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Class Information
Number: 228/42
Name: Metal fusion bonding > Including means to apply flux or filler to work or applicator > Gaseous flux
Description: Device whose applying or supplying means is designed and intended to bring the flux into engagement with the work or applicator while the flux is in a gaseous state.


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
7614538 Device clamp for reducing oxidation in wire bonding Nov. 10, 2009
7578900 Bonding device for manufacturing liquid crystal display device Aug. 25, 2009
7578423 Assembly for reducing oxidation of semiconductor devices Aug. 25, 2009
7520538 Orbital tube welding purge adaptor Apr. 21, 2009
7380699 Method and apparatus for vapour phase soldering Jun. 3, 2008
7303109 Stud bumping apparatus Dec. 4, 2007
7182793 System for reducing oxidation of electronic devices Feb. 27, 2007
7137544 Apparatus and method for performing welding at elevated temperature Nov. 21, 2006
7131566 Packaging method using lead-free solder Nov. 7, 2006
7112358 Self-adhesive purge dam for retaining purge gas around a weld zone Sep. 26, 2006
7014673 Filtering apparatus Mar. 21, 2006
6991967 Apparatus and method for die attachment Jan. 31, 2006
6866182 Apparatus and method to prevent oxidation of electronic devices Mar. 15, 2005
6827249 Fluxless tube seal Dec. 7, 2004
6814273 Flatwire repair tool systems and methods Nov. 9, 2004
6796483 Method and device for producing a soldered joint Sep. 28, 2004
6794616 Solder reflow oven Sep. 21, 2004
6761304 Heating head for soldering and de-soldering of SMD components Jul. 13, 2004
6761301 Soldering machine Jul. 13, 2004
6749655 Filtration of flux contaminants Jun. 15, 2004
6739204 Velocity measuring apparatus to establish purge gas velocity prior to welding May. 25, 2004
6715662 Waste energy recovery system for a controlled atmosphere system Apr. 6, 2004
6705506 Inert atmosphere soldering apparatus Mar. 16, 2004
6676006 Flux supply device in which liquid flux is supplied through liquid holding portion, and liquid flux supply method Jan. 13, 2004
6634544 Method and arrangement for improving quality in fusion welding operations Oct. 21, 2003
6607613 Solder ball with chemically and mechanically enhanced surface properties Aug. 19, 2003
6600137 Heating device and heating method Jul. 29, 2003
6576030 Filtering apparatus Jun. 10, 2003
6536649 Method of preventing residue contamination of semiconductor devices during furnace processing Mar. 25, 2003
6527164 Removing flux residue from reflow furnace using active gaseous solvent Mar. 4, 2003
6478215 Automatic wave soldering apparatus and method Nov. 12, 2002
6474530 Adaptor assembly for interchangeably mounting hot air solder reflow nozzles to soldering/desoldering apparatus Nov. 5, 2002
6464122 Soldering method and soldering apparatus Oct. 15, 2002
6446855 Compact reflow and cleaning apparatus Sep. 10, 2002
6427902 Machine for wave soldering of tinning Aug. 6, 2002
6395972 Method of solar cell external interconnection and solar cell panel made thereby May. 28, 2002
6382500 Solder reflow furnace with flux effluent collector and method of preventing flux contamination May. 7, 2002
6378753 Gas distribution system which can be connected to a gas supply Apr. 30, 2002
6352190 Soldering device Mar. 5, 2002
6347732 Circuit board component retention Feb. 19, 2002
6345757 Reflow soldering method Feb. 12, 2002
6332567 Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonators Dec. 25, 2001
6315189 Semiconductor package lead plating method and apparatus Nov. 13, 2001
6269998 Process for manufacturing electronic circuits Aug. 7, 2001
6250540 Fluxless joining process for enriched solders Jun. 26, 2001
6247630 Apparatus and method for uniformly melting the solder attaching a surface mount device to a printed circuit board Jun. 19, 2001
6234380 Apparatus and method for inerting a wave soldering installation May. 22, 2001
6223407 Apparatus for manufacturing an optical fiber cable May. 1, 2001
6223969 Method and machine for wave soldering or tinning May. 1, 2001
6206276 Direct-placement fluxless soldering using inert gas environment Mar. 27, 2001

1 2 3 4


 
 
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