
Sep. 24, 2002 |
| 6364195 |
Brazing Apparatus |
Apr. 2, 2002 |
| 6321970 |
Wire bonding machine |
Nov. 27, 2001 |
| 6290118 |
Method and apparatus for soldering and soldering land of a printed circuit board |
Sep. 18, 2001 |
| 6264089 |
Connecting apparatus |
Jul. 24, 2001 |
| 6247628 |
Ultrasonic vibration bonding tool |
Jun. 19, 2001 |
| 6234376 |
Supplying a cover gas for wire ball bonding |
May. 22, 2001 |
| 6223971 |
Driving unit of a welding equipment |
May. 1, 2001 |
| 6223967 |
Extended travel wire bonding machine |
May. 1, 2001 |
| 6173880 |
Friction stir weld system for welding and weld repair |
Jan. 16, 2001 |
| 6158649 |
Solder ball mounting apparatus and method |
Dec. 12, 2000 |
| 6149047 |
Die-bonding machine |
Nov. 21, 2000 |
| 6109501 |
Radial wire bonder and selectable side view inspection system |
Aug. 29, 2000 |
| 6095399 |
Pressure welding apparatus and pressure welding method |
Aug. 1, 2000 |
| 6068175 |
System for replacing a first area array component connected to an interconnect board |
May. 30, 2000 |
| 6059169 |
Spot welding system |
May. 9, 2000 |
| 6057526 |
Wire feed unit system to automatically feed filler wire to a weld |
May. 2, 2000 |
| 6045025 |
Method and apparatus for soldering and soldering land of a printed circuit board |
Apr. 4, 2000 |
| 5996878 |
Method of welding 5-G pipe |
Dec. 7, 1999 |
| 5976314 |
Device for ultrasonic treatment of workpieces background of the invention |
Nov. 2, 1999 |
| 5971248 |
Steady autorotation of wire bonding capillary |
Oct. 26, 1999 |
| 5950904 |
Gas containment box used with a welding head |
Sep. 14, 1999 |
| 5947364 |
Ultrasonic welding apparatus |
Sep. 7, 1999 |
| 5944248 |
Apparatus for processing curved surfaces |
Aug. 31, 1999 |
| 5931372 |
Ultrasonic bonding method and apparatus with locking tool tip |
Aug. 3, 1999 |
| 5927587 |
Capillary holder for wire bonding capillary |
Jul. 27, 1999 |
| 5921459 |
Modular robotic welding station |
Jul. 13, 1999 |
| 5894982 |
Connecting apparatus |
Apr. 20, 1999 |
| 5893510 |
Welding apparatus |
Apr. 13, 1999 |
| 5890645 |
Continuous feed wire uncoiler |
Apr. 6, 1999 |
| 5853655 |
Magnetic wheel guided carriage with positioning arm |
Dec. 29, 1998 |
| 5813590 |
Extended travel wire bonding machine |
Sep. 29, 1998 |
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