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Class Information
Number: 228/44.7
Name: Metal fusion bonding > Including means to force or clamp work portions together during bonding > Work portion comprises electrical component
Description: Device particularly adapted to a work part intended to be used in the transmission or regulation of electrical energy.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7344059 |
Apparatus and method for mounting an electrical connector to a glass sheet of a vehicle window |
Mar. 18, 2008 |
| 7246735 |
Wire clamping plate |
Jul. 24, 2007 |
| 7240820 |
Clamping device for processing electronic devices |
Jul. 10, 2007 |
| 7134589 |
Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate |
Nov. 14, 2006 |
| 7131568 |
Methods for lead penetrating clamping system |
Nov. 7, 2006 |
| 7040525 |
Stage structure in bonding machine and method for controlling the same |
May. 9, 2006 |
| 7015066 |
Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly |
Mar. 21, 2006 |
| 7007833 |
Forming solder balls on substrates |
Mar. 7, 2006 |
| 6942137 |
Die removal method and apparatus |
Sep. 13, 2005 |
| 6921017 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Jul. 26, 2005 |
| 6918528 |
Transducer tool holder |
Jul. 19, 2005 |
| 6899262 |
Clamping device |
May. 31, 2005 |
| 6886734 |
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
May. 3, 2005 |
| 6845898 |
Bondhead lead clamp apparatus |
Jan. 25, 2005 |
| 6840424 |
Compression bonding tools and associated bonding methods |
Jan. 11, 2005 |
| 6837418 |
Bondhead lead clamp apparatus and method |
Jan. 4, 2005 |
| 6827253 |
Method and means for rapid heat-sink soldering |
Dec. 7, 2004 |
| 6821381 |
Tool for thermo-compression-bonding chips, and chip packaging device having the same |
Nov. 23, 2004 |
| 6820793 |
Apparatus for the transport and equipping of substrates with semiconductor chips |
Nov. 23, 2004 |
| 6814277 |
Lead frame substrate clamp and method |
Nov. 9, 2004 |
| 6799714 |
Circuit board pallet with component arm |
Oct. 5, 2004 |
| 6783052 |
Clamp actuation mechanism |
Aug. 31, 2004 |
| 6769469 |
Process for mounting semiconductor device and mounting apparatus |
Aug. 3, 2004 |
| 6732902 |
Lead penetrating clamping system |
May. 11, 2004 |
| 6729527 |
Bonding tool with polymer coating |
May. 4, 2004 |
| 6715659 |
Apparatus for clamping semiconductor devices using sliding finger supports |
Apr. 6, 2004 |
| 6662993 |
Bondhead lead clamp apparatus |
Dec. 16, 2003 |
| 6648204 |
Alignment weight for floating pin field design |
Nov. 18, 2003 |
| 6648045 |
Chip bonding apparatus |
Nov. 18, 2003 |
| 6641027 |
Method of connecting electric leads to battery tabs |
Nov. 4, 2003 |
| 6637636 |
Apparatus of clamping semiconductor devices using sliding finger supports |
Oct. 28, 2003 |
| 6634538 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Oct. 21, 2003 |
| 6604671 |
Bondhead lead clamp apparatus and method |
Aug. 12, 2003 |
| 6604670 |
Lead penetrating clamping system |
Aug. 12, 2003 |
| 6588649 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Jul. 8, 2003 |
| 6585145 |
Die bonder and/or wire bonder with a device for holding down a substrate |
Jul. 1, 2003 |
| 6584670 |
Electrical terminal implementation device |
Jul. 1, 2003 |
| 6561408 |
Bonding head and component mounting apparatus |
May. 13, 2003 |
| 6550668 |
Method and means for rapid heat-sink soldering |
Apr. 22, 2003 |
| 6547121 |
Mechanical clamper for heated substrates at die attach |
Apr. 15, 2003 |
| 6533158 |
Wire bonding apparatus having wire clamp |
Mar. 18, 2003 |
| 6516994 |
Wire bonding apparatus for connecting semiconductor devices |
Feb. 11, 2003 |
| 6494357 |
Lead penetrating clamping system |
Dec. 17, 2002 |
| 6484922 |
Apparatus and method of clamping semiconductor devices using sliding finger supports |
Nov. 26, 2002 |
| 6478211 |
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
Nov. 12, 2002 |
| 6464123 |
Bondhead lead clamp apparatus and method |
Oct. 15, 2002 |
| 6419145 |
Lead penetrating clamping system |
Jul. 16, 2002 |
| 6378857 |
Printed circuit board fixture |
Apr. 30, 2002 |
| 6375061 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Apr. 23, 2002 |
| 6352191 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Mar. 5, 2002 |
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